5th IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS
Sponsored by the IEEE Computer Society - Test Technology Technical Council (TTTC)
May 13-16, 2001
Union Lido Park Hotel, Venice (Cavallino), Italy
During the last four years, the IEEE Workshop on Signal Propagation on Interconnects has been developed into a forum
of exchange on the latest research results in this area. The aim of this ensuing workshop is to report on the most recent
developments in the field of interconnect modeling, simulation and measurement on chips, boards, and packages. The event is
also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. In view
of the last years success the committee is looking forward to the 5th IEEE Workshop on Signal Propagation on Interconnects
where world class developers and researchers will share and discuss leading edge results in Venice, Italy. The workshop will
be held in English.

Notice: The Hotel only held special rooms to March 15 so make your arrangements as soon as possible since Venice is a very popular vacation place and the hotels are often sold out months ahead. See https://www.tet.uni-hannover.de/SPI

Main topics of the workshop will include, but are not limited to:

- delta I -Noise
- Broadband Measurement Techniques and Theory
- Coupling Effects on Interconnects
- Determination of Characteristic Parameters
- Field Theory
- Ground Bounce
- Guided Waves on Interconnects
- Measurement, Modeling, and Simulation of Package Interconnects
- Non-Linear Modeling and Analysis
- Propagation Characteristics on Signal and Ground Lines
- Radiation and Interference
- Simulation Techniques for 2- and 3-dimensional Interconnect Structures
- Substrate Influence on Signal Propagation
- Interconnects and Testing
- Mixed Signal Test
- Optical Interconnects: Design and Test

Submission of abstracts:
Those who wish to contribute to the workshop should send a two page extended summary of their paper (including figures)
to the Program Chair or the Co-Chair by January 31, 2001. The title of the paper as well as the names and affiliations of all
authors must appear on the first page of the summary. If the paper is accepted, the summary will be reproduced, as is, in the
workshop's digest. Notification about acceptance will be given by March 3, 2001.
Please consult our website https://www.tet.uni-hannover.de/SPI for more detailed information about the workshop and the location.
The committee is looking forward to your participation.

Workshop Standing Committee:
Joachim P. Mucha, President, Univ. Hannover, Institut f ¨ ur Theoret. Elektrotechnik, Hannover (D) mucha@tet.uni-hannover.de
Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Torino (I) canavero@polito.it
Hartmut Grabinski, Universit ¨ at Hannover, Institut f ¨ ur Theoretische Elektrotechnik, Hannover (D) grabinski@lfi.uni-hannover.de
Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa (CAN) msn@doe.carleton.ca
Petra Nordholz, Infineon Technologies AG, Munchen (D) petra.nordholz@infineon.com
Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for Comp. Elm., Urbana (USA) jose@decwa.ece.uiuc.edu
Program Chair: Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, Corso Duca Abruzzi 24, I-10129 Torino
(Italy) - Tel. +39-011-564-4060; Fax +39-011-564-4099; email canavero@polito.it
Program Co-Chair: Ivan A. Maio, Politecnico di Torino, Dipartimento di Elettronica, Corso Duca Abruzzi 24, I-10129 Torino
(Italy) - Tel. +39-011-564-4100; Fax +39-011-564-4099; email maio@polito.it

Technical Program Committee:
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
H. Dirks, Univ. Kiel (D)
E. Griese, Siemens C-LAB, Paderborn (D)
H.-J. John, Siemens AG, Paderborn (D)
W. John, SNI, Paderborn (D)
E. Kuh, Univ. of Calif., Berkeley (USA)
N. van der Meijs, Univ. Delft (NL)
O.A. Palusinski, Univ. Arizona, Tucson (USA)
H.J. Pfleiderer, Univ. Ulm (D)
L.T. Pileggi, Carnegie Mellon, Pittsb. (USA)
J.L. Prince, Univ. of Arizona, Tucson (USA)
K. Reiß, Univ. Karlsruhe (D)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
M. Swaminathan, Georgia I. Tech (USA)
R. Velazco, TIMA, Grenoble (F)
D. Williams, NIST, Boulder (USA)
T.W. Williams, Synopsys, Mount. View (USA)
Y. Zorian, Logic Vision Inc., San Jose (USA)