Announcement and Call for Papers
The Fifth International IEEE Symposium on High Density Packaging
and Component Failure Analysis in Electronics Manufacturing
(HDP´02)
June 24 - 27, 2002
Co-sponsored and jointly organized by
DaimlerChrysler SIM Technology Co., Ltd, Shanghai, China.
&
Chalmers University of Technology, Division of Electronics Production, Department of Production Engineering, Göteborg, Sweden
Technical co-sponsorship with IEEE CPMT Society
Electronics manufacturing and assembly technology are playing a key technology for the progress of Chinese electronics industry. Today many multi-national companies are establishing new facilities in China for expanding their global business and interest. However, many domestic Chinese electronics companies are still using old-fashioned electronics assembly technologies. The recently established joint-venture companies use more advanced electronics assembly technologies such as surface mount, chip-on-board etc. There is a great gap in technology level between these two types of companies. Therefore, there is a need to find a forum for the domestic Chinese Electronics industry to find out the latest technologies in the developed world. The foreign advanced countries also need to have a forum to establish contacts with the Chinese scientists, engineers and decision makers.
The purpose of this Symposium is to satisfy such a need and to establish a regular forum for information exchange between Chinese industrial community and foreign specialists.
Scope for the Symposium: The Symposium will cover the following areas and subjects:
· High density packaging including electronics and opto-electronics
packaging, CSP, BGA, Flip-chip, Chip on Board, Surface Mount Technology
and other novel emerging technology
· High density substrate including integrated passives
and active devices
· MEMS design, packaging and assembly
· Electronics manufacturing issues including cleaning issues,
quality control, logistics, repair, process optimization, statistic
process controls, ISO compliance, tooling or equipment, early
manufacturing involvement initiatives and yield and test innovations
used to enhance manufacturing processes or products related to
high density substrates, single chip and multichip packaging,
chip bumping and integrated component technologies
· Component failure analysis techniques including non-destructive
X-ray, ultrasonic microscopy, IR-microscopy etc
· Simulation and modelling for packaging and electronics
manufacturing processes
· Thermal management
· Environmental design and materials development including
life cycle analysis and end of life strategy etc
· Cost reengineering, improvements and analysis for electronics
packaging processes and products
Documentation: The documentation from the Symposium will be published in a proceedings with CD ROM with a full length papers (max 12 A4 pages) in English.
Journal publication: In addition, high quality papers will be selection for consideration to be published as special editions of the IEEE CPMT Transactions, "Soldering and Surface Mount Technology" or Journal of Electronics Manufacturing
Location: 865 Changning Road, DaimlerChrysler SIM Technology Co., Ltd. Shanghai, China
Languages: English will be used. Simultaneous translation into Chinese is made to suit the Chinese delegates.
Symposium Chair: Le Luo, DaimlerChrysler SIM Technology Co., Ltd.
Symposium Co-chair: Johan Liu, Chalmers University of Technology, Sweden.
International Advisory Committee
C P Wong, Georgia Institute of Technology, USA, Co-Chair
Wilhelm Senske, DaimlerChrysler, Germany, Co-Chair
Rolf Aschenbrenner, IZM, Germany
Heiner Bayer, Siemens, Germany
Arun Chaudhuri, Delco Delphi Electronics Systems, USA
Jannick Guinet, Schneider Electric, France
Joakim Anjeby, Saab Ericsson Space, Sweden
Jannes Jagt, Philips, The Netherlands
Jorma Kivilahti, Helsinki University of Technology, Finland
Kåre Gustavsson, Ericsson Microelectronics, Sweden
Pontus Lundström, Ericsson Microelectronics, Sweden
Wei Koh, Kingston, USA
John Lau, Agilent Technologies, USA
Y C Lee, University of Colorado, USA
Jianhua Wu, Gintic, Singapore
Sheng Liu, Wayne State University, USA
Wei Lu, Shanghai Institute of Technical Physics, China
Jusheng Ma, TsingHua University, Beijing, China
Erdogan Madenci, University of Arizona, USA
Bernd Michel, IZM, Germany
James Morris, State University of New York, Binghamton, USA
Koji Nihei, Waseda University, Japan
K W Paik, Korean Advance Institute of Science and Technology,
Korea
Yi-Hsin Pao, Ford, USA
Robert Pfall, Motorola, USA
W J Plumbrige, Open University, UK
Patrice Rollet, Promosol, France
Petri Savolainen, Nokia, Japan
Frank Stubhan, DaimlerChrysler SIM Technology, China
Ganesh Subarayan, University of Colorado, USA
K. Suganuma, Osaka University, Japan
Ephraim Suhir, Lucent Technologies, USA
Kenichi Suzuki, Japan
Osamu Takeda, T & T Ltd, Japan
Andrew Tay, National University of Singapore, Singapore
Rao Tummala, Georgia Institute of Technology, USA
Itsuo Watanabe, Hitachi Chemicals, Japan
David Whalley, Loughborough University, UK
Kin Wong, Semiconductor Equipment and Materials International,
USA
Jianming Qu, Georgia Institute of Technology, USA
Anders Thölén, Chalmers University of Technology,
Sweden
Liqiang Xu, , DaimlerChrysler SIM Technology, China
Shouwen Yu, Tsing Hua University, Beijing, China
Magnus Willander, Chalmers University of Technology, Sweden
Xiangfu Zong, Fudan University, China
Program committee
Xiaoming Xie, Chair, DaimlerChrysler SIM Technology Co., Ltd.
Margareta Pontén, Co-Chair, Chalmers University of Technology,
Sweden
Tiebing Wang, Program secretary, Chalmers University of Technology, Sweden
Guo Liang Chen, University of Science & Technology, Beijing,
China
Liu Chen, Chalmers University of Technology
Yi Lan Kang, Tianjing University, Tianjing, China
Charles Lee, Infineon, Singapore
Jon Nysether, SINTEF, Norway
Xitao Wang, Chalmers University of Technology, Sweden
Piotr Starski, Chalmers University of Technology, Sweden
Arne Tolvgård, Ericsson Radio Systems, Sweden
Yan Li Wang, University of Science & Technology, Beijing,
China
You are welcome to submit an abstract with max 300 words that cover the topic, experimental approach, results and conclusions for the paper by Feb 28, 2002 to Chalmers University of Technology, Division of Electronics Production, Department of Production Engineering, Attn. Dr Tiebing Wang, Se- 431 53 Mölndal, Sweden or you can email at tiebing@pe.chalmers.se. Notification of abstracts will be made by November 7, 2000. Final Acceptance of the abstract will be made by November 15, 2000. Final paper is due November 30, 2000. Please send the final paper to Chalmers University of Technology for countries outside of China.
We are also interested to have exhibitors from materials, equipment suppliers to exhibit their products. If you are interested in exhibition, please contact Dr Tiebing Wang, Chalmers University of Technology, Sweden.
Please send abstracts to (for countries outside of China)
Chalmers University of Technology
Division of Electronics Production
Department of Production Engineering
Mrs Carina Schmidt
Se-431 53 Mölndal
Sweden
Telephone: +46-31-706 6287
Fax: +46-31-706 6289
e-mail: carina.schmidt@ivf.se
Contact Information Form
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Please fax this sheet together with the abstract of the paper to +46-31-706 6289 or email to carina.schmidt@ivf.se