TC-16: RF and Wireless

Here is a description of TC-16. This activities is in its second year and would benefit from more active volunteers. It is a good chance to mingle with the elite that worry about RF components, packaging and microsystems. Call Craig Gaw to join the team.

Technical Scope:

The design, development, & technology of RF & wireless components, devices, circuitry & systems.

Topics of interest include:
o Technology of packaging active/passive hybrid and integrated RF & wireless components
o Electrical and physical design; reliability, performance and characterization
o Reliability, reliability physics, failure analysis, degradation models, thermal analysis, simulation, modeling, characterization & prediction, assembly techniques, low noise issues
o Materials (reliability without hermeticity, adhesives, ceramics, plastics, glasses, metals, solders, films, encapsulants, sealants, molding compounds, etc.)
o Processing (bonding, brazing, welding, soldering, sealing, molding, flip-chip, chip-on-board, etc.)
o Devices and Components ( RF & wireless modules, amplifiers, transmitters, receivers, MMICs, FETs, HEMTs, HBTs, MEMs, connectors, passive components, etc.
o Systems and Manufacturing (components, design, assembly, reliability, automation)

Chair:
Craig Gaw Motorola Inc., 2100 East Elliot Road, MS EL707, Tempe, AZ 85284
p: 480-413-5920, f: 480-413-3481, email: c.a.gaw@ieee.org

Vice-Chair:
Manos Tentzeris Georgia Institute of Technology, ECE Dept, Atlanta, GA 30332-0250
p: 404-385-0378, f: 404-894-4641, email: etentze@ece.gatech.edu

Members:
Alexander Dabek (Co-chair, Europe) - Tyco Electronics, Munich, Germany,
email: Alexander.Dabek@ieee.org
David W. Palmer (TC-16 Web master) - Sandia National Laboratories, Albuquerque, NM
email: d.palmer@ieee.org
Frank Bachner - Micro Interconnect Inc., Del Mar, CA,
email: fbachner@msn.com
Rao Bonda, Motorola Inc., Tempe, AZ
email: r.bonda@ieee.org
Sridhar Canumalla, Nokia, Dallas, TX,
email: Sridhar.Canumalla@nokia.com
Patric Heide - Siemens AG - Corporate Technology, Munich, Germany ,
email: patric.heide@mchp.siemens.de
Shih Hsu, Raytheon RF Components, Andover, MA,
email: Shih_C_Hsu@rrfc.raytheon.com
Shankar N. Ekkanath Madathil - De Montfort University, Leicester, UK,
email: snem1@dmu.ac.uk
Joseph Mantz - AT&T Wireless Services, Redmond, WA,
email: joe.mantz@attws.com
Andrea Paganini - IBM, Vermont,
email: paganini@us.ibm.com
Koneru "Rama" Ramakrishna - Motorola Inc., Austin, TX,
email: rama@ieee.org
Dietrich Riemer, The Boeing Company, Seattle, WA,
email: dietrich.e.riemer@boeing.com
Matt Schwiebert - Agilent Technologies, Santa Rosa, CA,
email: matt_schwiebert@agilent.com

Key Conferences:
Planning initiated by Prof. Manos Tentzeris of Georgia Tech for TC-16 sponsored workshop in the "RF & Wireless" technical area.
TC-16 supports ECTC's Components Group

Key Conferences Sponsored by Other Societies:
International Microwave Symposium sponsored by MTTS
GaAs IC Symposium sponsored by EDS, MTTS & SSCS
GaAs Reliability Workshop sponsored by JEDEC, IEEE & EDS

Suggestions for "RF & Wireless" Technical Committee Conference/Workshop Participation:
Planning initiated for TC-16 sponsored workshop. (Manos Tentzeris is key organizer)
In conjunction with ECTC's Components Committee, TC-16 plans to organize a special session/symposia each year for ECTC. (Matt Schwiebert was key organizer for ECTC 2001)

Journals / Publications in "RF & Wireless":
IEEE Transactions on Microwave Theory & Techniques
IEEE Transactions on Electron Devices
Microwave Applications
Microwaves & RF
RF Design

Short courses:
"RF/Wireless Packaging: Status & Challenges", ECTC 2000 & 2001
Manos Tentzeris & Joy Laskar, Georgia Institute of Technology

Activities for past year:
Assisted ECTC Components Committee with review of RF papers submitted to ECTC 2001.
Obtained 2 papers on RF MEMS for Components Committee session at ECTC 2001.
Manos Tentzeris (TC-16 vice-chair) & Joy Laskar presented course on "RF/Wireless Packaging: Status & Challenges" at ECTC 2000 & will present course again at ECTC 2001.
Manos Tentzeris organized & chaired "Cellular & Wireless" session for TC-14's "System Packaging Workshop" (May 8-10, 2001 in Scottsdale, AZ). He also investigated what is required to organize a workshop.
Recruited additional technical committee members
David Palmer set up the TC-16 web page & keeps it updated.

Goals for upcoming year:
Organize & hold workshop.
In conjunction with ECTC Components committee, TC-16 will organize a special symposia for ECTC 2002.
Broaden representation on technical committee by recruiting new members from key organizations doing R&D within technical scope of "RF & Wireless" technical committee.
Maintain & update web page.