First Announcement and Call for Papers https://ds&t.fudan.edu.cn/icept2003
ICEPT 2003'
April 21-23, 2003 Shanghai, China
Sofitel Jin Jiang Oriental

Sponsored by: Chinese Institute of Electronics (CIE-CEPS)
Technical co-sponsorship with:
Fudan University(China)
IEEE-CPMT (USA)
IMAPS-China
JIEP (Japan)
Institute of Microelectronics (Singapore)
Tsinghua University (China)
Hebei Semiconductor Institute (China)
Wuxi Microelectronics Research Center (China)
Shanghai IC Industry Association (China)
Organized by: Fudan University (China)

General Chair
Keyun Bi
(CAEIT, China)
Co-Chairmen
Charles E. Bauer
(IMAPS, USA)
Rao R. Tummala
(IEEE-CPMT, USA)
Yuliang Yang
(Fudan Univ., China)
Org. Co-Chairmen
Richard Breck
(IMAPS, USA)
Xiaoman Chen
(Fudan Univ., China)
Shenli Fu
(I-SHOU Univ., Taiwan)
Youbin Li
(CETC, China)
Prog. Co-Chairmen
James E. Morris
(Portland S.U.,USA)
Shangtong Gao
(HBSI,China)
Jiaji Wang
(Fudan Univ., China)
Feijian Wu
(Chipbond, Taiwan)

The Fifth International Conference on Electronic Packaging Technology (ICEPT 2003'), sponsored by Chinese Institute of Electronics (CIE-CEPS), is organized with the intention of providing a forum for the presenting and discussion of the latest development in electronic packaging technology and related fields.
Call for Papers
Papers that deal with all aspects of electronic packaging are solicited. The following is a partial list of topics to be addressed:
Overview on advanced electronic packaging technologies;
Packaging design, modeling and simulation;
Manufacturing technologies;
Packaging materials and components;
Packaging processes: wiring, attaching, bonding, soldering, sealing and encapsulation;
Material characterization: electrical, chemical, mechanical and thermal management;
Reliability and testing;
Interconnecting technologies;
MEMS;
The industry and marketing.
In order to provide opportunities for synergistic interactions among those working in packaging R&D, production and equipment, an exhibition and seminars on special topics are planned. All companies interested in these events are solicited.
Paper Submission
Prospective authors are requested to submit a 500 to 1000 words summary in English with no more than 4 figures for review by Email. The title page should include an abstract and the authors' full addresses (Email address, Telephone and Fax numbers). The summary should be sent to:
Mr. Guowei He icept2003@vip.163.com or Fax: 86-21-65103056 by Jan. 21st , 2003 .

Conference Registration
The conference registration form can be downloaded from our homepage. Please fill & send it to:
Mr. Linggen Song lgsong@fudan.ac.cn or Fax: 86-21-65103056 by Mar. 5th, 2003.

Exhibition Registration
Besides the general programs, there will be table-top exhibitions and technical seminars for advertising. For the details on these events you can visit our homepage. For the exhibition registrations, please download the registration form , full fill and send it back to:
Mr. Ding Li asianinfo@online.sh.cn or Fax 86-21-64697155 by Mar. 5th, 2003.

If you have more questions, please contact:
Mr. Jiaji Wang jjwang@srcap.stc.sh.cn or Fax: 86-21-65643529

For further information please visit our homepage:
https://ds&t.fudan.edu.cn/icept2003
It will be upgraded as necessary .

Important dates:
Nov. 1st , 2002 Second Announcement will be sent
Jan. 21st , 2003 Deadline for receipt of summaries
Feb. 21st , 2003 Notification of acceptance will be sent
Mar. 21st , 2003 A camera-ready version of the paper must be received
Mar. 5th , 2003 Deadlines for registrations for conference, exhibition, and technical seminars