Dr. Johnson is a Ginn Professor of Electrical Engineering at Auburn University and Director of the Laboratory for Electronics Assembly and Packaging (LEAP). At Auburn, he has established teaching and research laboratories for advanced packaging and electronics assembly. Research efforts are focused on materials, processing, and reliability for electronics assembly and for high temperature electronics. He has published and presented numerous papers at workshops and conferences and in technical journals. He has also co-edited one IEEE book on MCM technology and written two book chapters in the areas of silicon MCM technology and MCM assembly and one book chapter on high temperature packaging. He is an Associate Editor of the IEEE Transactions on Electronics Packaging Manufacturing. He received the 1997 Auburn Alumni Engineering Council Senior Faculty Research Award for his work in electronics packaging and assembly.
Dr. Johnson was the 1991 President of the International Society for Hybrid Microelectronics (ISHM). He received the 1993 John A. Wagnon, Jr. Technical Achievement Award from ISHM, was named a Fellow of the Society in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is a Fellow of IEEE, and a member SMTA, and IPC.
Dr. Johnson received the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt University, Nashville, TN, and the Ph.D. degree in 1987 from Auburn University, Auburn, AL, all in electrical engineering. He has worked in the microelectronics industry for DuPont, Eaton, and Amperex.