IEEE Phoenix Section Components, Packaging, and Manufacturing Technology Society Chapter, & Waves and Devices Chapter jointly held An All Day Workshop on Thursday, November 20th, 2003, at the Memorial Building located on the campus of Arizona State University, Tempe, Arizona. The workshop was very well attended with 227 registrants. The breakdown of registrants included 22 organizing committee members, 13 speakers, 32 vendor representatives, 67 IEEE members (included 3 student members), and 93 non-members (included 12 student non-members). The workshop agenda included:

7:00 AM - 8:00 AM: Registration
8:00 AM - 10:10 AM: Morning Section I: Technology Roadmap and Devices Focus
Chair: Dr. Stephen Goodnick, Arizona State University, Tempe, Arizona.
Topic 1: "Keynote Presentation: CMOS Logic Transistor Roadmap - Drivers, Challenges, and Potential Solutions", Presented by Dr. Peter Zeitzoff, International SEMATECH, Austin, Texas.
Topic 2: "Silicon Nano-Transistors and Nanotechnology for High-Performance Logic Applications", Presented by Dr. Robert S. Chau and Dr. Suman Datta, Intel Corporation, Hillsboro, Oregon.
Topic 3: "Trends in Magnetic Information Data Storage and Magnetic Random Access Memory", Presented by Dr. Yang-Ki Hong, University of Idaho, Moscow, Idaho.
10:10 AM - 10:30 AM: Refreshment Break
10:30 AM - 11:50 AM: Morning Session II: Devices and Interconnects Focus
Chair: Dr. Chuck Weitzel, Motorola, Inc., Tempe, Arizona.
Topic 4: "RF and Mixed Signal Technologies", Presented by Mr. Jim Teplik, Motorola, Inc., Tempe, Arizona.
Topic 5: "Optimal Global Interconnects for Gigascale Integration", Presented by Dr. Azad Naeemi, Georgia Institute of Technology, Atlanta, Georgia.
11:50 AM - 12:50 PM: Buffet Lunch / Vendor Displays
12:50 PM - 3:10 PM: Afternoon Session I: Packaging and Characterization Focus
Chair: Dr. Rao Bonda, Motorola, Inc., Tempe, Arizona.
Topic 6A: "High Speed Package Design - Package Characterization and Performance", Presented by Mr. Nozad Karim, Amkor Technology Inc., Chandler, Arizona.
Topic 6B: "Embedded Passives, RF Functional Blocks, and Shields", Presented by Mr. Michael P. Gaynor, Amkor Technology Inc., Atlanta, Georgia.
Topic 7: "Broadband Mixed Signal System Level Packaging", by Mr. Hassan Hashemi, Mindspeed Technologies Inc., Arizona.
Topic 8: "Characterization and Failure Analysis of Silicon Devices: Current and Future", Presented by Dr. Dieter Schroder, Arizona State University, Tempe, Arizona.
Topic 9: "Failure Analysis of Microelectronic Packages: Current and Future", Presented by Dr. Deepak Goyal, Intel Corporation, Chandler, Arizona.
3:10 PM - 3:30 PM: Refreshment Break
3:30 PM - 4:30 PM: Afternoon Session II: Technology Trends
Chair: Dr. Mali Mahalingam, Motorola, Inc., Tempe, Arizona.
Topic 10: "The Road to Ubiquitous Computing, Entertainment, & Communications - Portable Wireless and Broadband Applications and Markets", Presented by Mr. Christopher Taylor, Strategy Analytics, Boston, Massachusetts.
Topic 11: "Vision for Convergence: Next Generation Computing and Communications Solutions", Presented by Mr. Ronald Curry, Intel Corporation, Santa Clara, California.
4:30 PM - 5:00 PM: Reception / Vendor Displays
5:00 PM - 6:00 PM: Panel Discussion Titled "Future of Computing and Communication Technologies and Applications", Moderated by Dr. Stephen Goodnick, Arizona State University, Tempe, Arizona.

The morning session with a focus on technology roadmap, devices, and interconnects was very well received by the workshop audience. Dr. Peter M. Zeitzoff gave an insight into to be recently released version of the International Technology Roadmap for Semiconductors (ITRS) which maps the scaling of the IC technology generations over the next fifteen years. His presentation focused on model-based approach to transistor scaling which is rapidly scaling into the deep submicron regime, with current gate lengths approaching 45 nm (0.045 mm). Dr. Suman Datta talked about silicon-based nano-transistors and nanotechnology enabling of Moore's Law continuation up to 2015 and the approaches that need to be adopted for continuing the law beyond 2015. He emphasized that the future approaches must utilize the modern-day silicon technology's strong foundation and that successful technology options will only emerge from a strong collaboration between the semiconductor industry, the academia and the government agencies. Dr. Yang-Ki Hong gave a brief description of the principles of magnetic recording and MRAM; and the fabrication of media and MRAM. Later part of his talk focused on the history of recording technology, future magnetic recording, characteristics and development trends of the most important magnetic nanoparticles and nanofilms, and also magnetic element shapes for magnetic tunneling junction (MTJ) of MRAM device. Mr. Jim Teplik described the key features required in an RF/mixed-signal technology for wireless applications by examining both the active and passive components as well as reviewing the state of the art, key performance metrics, trends, challenges, and opportunities. The presentation also addressed the importance of effective signal isolation and gave a brief review of opportunities beyond 2GHz. Dr. Azad Naeemi emphasized that the design of GSI chips should shift from transistor-centric to interconnect-centric to facilitate efficient use of valuable on-chip metal levels based the fact that the transistor performance improves with scaling down of physical dimensions whereas interconnect performance degrades with scaling down of cross-sectional dimensions. In his talk, Dr. Azad Naeemi proposed a new interconnect-centric methodology to optimize the design of global interconnects by simultaneously maximizing data flux density and minimizing latency that also offers the best trade-off between energy dissipation and data flux density, and reduces interconnect crosstalk and silicon area used for repeaters substantially.

The afternoon session focused on packaging, characterization, and technology trends. Mr. Nozad Karim mentioned that to address today's complex electronic system designs, a "design chain management" approach should be implemented where silicon layout, IC packaging, and the final system are considered from the start of any project. He emphasized that the need is especially crucial for applications that include advanced packaging solutions, such as RF, high speed digital Gbit+, stacked packaging and system in a package (SiP). In his presentation, Mr. Michael P. Gaynor covered embedded passives, shields, and RF functional blocks within the module package by utilizing various filters and BALUNs for WLAN and Bluetooth applications. He also briefly reviewed other passive component embedding technologies. The justification for embedding in general as well as for each technology was discussed. He highly emphasized that the embedded technologies provide opportunities for a low cost, size and performance solution to RF module packaging requirements. Mr. Hassan Hashemi discussed an overview of challenges faced with power distribution in a mixed signal system-on-chip (SOC) device by using common practices and methodologies adopted for digital systems as an example. He also discussed the electrical and physical attributes of a state of the art mixed signal SOC. Trade-offs between common versus separate supply or return path in flipchip and wire bond package implementation of this device is reviewed. Dr. Dieter Schroder suggested that failure site location identification is becoming progressively more difficult due to the small feature size of today's devices, the complex device structure, consisting of many metal layers, flip-chip bonding, etc., pushing many existing characterization tools to the limits. The techniques that were discussed by him included IDDQ testing, liquid crystal, emission microscopy, microprobing, voltage contrast, optical beam induced resistance change, and picosecond imaging circuit analysis. He also suggested that scanning probes with submicron mechanical resolution and transmission electron microscopy with sub-Angstrom resolution allowing imaging of individual impurities, are improving. Dr. Deepak Goyal provided an overview of the typical failure modes and mechanisms observed in the advanced microelectronic packages. A brief introduction to the methodology of failure analysis of packages as well as failure analysis challenges for the next generation packages were presented. In addition, Dr. Deepak Goyal also discussed the current and next generation analytical capabilities for package level fault isolation and failure analysis. Mr. Christopher Taylor suggested that driven by consumer demand and the development of lower cost components, the portable wireless evolution promises lead to ubiquitous access to entertainment, communications and computer power. In his talk, Mr. Christopher Taylor reviewed broadband access and wireless portable markets, and provided an overview of the market trends and component requirements driving the increasingly important wireless segment of the semiconductor industry. In the last talk of the day, Mr. Ronald E. Curry mentioned that the vision for future convergence can be simply stated as "any device, anywhere, anytime" which requires melding of the communication and computing worlds leading to micro and macro level convergence. In his talk, Mr. Ronald E. Curry discussed the concepts of Micro and Macro convergence, and their impact on the society in the future. He also discussed technologies, platforms and initiatives that are accelerating the convergence of communications and computing.

The day ended with an hour long panel discussion consisting of eight speakers and moderated by Dr. Stephen Goodnick. The topic was "Future of Computing and Communication Technologies and Applications". Following a brief statement by each of the panelists on their vision for the future of computing and communications technology, the panel session solicited general questions from the audience. The discussions among panelists and between panelists and audience were lively and interesting.

The production of handouts and compact discs as well as breakfast, refreshment breaks, lunch, and reception were subsidized in part by the financial support obtained from the Premier Sponsors who contributed $1000 and Standard Sponsors who contributed up to $500. The Premier Sponsors included Intel Corporation, Hillsboro, Oregon, and IEEE Phoenix Section. The Standard Sponsors included Department of Electrical Engineering, Arizona State University, Tempe, Arizona; IEEE Components, Packaging, and Manufacturing Technology Society; IEEE Microwave Theory and Techniques Society; Microchip Corporation, Chandler, Arizona; Motorola, Inc., Tempe, Arizona; and Primarion, Inc., Tempe, Arizona.

The vendor displays by American Express Financial Advisors, Amkor Technology, Ansoft Corporation, ASE (US), Inc., ChipPac Inc., Dow Corning Corporation, Kyocera America, Inc., Odyssey1/TDA Systems/Tektronix, Rogers Corporation, TDK R+D Corporation, Vacuum Barrier Corporation, and Zeus Electronics, Inc. were very valuable for overall success of the workshop. The displays were very professional and technically oriented.

An IEEE Phoenix Section display was very professionally put together for the first time in the history of IEEE Phoenix Section with lot if information about IEEE in general; and IEEE / CPMT Society and IEEE / WAD Phoenix Chapter in general. Many of workshop attendees, including both IEEE and non-IEEE members, stopped by the display and were impressed by the information. The display in general sparked quite a bit interest among IEEE non-members to join IEEE.

The workshop was made possible by the hard work of the organizing committee consisting of members from both IEEE Phoenix Section CPMT Chapter as well as WAD Chapter. The overall success of the workshop was due to the long hours of dedicated work over a period of six months by all members of the workshop organizing committee. The workshop organizing committee consisted of the following members:
General Chair: Vasudeva P. Atluri, Ph.D.
Co-Chair: Bruce Kim, Ph.D.
Technical Program: Rao Bonda, Ph.D.
Mali Mahalingam, Ph.D.
Stephen Goodnick, Ph.D.
Chuck Weitzel, Ph.D.
Vendor Registration: Dongming He, Ph.D.
Rashaunda Henderson, Ph.D.
Sam Karikalan
Steve Rockwell
Electronic Media: James E. Drye
David Penunuri, Ph.D.
Daoqiang Lu, Ph.D.
Registration: Ellen Lam, Ph.D.
Sandeep B. Sane, Ph.D.
Eric C. Palmer, Ph.D.
Arrangements: Nitin A. Deshpande
Ravi Sharma, Ph.D.
Shane Johnson, Ph.D.
Prashant Raghu, Ph.D.
Publicity: Steve Post
Bruce Bosco

In conclusion, the workshop was very well attended and appreciated by the attendees. The net profits from the workshop are approximately $11843.20. Continuing with the tradition from last year, 50% of the profits, approximately $5921.60, will be donated to the IEEE Phoenix Section Student Scholarship Endowment at the Arizona State University Foundation. In addition to raising funds for local chapters, one of the goals of the workshop is to help increase the scholarship endowment. Over last two years, the workshop organizing committee was able to contribute approximately about $10,000.00 to the scholarship endowment bring the total endowment fund to greater than $35,000.00. This endowment is helping IEEE Phoenix Section give four awards to undergraduate students totaling to $4000.00 every year within IEEE Phoenix Section region. The students from Arizona State University, Devry Institute, Embry-Riddle Aeronautical University, and Northern Arizona State University are eligible to apply for these scholarships. The scholarship fund was initiated about five years ago jointly by IEEE Phoenix Section, IEEE / CPMT Phoenix Chapter, and IEEE / WAD Phoenix Chapter.

Picture of IEEE Phoenix Section Workshop 2003 Organizing Committee members in front IEEE Phoenix Section Display
Kneeling Down (Left to Right): Dr. Rao Bonda, Mr. Jim Drye, Mr. Steve Post, Dr. Chuck Weitzel, Dr. Bruce Kim, and Dr. Prashant Raghu
Standing (Left to Right): Dr. Ellen Lan, Mr. Sam Karikalan, Mr. Eric C. Palmer, Dr. Daoqiang Lu, Dr. Rashaunda Henderson, Dr. Shane Johnson, Dr. Ravi Sharma, Dr. Vasu Atluri, Mr. Steve Rockwell, Dr. Mali Mahalingam, Mr. Bruce Bosco, Dr. Dongming He, and Dr. Dave Penunuri
Not in the Picture: Dr. Steve Goodnick, Dr. Sandeep Sane, and Mr. Nitin Deshpande