From: Margie Ballinger/MKT/HQ/KEMET/US [margieballinger@kemet.com]
Sent: Tuesday, August 17, 2004 9:33 AM
To: Margie Ballinger/MKT/HQ/KEMET/US
Subject: 55th Electronic Components & Technology Conference

FOR IMMEDIATE RELEASE                                                Contact: Jim Bruorton
(864) 963-6621


55th Electronic Components & Technology Conference
Call for Papers


        Orlando, Florida  USA- August 10, 2004)--The 55th Electronic Components & Technology Conference will be held at Wyndham Palace Resort & Spa in Orlando, Florida USA on May 31 – June 3, 2005.
        This conference comprises papers covering a wide spectrum of topics, including not only electronic components, but also exciting new developments in all areas of electronics technology (for example, electronics assembly, packaging, systems packaging, optoelectronics, reliability and materials). In 2004, over 300 papers and posters, and 16 Professional Development Courses were presented by companies, universities and research institutions from around the world. The audience included representatives from leading universities and companies eager to stay abreast of the rapidly changing and emerging technologies in the electronics field.
        The primary goal of the conference is to offer quality coverage of technological innovations in the areas of packaging design, materials, processes, quality and manufacturing of devices, components and systems. The Program Committee represents a wide variety of disciplines and expertise from the electronics industry. We are committed to assembling the highest quality program for the 55th ECTC, and we need many excellent papers to meet this commitment.
       

Major Topics for ECTC

Advanced Packaging:
New packaging technologies, systems packaging, designs, materials and configurations addressing performance density and cooling for single chip, multi-chip, wafer-level, MEMS and power packages. Special emphasis on flip-chip, fine pitch and high lead count packaging in CSP, BGA , CGA, LGA, SMT packages for both Pb-bumps and package assembly.
Components & RF:
New passive or active component technologies, integrated-embedded components, RF & wireless component applications, component performance, systems and reliability.
Education:
Education for engineering curricula in the 21st century and collaborative research and engineering programs between universities, government, or industry; development and the use of multi-media for packaging education.
Emerging Technologies: Biomedical Packaging:
Packaging of biomedical devices. Microfludic devices. Biocompatible materials. Miniaturized diagnostic, drug delivery, prevision surgery, prosthesis, bio-sensing devices. Integrated biotech devices using sample preparation, processing and data communication, test procedures and results.
Emerging Technologies: Nano-Scale Packaging:
Micro-to-nano transition and interfaces. Packaging of nano-scale electronic and sensing devices and its design. Nano-materials, nano-pattering, nano-interconnections, and characterization. Nano-fluidics, optics and mechanics. Nano-electro-mechanical systems (NEMS).
Interconnections:
First level electronic interconnection technologies including, flip-chip, 3D interconnect, lead-free interconnects, wirebonding, TAB, and conductive polymers; under-bump metallurgy, substrate metallurgy and interconnect, wafer and device level interconnections, electrical issues of advanced interconnect structures, novel interconnects, and electromigration of bumped interconnects.
Manufacturing Technology:
Advanced process development and equipment improvement for wafer thinning, bumping, stacking, and low-k chip packaging, high-density interconnect and embedded component substrates, testing and burn-in. Emphasis on product level integration and optimization for different product applications, cost, yield, performance and environmental improvements, process characterization, new product introduction and ramp, design for flexible manufacturing and testing.
Materials & Processing:
Processes for IC packaging that enhance performance (mechanical and electrical) and cost effectiveness. Technology, development and application of adhesives, encapsulants, chip underfills, solders and alloys, magnetic and optical materials, ceramics, composites, dielectrics, thin films, nanomaterials, thermal materiarls, bonding and plating processes.

Modeling & Simulation:
Electrical, thermal, optical, mechanical modeling, simulation, characterization and packaging solutions including system-level applications.
OptoElectronics:
Packaging for fiber-optic modules, infra-red wireless, consumer opto-electronics, flat-panel, projection and micro-displays, solid state lighting, optical amplifiers, lasers, detectors, OEICs, optical data interconnect, optical backplanes, passive components, and WDMs.
Posters:
Papers may be submitted on any of the listed major topics; presentation of papers in a poster format is highly encouraged at ECTC.
Quality & Reliability:
Assessment, failure analysis, reliability testing and data analysis, failure and accelerated models, qualification of components and systems, KGD, incremental quality improvement, and TQM.
Professional Development Courses:
Proposals are also solicited from individuals interested in teaching educational short courses (~4 hours) on topics described in the Call for Papers. Proposals including course descriptions must be submitted to Rao Bonda, at rao.bonda@freescale.com no later than October 15th, 2004.

Paper Submission

       
        You are invited to submit a 750-word abstract that describes the scope, contact, and key points of your proposed paper via the website at www.ectc.net. Please check the website for details on how to submit abstracts electronically. For additional information regarding abstract and paper submissions, authors may contact perfecto@us.ibm.com.
        The abstracts must be received by October 15, 2004.  Your submission must include the mailing address, business telephone number, facsimile number and email address of the presenting author and the names and affiliations of all authors.  Please indicate no more than two Program subcommittees that should evaluate you paper for acceptance.  Authors will be notified of paper acceptance with instructions for publication by December 15, 2004.  At the discretion of the program committee, abstracts may be considered for poster sessions.  Manuscripts are due in final form for publication in the Conference Proceedings by February 7, 2005. The work submitted should be original and no previously published, and avoid inclusion of commercial content. In addition to a printed copy conforming to the ECTC format, a computer file for CD-ROM is needed in the preferred MS Word format.


The 55th ECTC conference is sponsored jointly by the Electronic Components, Assemblies, and Materials Association (the electronic components sector of the Electronic Industries Alliance) and the IEEE Components, Packaging and Manufacturing Technology Society.


Regards,
Marjorie Ballinger
ECTC Assistant Publicity Chairman