CPMT OFFICERS

President -- Phil Garrou, +1 919 248 9261
Technical VP -- Rolf Aschenbrenner, +4930-46403164
Administration VP -- H. Anthongy Chan,
Treasurer -- John Segelken, +1 732 920 3023
VP Publications -- Paul B. Wesling, +1 408 331 0114
VP Conferences -- S. W. Ricky Lee, +852 2358 7203, rickylee@ust.hk
VP Education -- Albert Puttlitz, FAX +1 802 879 0466
Senior Past President -- John Stafford, +1 602 413 5509
Junior Past President -- Rao Tummala, +1 404 894 9097
Secretary -- Ron Gedney, +1 703 834 2084
Executive Director -- Marsha Tickman, +1 732 562 5529
IEEE VP TAB -- Ralph Wyndrum, +1 732 219 0005

Board of Governors, Elected Members at Large

2006
William D. Brown
Philip C. H. Chan
Charles Lee
Johan Liu
Thomas G. Reynolds, III
Ephraim Suhir

 

2004

Rolf Aschenbrenner

N. Rao Bonda

Rajen Chanchani

Ricky Lee

Connie Swager

Naoaki Yamanaka

2005
William T. Chen

Li Li
L. Merrill Palmer

Walter J. Trybula
E. Jan Vardaman

David C. Whalley

Standing Committee Chairpeople
Student Chapter Development -- William D. Brown, wdb@engr.uark.edu
Distinguished Speakers -- A. F. Puttlitz, FAX +1 802 879 0466
Fellows Search -- Rao Tummala, rao.tummala@ee.gatech.edu, & David Palmer, d.palmer@ieee.org
Fellows -- C. P. Wong, cp.wong@ieee.org
Constituition & Bylaws -- Tony Mak, +1 972 371 4364, t.mak@ieee.org
Finance -- Ralph Wyndrum, Jr., r.wyndrum@ieee.org
Long Range Planning -- Dennis Olsen, d.olsen@ieee.org
Standards --
IEEE Books & Cand D Magazine Editor, Joe Brewer, +1 386 445 2593, j.brewer@ieee.org
Membership -- Ralph Russell, cpmt-membership@ieee.org
Chapter Development -- Ralph Russell, II, see membership
Nominations -- John Segelken, +1 732 920 3023
International Relations -- Leo Feinstein, +1 508 870 0051; Europe -- Ephraim Suhir, +1 908 582 5301; Far East -- W. T. Chen, +65 874 8110
Joint Committee on Semiconductor Manufacturing -- G. C. Cheek

Publications

CPMT SOCIETY NEWSLETTER
Editor: David W. Palmer, email: d.palmer@ieee.org, FAX +1 505 844 7011, Tel: +1 505 844 2138

Associate Editor: Li Li, Free Scale Inc., li.li@ieee.org
Composition: Alina Deutsch, deutsch@us.ibm.com
Proofreading: Janice Washington
CPMT Archival Publications
Publications VP: Paul Wesling, email: p.wesling@ieee.org, Tel: +1 408 331 0114.
Transactions-CPT editor, Avram Bar-Cohen, Univ. of Maryland, 2181B Martin Hall, College Park, MD 20742 USA, Tel: +1 301 405 3173; email barcohen@eng.umd.edu
Transactions-AdvP editor; G. Subbarayan, Purdue University, ME Department, Tel: +1 765 494 9770; email ganeshs@ecn.purdue.edu
Transactions EPM editor, Walter Trybula, Tel +1 512 356 3306, email w.trybula@ieee.org

Technical Committees

TC-ECCC (TC-1) Electrical Contacts, Connectors and Cables--Gerald Witter, Chugai, +1 708 244 6025
TC-DIP (TC-2) Discrete and Integral Passive Components-Leonard Schaper, Univ. of Arkansas, schaper@uark.edu
TC-Assy (TC-3) IC and Package Assembly - Michele Berry, Intel, michele.j.berry@intel.com
TC-EM (TC-4) Manufacturing Design & Process-Walt Trybula, SEMATECH, +1 512 356 3306
TC-M (TC-5) Materials--Rajen Chanchani, Sandia Labs, +1 505 844 3482
TC-HDSB (TC-6) High Density PWB packaging -- Yoshitaka Fukuoka, weisti.fukuoka@rose.zero.ad.jp
TC-ASTR (TC-7) Environmental Stress & Reliability Test--Kirk Gray, k.a.gray@ieee.org
TC-Therm (TC-9) Thermal Management & Thermomechanical Design--Tony Mak, Dallas Semi, +1 972 371 4364
TC-Opto (TC-10) Fiber Optics & Photonics-Frank Shi, UC Irvine, email: FGSHI@uci.edu
TC-Test (TC-11) Electrical Test -- Bruce Kim, Bruce.Kim@asu.edu, Tel: +1 480 965 3749
TC-EDMS (TC-12) Electrical Design, Modeling and Simulation-- Madhavan Swaminathan, G Tech, +1 404 894 3340
TC-PEP (TC-13) Power Electronics Packaging--Doug Hopkins, SUNY Buffalo, +1 607 729 9949
TC-SP (TC-14) Systems Packaging-Erich Klink, eklink@de.ibm.com
TC-RF+W (TC-16) RF and Wireless-- Craig Gaw, Motorola, +1 480 413 5920
TC-MEMS (TC-17) MEMS and Sensor Packaging-Eric Jung, IZM Berlin, email: erju@izm.fhg.de
TC-WLP (TC-18) Wafer Level Packaging-Michael Toepper, IZM Berline, toepper@izm.fhg.de
TC-Ed (TC-19) Education--Rao Tummala, G Tech, +1 404 894 9097
TC-GEMP (TC-21) Green Electronics Manufacturing and Packaging--Hansjoerg Griese, Email: griese@izm.fhg.de

TC-NANO Nano Packaging -- Rao Tummala, Georgia Tech, rao.tummala@ee.gatech.edu