WILLIAM D. BROWN

Received the IEEE Fellow of Institute in 2004 for leadership in furthering education of high density electronics.

William D. Brown received the B.S. degree in Electrical Engineering from the University of Arkansas, Fayetteville, in 1969, the M.S. degree from Pennsylvania State University, University Park, in 1970; and the Ph.D. degree from the University of New Mexico, Albuquerque, in 1975.

From 1969 to 1977, he was a Member of the Technical Staff at Sandia National Laboratories in Albuquerque, NM. In 1977, he joined the faculty of the Electrical Engineering Department at the University of Arkansas where he presently holds the rank of Distinguished Professor. From 1983 to 1998, he served as the Head of the Department of Electrical Engineering. Since January 1999, he has served as the Associate Dean for Research in the College of Engineering. His research interests include microelectronic materials and devices, solid-state and semiconductor physics, and electronic packaging.

Bill's research has resulted in over 300 conference presentations, over 300 technical journal/proceedings publications, and 10 U.S. patents. He has contributed to the book,
Electronic Manufacturing Processes published by Prentice Hall, and has contributed to and edited the books Nonvolatile Semiconductor Memory Technology and Advanced Electronic Packaging: With Emphasis On Multichip Modules, both published by the IEEE PRESS.

Bill is a registered Professional Engineer in the State of Arkansas and holds memberships in the Institute of Electrical and Electronics Engineers (he serves on the Board of Governors of the Components, Packaging, and Manufacturing Technologies Society), the International Microelectronics and Packaging Society, the Materials Research Society, the American Vacuum Society, the Arkansas Academy of Science, and the American Society of Engineering Educators (ASEE). He is a Fellow of the Electrochemical Society.