FOR IMMEDIATE RELEASE
Contact:
Jim Bruorton
(864) 963-6621
Orlando, Florida USA- August
10, 2004)--The 55th Electronic Components & Technology
Conference will be held at Wyndham Palace Resort & Spa
in Orlando, Florida USA on May 31 June 3, 2005.
This conference comprises papers covering
a wide spectrum of topics, including not only electronic components,
but also exciting new developments in all areas of electronics
technology (for example, electronics assembly, packaging, systems
packaging, optoelectronics, reliability and materials). In 2004,
over 300 papers and posters, and 16 Professional Development Courses
were presented by companies, universities and research institutions
from around the world. The audience included representatives from
leading universities and companies eager to stay abreast of the
rapidly changing and emerging technologies in the electronics
field.
The primary goal of the conference
is to offer quality coverage of technological innovations in the
areas of packaging design, materials, processes, quality and manufacturing
of devices, components and systems. The Program Committee represents
a wide variety of disciplines and expertise from the electronics
industry. We are committed to assembling the highest quality program
for the 55th ECTC, and we need many excellent papers to meet this
commitment.
Advanced Packaging:
New packaging technologies, systems packaging, designs, materials
and configurations addressing performance density and cooling
for single chip, multi-chip, wafer-level, MEMS and power packages.
Special emphasis on flip-chip, fine pitch and high lead count
packaging in CSP, BGA , CGA, LGA, SMT packages for both Pb-bumps
and package assembly.
Components & RF:
New passive or active component technologies, integrated-embedded
components, RF & wireless component applications, component
performance, systems and reliability.
Education:
Education for engineering curricula in the 21st century and collaborative
research and engineering programs between universities, government,
or industry; development and the use of multi-media for packaging
education.
Emerging Technologies: Biomedical Packaging:
Packaging of biomedical devices. Microfludic devices. Biocompatible
materials. Miniaturized diagnostic, drug delivery, prevision surgery,
prosthesis, bio-sensing devices. Integrated biotech devices using
sample preparation, processing and data communication, test procedures
and results.
Emerging Technologies: Nano-Scale Packaging:
Micro-to-nano transition and interfaces. Packaging of nano-scale
electronic and sensing devices and its design. Nano-materials,
nano-pattering, nano-interconnections, and characterization. Nano-fluidics,
optics and mechanics. Nano-electro-mechanical systems (NEMS).
Interconnections:
First level electronic interconnection technologies including,
flip-chip, 3D interconnect, lead-free interconnects, wirebonding,
TAB, and conductive polymers; under-bump metallurgy, substrate
metallurgy and interconnect, wafer and device level interconnections,
electrical issues of advanced interconnect structures, novel interconnects,
and electromigration of bumped interconnects.
Manufacturing Technology:
Advanced process development and equipment improvement for wafer
thinning, bumping, stacking, and low-k chip packaging, high-density
interconnect and embedded component substrates, testing and burn-in.
Emphasis on product level integration and optimization for different
product applications, cost, yield, performance and environmental
improvements, process characterization, new product introduction
and ramp, design for flexible manufacturing and testing.
Materials & Processing:
Processes for IC packaging that enhance performance (mechanical
and electrical) and cost effectiveness. Technology, development
and application of adhesives, encapsulants, chip underfills, solders
and alloys, magnetic and optical materials, ceramics, composites,
dielectrics, thin films, nanomaterials, thermal materiarls, bonding
and plating processes.
Modeling & Simulation:
Electrical, thermal, optical, mechanical modeling, simulation,
characterization and packaging solutions including system-level
applications.
OptoElectronics:
Packaging for fiber-optic modules, infra-red wireless, consumer
opto-electronics, flat-panel, projection and micro-displays, solid
state lighting, optical amplifiers, lasers, detectors, OEICs,
optical data interconnect, optical backplanes, passive components,
and WDMs.
Posters:
Papers may be submitted on any of the listed major topics; presentation
of papers in a poster format is highly encouraged at ECTC.
Quality & Reliability:
Assessment, failure analysis, reliability testing and data analysis,
failure and accelerated models, qualification of components and
systems, KGD, incremental quality improvement, and TQM.
Professional Development Courses:
Proposals are also solicited from individuals interested in teaching
educational short courses (~4 hours) on topics described in the
Call for Papers. Proposals including course descriptions must
be submitted to Rao Bonda, at rao.bonda@freescale.com no later
than October 15th, 2004.
Make arrangements to attend this grand
ECTC in Orlando. Please visit the conference website for all contact
information: www.ectc.net