Year 2004 activities for Members of IEEE-CPMT Hong Kong,


1. Eight workshops and two seminars were held in year 2004:

Eight Workshops:
(i) Three Dimensional Packaging, Interconnection & Assembly for Microelectronics Miniaturization
Speaker: Dr. Chuck Bauer
Date: April 21 (Wednesday), 2004 (10:00 p.m. to 5:00 p.m.)
Venue: Room 2404 (Lift 17, 18), HKUST
(ii) Wire Bonding in Microelectronics
Speaker: George G. Harman
Date: April 30 (Friday), 2004 (9:00 a.m. to 5:30 p.m.)
Venue: Room 2404 (Lift 17, 18), HKUST
(iii) Monitoring the Health (Reliability) of Products
Speaker: Dr. Michael Pecht
Date: June 9 (Wednesday), 2004 (2:00 p.m. to 5:30 p.m.)
Venue: Room 2404 (Lift 17, 18), HKUST
(iv) Trends in High Density Packaging and Portable Microelectronics
Speaker: E. Jan Vardaman
Date: June 29 (Tuesday), 2004 (2:00 p.m. to 5:30 p.m.)
Venue: Room 3006 (Lift 3), HKUST
(v) Impact of Lead-Free on Electronic and Optoelectronic Packaging and their SMT Assembly
Speaker: Dr. John H. Lau
Date: June 15 (Tuesday), 2004 (2:30 p.m. to 4:30 p.m.)
Venue: Room 3006 (Lift 3), HKUST
(vi) Conductive Adhesive Joining Technology for Electronics Packaging Applications
Speaker: Prof. Johan Liu
Date: July 26 (Monday), 2004 (9:00 a.m. to 5:30 p.m.)
Venue: Room 1505 (Lift 25, 26), HKUST
(vii) Preparation and Implementation for Lead-Free Soldering
Speaker: Dr Ning-Cheng Lee
Date: August 20 (Friday), 2004 (9:00 a.m. to 5:30 p.m.)
Venue: Room 2404 (Lift 17, 18), HKUST
(viii) Trend and Design of MEMS and Advanced Packaging
Speaker: Dr K. N. Chiang
Date: September 3 (Friday), 2004 (9:00 a.m. to 12:30 p.m.)
Venue: Room 2404 (Lift 17, 18), HKUST

Two Seminars:
(ix) Migration to Lead-Free Microelectronics Assembly & Some Key Technical Issues
Speaker: Dr. Karl Puttlitz
Date: July 23 (Friday), 2004 (3:00 p.m. to 4:00 p.m.)
Venue: Room 3006 (Lift 3), HKUST
(x) Semiconductor Packaging Industry Trends - Flip Chip & System in Package
Speaker: Dr. William Chen
Date: September 7 (Tuesday), 2004 (10:00 a.m. to 11:30 a.m.)
Venue: Room 2404 (Lift 17, 18), HKUST

2. The Chapter successfully elevated three local members from Member grade to Senior Member grade. They are Dr. Torsten Wipiejewski, Dr. Matthew MF Yuen, and Dr. Wing Yiu Cheung.

3. The Student Chapter arranged a Student Booth in ECTC 2004 and a Student Symposium held in HKUST on 15 June 2004. Company visit were arranged, including a visit to Hua Wei in ShenZhen on 30 August, 2004.

According to our new By-laws, Dr. Li Ming will step up to be our Chapter Chair for year 2005-2006. There will be election for Chapter Vice-chair and Chair-elect in year 2004 AGM which will be held jointly with the AGM of Hong Kong Section. We would like to call for nomination of the Chapter Vice-chair and Chair-elect for year 2005-2006. Only Hong Kong IEEE CPMT members of grade Member, Senior Member and Fellow are eligible to be nominated, or, to second a nomination. Nomination shall be made from 1st to 21st November. Please state the name, membership number and e-mail address of the nominee in the nomination and all the nominations should address to ken.cheung@ieee.org before noon 21st November.

Thank you for your support.

Best regards,

Dr. Cheung Yiu-Ming, Ken
Chairman, IEEE CPMT Hong Kong for Year 2004