CPMT OFFICERS

President -- Phil Garrou, +1 919 248 9261
Technical VP -- Rolf Aschenbrenner, +4930-46403164
Administration VP -- H. Anthongy Chan,
Treasurer -- John Segelken, +1 732 920 3023
VP Publications -- Paul B. Wesling, +1 408 331 0114
VP Conferences -- S. W. Ricky Lee, +852 2358 7203, rickylee@ust.hk
VP Education -- Albert Puttlitz, FAX +1 802 879 0466
Senior Past President -- John Stafford, +1 602 413 5509
Junior Past President -- Rao Tummala, +1 404 894 9097
Secretary -- Ron Gedney, +1 703 834 2084
Executive Director -- Marsha Tickman, +1 732 562 5529
IEEE VP TAB -- Ralph Wyndrum, +1 732 219 0005

Board of Governors, Elected Members at Large

Standing Committee Chairpeople
Student Chapter Development -- William D. Brown, wdb@engr.uark.edu
Distinguished Speakers -- A. F. Puttlitz, FAX +1 802 879 0466
Fellows Search -- Rao Tummala, rao.tummala@ee.gatech.edu, & David Palmer, d.palmer@ieee.org
Fellows -- C. P. Wong, cp.wong@ieee.org
Constituition & Bylaws -- Tony Mak, +1 972 371 4364, t.mak@ieee.org
Finance -- Ralph Wyndrum, Jr., r.wyndrum@ieee.org
Long Range Planning -- Dennis Olsen, d.olsen@ieee.org
Standards --
IEEE Books & Cand D Magazine Editor, Joe Brewer, +1 386 445 2593, j.brewer@ieee.org
Membership -- Ralph Russell, cpmt-membership@ieee.org
Chapter Development -- Ralph Russell, II, see membership
Nominations -- John Segelken, +1 732 920 3023
International Relations -- Leo Feinstein, +1 508 870 0051; Europe -- Ephraim Suhir, +1 908 582 5301; Far East -- W. T. Chen, +65 874 8110
Joint Committee on Semiconductor Manufacturing -- G. C. Cheek

Publications

CPMT SOCIETY NEWSLETTER
Editor: David W. Palmer, email: d.palmer@ieee.org, FAX +1 505 844 7011, Tel: +1 505 844 2138
Associate Editor: Li Li, Free Scale Inc., li.li@ieee.org
Composition: Alina Deutsch, deutsch@us.ibm.com
Proofreading: Janice Washington
CPMT Archival Publications
Publications VP: Paul Wesling, email: p.wesling@ieee.org, Tel: +1 408 331 0114.
Transactions-CPT editor, Avram Bar-Cohen, Univ. of Maryland, 2181B Martin Hall, College Park, MD 20742 USA, Tel: +1 301 405 3173; email barcohen@eng.umd.edu
Transactions-AdvP editor; G. Subbarayan, Purdue University, ME Department, Tel: +1 765 494 9770; email ganeshs@ecn.purdue.edu
Transactions EPM editor, R. Wayne Johnson, Tel +1 334 844 1880, johnson@eng.auburn.edu

Technical Committees

TC-ECCC (TC-1) Electrical Contacts, Connectors and Cables--Gerald Witter, Chugai, +1 708 244 6025
TC-DIP (TC-2) Discrete and Integral Passive Components-Leonard Schaper, Univ. of Arkansas, schaper@uark.edu
TC-Assy (TC-3) IC and Package Assembly - Michele Berry, Intel, michele.j.berry@intel.com
TC-EM (TC-4) Manufacturing Design & Process-Walt Trybula, SEMATECH, +1 512 356 3306
TC-M (TC-5) Materials--Rajen Chanchani, Sandia Labs, +1 505 844 3482
TC-HDSB (TC-6) High Density PWB packaging -- Yoshitaka Fukuoka, weisti.fukuoka@rose.zero.ad.jp
TC-ASTR (TC-7) Environmental Stress & Reliability Test--Kirk Gray, k.a.gray@ieee.org
TC-Therm (TC-9) Thermal Management & Thermomechanical Design--Tony Mak, Dallas Semi, +1 972 371 4364
TC-Opto (TC-10) Fiber Optics & Photonics-Susan Law -- Fax: +612 9351 1911, Email: s.law@oftc.usyd.edu.au
TC-Test (TC-11) Electrical Test -- Bruce Kim, Bruce.Kim@asu.edu, Tel: +1 480 965 3749
TC-EDMS (TC-12) Electrical Design, Modeling and Simulation-- Madhavan Swaminathan, G Tech, +1 404 894 3340
TC-PEP (TC-13) Power Electronics Packaging--Doug Hopkins, SUNY Buffalo, +1 607 729 9949
TC-SP (TC-14) Systems Packaging-Erich Klink, eklink@de.ibm.com
TC-RF+W (TC-16) RF and Wireless-- Craig Gaw, Motorola, +1 480 413 5920
TC-MEMS (TC-17) MEMS and Sensor Packaging-Eric Jung, IZM Berlin, email: erju@izm.fhg.de
TC-WLP (TC-18) Wafer Level Packaging-Michael Toepper, IZM Berline, toepper@izm.fhg.de
TC-Ed (TC-19) Education--Rao Tummala, G Tech, +1 404 894 9097
TC-GEMP (TC-21) Green Electronics Manufacturing and Packaging--Hansjoerg Griese, Email: griese@izm.fhg.de
TC-NANO Nano Packaging -- Rao Tummala, Georgia Tech, rao.tummala@ee.gatech.edu