CHAPTER NEWS

REGION 10 CHAPTER ACTIVITY ROUND UP -- by Dr. P. B. Parikh

• Dr. Lih-Shan Chen Secretary of IEEE CPMT Taipei Chapter has reported having organized IMAPS Taiwan 2004 Technical Symposium in Kaohsiung on October 22, 2004. More than 40 technical papers were presented in the conference. The papers included such topics as advanced packaging, lead-free soldering technology, green materials, testing and reliability of packaging. Dr. Okuno, general manager of Senju Metal Industry Co. Taiwan Branch, was invited to give a speech with "Technical Report in Recent BGA Soldering" as the topic.
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• The IEEE CPMT Hongkong Chapter had organized the election of Chair elect and Vice Chair of the year 2005 and 2006. Dr. Ming Li will step up to be the Chairperson of IEEE CPMT Hongkong chapter by 1st January 2005 for the year 2005-2006.

The Chapter successfully elevated three local members from Member grade to Senior Member grade. They are Dr. Torsten Wipiejewski, Dr. Matthew MF Yuen, and Dr. Wing Yiu Cheung.

The Student Chapter arranged a Student Booth in ECTC 2004 and a Student Symposium held in HKUST on 15 June 2004. Company visit were arranged, including a visit to Hua Wei in ShenZhen on 30 August, 2004.

In addition Mr. Cheung Yiu-Ming, Ken has also summarized the activities of the Hongkong chapter during the year 2004 as under:-

A. Eight workshops with details as under: -
Ø Three Dimensional Packaging, Interconnection & Assembly for Microelectronics Miniaturization by Dr. Chuck Bauer on April 21 2004 (one day).
Ø Wire Bonding in Microelectronics by George G. Harman on April 30 2004 (one day).
Ø Monitoring the Health (Reliability) of Products by Dr. Michael Pecht on June 9 2004 (half day).
Ø Trends in High Density Packaging and Portable Microelectronics by E. Jan Vardaman on June 29 2004 (half day).
Ø Impact of Lead-Free on Electronic and Optoelectronic Packaging and their SMT Assembly by Dr. John H. Lau on June 15 2004 (half day).
Ø Conductive Adhesive Joining Technology for Electronics Packaging Applications by Prof. Johan Liu on July 26 2004 (one day).
Ø Preparation and Implementation for Lead-Free Soldering by Dr Ning-Cheng Lee on August 20 2004 (one day).
Ø Trend and Design of MEMS and Advanced Packaging by Dr K. N. Chiang on September 3 2004 (half day).

B. Two Technical Lectures:
Ø Migration to Lead-Free Microelectronics Assembly & Some Key Technical Issues by Dr. Karl Puttlitz on July 23 2004.
Ø Semiconductor Packaging Industry Trends - Flip Chip & System in Package by Dr. William Chen on September 7 2004.

• Dr. K L Pey of Singapore Chapter has reported the following activities during the quarter:

A. Technical Seminars.
Two IEDM video short courses were arranged in Sep'04. Due to an overwhelming response, three separate viewing sessions were conducted
Ø Sep 19 & 24 and 2 Oct, Course 1 - The Future of Semiconductor Manufacturing
Ø Sep 22, Course 2 - Silicon +: Augmented Silicon Technology.

B. Technical talk and short courses
Ø Oct 11, Dr. Professor Arun N. Chandorkar of Indian Institute of Technology, Bombay, India gave a talk on "Technology scaling and its influence on architecture designs".
Ø A one-day short course on "Integration of Copper with Low-k Dielectrics" by Dr Jeffrey Gambino, IBM, USA was held on 25 October 2004 at the Sheraton Towers, Singapore.

C. Conferences/Events Planned
Ø EPTC'04
The 6th EPTC is scheduled for 8 - 10 December 2004. The Call for Papers has received a good response and close to 200 abstracts were received, topping the submissions in 2003. All the arrangements for a successful conference are being made including the short courses, keynote and invited speeches, table-top exhibition and social events. A new feature will be an executive forum on the trend and directions in key packaging thrusts targeted at technology leaders in the region. With the industry pick-up and the impending lead-free implementation, it is expected that EPTC 2004 will generate even greater interest and participation.
Ø A one-day short course on "Failure Mechanisms and Reliability in Integrated Circuits" by Dr. M.K. Radhakrishnan, NanoRel Consultants will be held on 10 December 2004 at the Sheraton Towers Singapore.
Ø IPFA'05
The 2005 International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA'05), organized by the IEEE Rel/CPMT/ED Singapore Chapter, and technically co-sponsored by the IEEE EDS and Reliability will be held at Shahgri-La's Rasa Sentosa Resort, Singapore, 27 - 31 June 2005. The second call for papers has been announced. For more information, please visit the IPFA'05 website at https://www.ewh.ieee.org/reg/10/ipfa/html/2005/.
Ø The Chapter donated S$500 to the Student Chapter of the Nanyang Technological University branch for a "Back to the Future" competition for post-graduate students.

• IEEE CPMT India Council chapter organized a cosponsored one day technical event (with the Annual Convention of SMTA-IC) on 26th November 2004 at Bangalore. The theme for this convention was "Managing Profitable Electronic Manufacturing Services". As a sponsoring organization all our members of IEEE CPMT were entitled to free registration at the convention. Accordingly, 5 of our IEEE CPMT members (including 2 from CPMT Execom) attended the convention. Totally 8 review papers (including one on "Lead Free Interconnect Technology" by Mr. R Kaura and one on "Electronic Packaging" by Prof N J Rao of Indian Institute of Science, Bangalore) were presented and discussed in detail. The convention was well attended by about 80 delegates from all over India.

The chapter has planned a technical lecture on "Status of Commercialization of MEMS in Indian Perspective" by Dr. D. N. Singh on 17th December at IIT, Powai, Bombay alongwith IEEE Bombay section. One more technical lecture on "Advanced Packaging" by Mr. S.Shakar Narayan is also planned in December 2004.