Call for Titles & Abstracts
Deadline: April 15, 2005 Send to:
wlp@ece.gatech.edu
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First
International
Workshop
on 3S (SOP, SIP, SOC)
Electronic
Technologies
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September 22 & 23, 2005
Global Learning & Conference Center at Technology Square
84 Fifth Street, Atlanta, GA, 30308 USA
Sponsored by Georgia Tech's Packaging Research Center and the
IEEE-CPMT Society
General Chair: Rao R. Tummala, Director, Packaging Research
Center, Georgia Institute of Technology
Course Fees & Program
Updates * Register
Online
The SOP paradigm changes the current chip-centric SOC
methodology to a cheaper, faster-to-market IC-package-system co-design
flow. The advantages of the SOP paradigm over SOC appear
overwhelming due to SOP's design simplicity, lower cost and higher
system function integration, electrical performance, without the
intellectual property issues that dominate SOC. The SOP
is also different from and offers advantages over 3D packaging
and SIP. The 3D packaging is typically stacking of similar,
or dissimilar, chips such as DRAMS. The SIP goes beyond
to embed both actives and passives but the passives are discrete,
thick and bulky components. The SOP goes one step further
in the ultimate 3D integration of components in thin film form
at microscale, in the short term, and nanoscale in the long term.
The SOP focuses on integrating both single function as well as
heterogeneous system functions, optimizing ICs for transistors
and package for integration of digital, RF, optical, sensor and
others. It accomplishes this by both build-up SOP, similar
to ICs and stacked SOP, similar to parallel board fabrication.
This workshop reviews the latest R & D and manufacturing status
of each of the 3 electronic technologies around the world.
It will also attempt to compare and contrast SOC, 3D stacking,
SIP, SOP and MCM.
SOP,
SIP, SOC and 3D Technologies
·Mixed Signal Design
·Mixed Signal Tools
·Embedded Digital integration and modules
·Embedded Optical integration and modules
·Embedded RF integration and modules
·Multifunction integration and modules
·Fabrication and Assembly
·Mixed Signal Test
·Mixed Signal Reliability
·Stacked ICs
·Stacked Packages
·Manufacturing
·Applications & Products
Course Fees & Program Updates * Register Online