Call for Titles & Abstracts
Deadline: April 15, 2005  Send to: wlp@ece.gatech.edu
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        First
International Workshop
        on 3S (SOP, SIP, SOC)
Electronic Technologies
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September 22 & 23, 2005
Global Learning & Conference Center at Technology Square
84 Fifth Street, Atlanta, GA, 30308 USA

Sponsored by Georgia Tech's Packaging Research Center and the IEEE-CPMT Society
General Chair:
Rao R. Tummala, Director, Packaging Research Center, Georgia Institute of Technology

Course Fees & Program Updates * Register Online

The SOP paradigm changes the current chip-centric SOC methodology to a cheaper, faster-to-market IC-package-system co-design flow.  The advantages of the SOP paradigm over SOC appear overwhelming due to SOP's design simplicity, lower cost and higher system function integration, electrical performance, without the intellectual property issues that dominate SOC.  The SOP is also different from and offers advantages over 3D packaging and SIP.  The 3D packaging is typically stacking of similar, or dissimilar, chips such as DRAMS.  The SIP goes beyond to embed both actives and passives but the passives are discrete, thick and bulky components.  The SOP goes one step further in the ultimate 3D integration of components in thin film form at microscale, in the short term, and nanoscale in the long term.  The SOP focuses on integrating both single function as well as heterogeneous system functions, optimizing ICs for transistors and package for integration of digital, RF, optical, sensor and others.  It accomplishes this by both build-up SOP, similar to ICs and stacked SOP, similar to parallel board fabrication.

This workshop reviews the latest R & D and manufacturing status of each of the 3 electronic technologies around the world.  It will also attempt to compare and contrast SOC, 3D stacking, SIP, SOP and MCM.

SOP, SIP, SOC and 3D Technologies

·Mixed Signal Design
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Mixed Signal Tools
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Embedded Digital integration and modules
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Embedded Optical integration and modules
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Embedded RF integration and modules
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Multifunction integration and modules
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Fabrication and Assembly
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Mixed Signal Test
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Mixed Signal Reliability
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Stacked ICs
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Stacked Packages
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Manufacturing
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Applications & Products

Course Fees & Program Updates * Register Online