CPMT NEWSLETTER for MARCH 2006

- Full Newsletter (900 kB) INDEX to individual PDFs - President's Column - Officers & Chairs Listing - IEEE Fellow Nominations Process - Interview with Dr. Bill Chen, new CPMT President - Interview with Paul Wesling, CPMT Publications Vice President - Senior Membership & New Senior Members - Conference Report: EMAP'05 - Chapter News - Interview with Candidates for IEEE President UPCOMING EVENTS: Programs, Calls for Papers: - Int'l Conference on Electronics Packaging (ICEP 2006) in Tokyo, Japan (4/06): Advance Program - Int'l Conf on Thermal, Mechanical Simulation and Experiments in Micro-Electronics (EuroSimE) in Milan, Italy (4/06): Advance Program - Design, Test, Integration, Packaging of MEMS/MOEMS (DTIP) in Lago Maggiori, Italy (4/06): Advance Program - IEEE Workshop on Signal Propagation on Interconnects (SPI 2006) in Berlin, Germany (5/06): Advance Program - International Spring Seminar on Electronics Technology (ISSE 2006) in Dresden/St. Marienthal, Germany (5/06): Advance Program - Electronic Components & Technology Conference (ECTC) in San Diego (5/06): Advance Program

UPCOMING EVENTS (continued) - InterSociety Conference on Thermal Phenomena in Electronic Systems (I-THERM) in San Diego (5/06): Advance Program - Int'l Conference on Electronics Packaging Technology (ICEPT'06) in Shanghai, China (8/06): CFP - Abstracts due 5/25 - European Systemintegration Conf (ESTC'06) in Dresden, Germany (9/06): Topics, Keynote Speakers - SOP/SiP/SOC Electronics Workshop in Atlanta (9/06): CFP - Abstracts due 6/23 - Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2006) in Scottsdale, Arizona (10/06): CFP - Papers due 7/10 - Int'l Electronics Mfgng Technology Conf in Kuala Lumpur, Malaysia (11/06): CFP - abstracts due 5/10 - 8th VLSI Packaging Workshop in Japan in Kyoto, Japan (12/06): CFP - abstracts due 5/26 - 8th Electronics Packaging Technology Conference (EPTC 2006) in Singapore (12/06): CFP - abstracts due 6/15 - 8th Int'l Conf on Electronic Materials and Packaging (EMAP 2006) in Hong Kong (12/06): CFP - abstracts due 6/30 - PORTABLE: Portable Information Devices in Orlando, Florida (3/07): CFP - Abstracts due 6/1 - SEMI-THERM'07: Semiconductor Thermal Measurement and Management Symposium in San Jose, CA (3/07): CFP - Abstracts due 9/15

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