CPMT NEWSLETTER for JUNE 2006

- Full Newsletter (900 kB) INDEX to individual PDFs - President's Column - Officers & Chairs Listing - Bio: New Strategic Director for Awards - Bios: Transactions Editors-In-Chief       Bar-Cohen, Ramakrishna, Lee - Interview with Rao Bonda, Technical VP - Interview with Rolf Aschenbrenner, Conferences VP - Interview with David Palmer, Fellows Search Committee - Report on ECTC in San Diego - The 2006 CPMT Award Winners - Call for Nominations for Positions on CPMT Board - Two Book Reviews: Pb-Free Solders - Workshop Report: Pictures from EMAP 2005 - Chapter News - Conference Announcements and Calls for Papers UPCOMING EVENTS: Programs, Calls for Papers: - Int'l Conference on Electronics Packaging Technology (ICEPT 2006) in Shanghai, China (August): CFP & Advance Program - 1st Electronics Systemintegration Technology Conference (ESTC 2006) in Dresden, Germany (Sept): Advance Program - SOP/SiP/SOC Electronics Workshop in Atlanta, GA (Sept): Advance Program

UPCOMING EVENTS (continued) - Workshop on Accelerated Stress Testing & Reliability (ASTR 2006) in San Francisco, CA (Oct): Advance Program - Electrical Performance of Electronic Packaging (EPEP 2006) in Scottsdale, Arizona (Oct): Advance Program - 31st Int'l Electronics Manufacturing Technology Symposium (IEMT 2006) in Kuala Lumpur, Malaysia (Nov): Advance Program - 8th VLSI Packaging Workshop in Japan in Kyoto, Japan (Dec): Advance Program - 8th Electronics Packaging Technology Conference (EPTC 2006) in Singapore (Dec): Advance Program - 8th Int'l Conference on Electronics Materials And Packaging (EMAP 2006) in Hong Kong (Dec): Call for Papers - Int'l Conference on Thermal Issues in Emerging Technologies - Theory and Application (ThETA'07) in Cairo, Egypt (Jan): Call for Papers - 6th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007) in Tokyo, Japan (Jan): Call for Papers - 10th European Systems Packaging Workshop (ESPW) in Como, Italy (Jan): Call for Papers - PORTABLE: Portable Information Devices in Orlando, Florida (March): Call for Papers - Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'07) in San Jose, CA (March): Call for Papers - 57th Electronic Components and Technology Conference (ECTC 2007) in Reno, Nevada (May/June): Call for Papers (Due Oct 15)

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