CPMT NEWSLETTER for SEPTEMBER 2006

- Full Newsletter (1.3 MB) INDEX to individual PDFs - President's Column - Officers & Chairs Listing - Minutes from June BOG meeting - Bios: Region 10 Strategic Director       Charles Lee - Bios: Transactions Editors-In-Chief       Ganesh Subarayan, Wayne Johnson - Interview with Avi Bar-Cohen, CPMT Editor-in-Chief - Interview with Marsha Tickman, Executive Director - Report on ICEPT (Shanghai), ESTC (Dresden) - Report on HDP Conference (Shanghai) - 2007 Award Nominations - Member-Get-a-Member Program - Chapter News - Conference Announcements and Calls for Papers UPCOMING EVENTS: Programs, Calls for Papers: - International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT 2006) in Taipei, Taiwan (Oct): Advance Program - Electrical Performance of Electronic Packaging (EPEP 2006) in Scottsdale, Arizona (Oct): Advance Program - 31st Int'l Electronics Manufacturing Technology Symposium (IEMT 2006) in Kuala Lumpur, Malaysia (Nov): Advance Program - 8th VLSI Packaging Workshop in Japan in Kyoto, Japan (Dec): Advance Program - 8th Electronics Packaging Technology Conference (EPTC 2006) in Singapore (Dec): Advance Program

UPCOMING EVENTS (continued) - 8th Int'l Conference on Electronics Materials And Packaging (EMAP 2006) in Hong Kong (Dec): Advance Program - Printed Electronics USA (PrintElec 2006) in Phoenix, AZ (Dec): Advance Program - 2006 Electrical Design of Advanced Packaging and Systems (EDAPS 2006) in Shanghai, China (Dec): Advance Program - Int'l Conference on Thermal Issues in Emerging Technologies - Theory and Application (ThETA'07) in Cairo, Egypt (January): Advance Program - 6th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007) in Tokyo, Japan (January): Advance Program - 10th European Systems Packaging Workshop (ESPW) in Como, Italy (Jan): Call for Papers - PORTABLE: Portable Information Devices in Orlando, Florida (March): Call for Papers - Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'07) in San Jose, CA (March): Advance Program - Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) in London, England (April): Call for Papers (Due Oct 30) - International Spring Seminar on Electronics Technology (ISSE 2007) in Cluj-Napoca, Romania (May): Call for Papers (Due February 16) - 57th Electronic Components and Technology Conference (ECTC 2007) in Reno, Nevada (May/June): Call for Papers (Due Oct 30)

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