CPMT NEWSLETTER for DECEMBER 2006

- Full Newsletter (600 kB) INDEX to individual PDFs - President's Column: "More on Moore's Law" - Officers & Chairs Listing - New BOG Members: Profiles - New Fellows of the IEEE, from CPMT - Member Recognition: Dr. Johan Liu - Conference Reviews: CriMiCo, IEMT, IMPACT - Chapter Reports - Call for Papers: EPTC, December, Singapore - Call for Papers, EMAP, November, Korea - Call for Papers, SPI, May, Italy - Call for Papers, IEMT, October, San Jose, CA - Call for Papers, APM, October, San Jose, CA - Call for Papers, IWASI, June, Italy - Call for Papers, ICEPT, August, Shanghai - Call for Special Section: Obsolescence UPCOMING EVENTS: Programs, Calls for Papers: - Int'l Conference on Thermal Issues in Emerging Technologies - Theory and Application (ThETA'07) in Cairo, Egypt (January): Advance Program - 6th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007) in Tokyo, Japan (January): Advance Program - 10th European Systems Packaging Workshop (ESPW) in Como, Italy (Jan): Advance Program - PORTABLE: Portable Information Devices in Orlando, Florida (March): Advance Program - Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'07) in San Jose, CA (March): Advance Program - Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) in London, England (April): Advance Program - International Spring Seminar on Electronics Technology (ISSE 2007) in Cluj-Napoca, Romania (May): Advance Program

UPCOMING EVENTS (continued) - 57th Electronic Components and Technology Conference (ECTC 2007) in Reno, Nevada (May/June): Advance Program - 2007 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Stresa, Italy (June): Advance Program - 9th Int'l IEEE-CPMT Symposium on High Density Design, Packaging and Microsystem Integration (HDP’07) in Shanghai, China (June): Call for Papers - IEEE International Workshop on Advances in Sensors and Interfaces (IWASI) in Bari, Italy (June): Call for Papers - 3rd Annual Organic Microelectronics Workshop in Seattle, WA (July): Call for Papers - ASME/IEEE InterPACK 2007 in Vancouver, BC (July): Advance Program - 8th International Conference on Electronics Packaging Technology (ICEPT 2007) in Shanghai, China (August): Call for Papers - 52nd IEEE Holm Conference on Electrical Contacts, and Intensive Course in Pittsburgh, PA (September): Call for Papers - 16th Annual International Symposium on Semiconductor Manufacturing (ISSM'07) in Santa Clara, CA (October): Call for Papers - 2007 IEEE Electrical Performance of Electronic Packaging (EPEP) in Atlanta, GA (October): Call for Papers - 32nd Int'l Electronics Manufacturing Technology Symposium (IEMT 2007) in Silicon Valley, CA (Oct): Call for Papers - Advanced Packaging Materials Symposium (APM 2007) in Silicon Valley, CA (Oct): Call for Papers - 9th Int'l Conference on Electronics Materials And Packaging (EMAP 2007) in Korea (Nov): Call for Papers - 9th Electronics Packaging Technology Conference (EPTC 2007) in Singapore (Dec): Call for Papers

We provide a ListServ email notification service; those who wish to subscribe will get a notice every three months, on the day the latest NEWSLETTER is posted on this site. For details, see our instructions.