CPMT NEWSLETTER for DECEMBER 2007

- Full Newsletter (1.2 MB) INDEX to individual PDFs - VP-Pub'ns Column: Paul Wesling - Officers & Chairs Listing - CPMT Society News     - Results of Officers Election     - Report on November Board meeting - Nominations for CPMT Awards - Fellows Nom Process; List of Fellows - Senior Mem Process; new Senior Members - Recognition: Kitty Pearsall - Chapter Reports: Singapore, UK&Ireland - Conference Reports:     - EDAPS in Taipei, Taiwan     - ASTR in Washington, DC USA     - FDIP in Atlanta, GA USA     - 3D System Integration in Munich, Germany     - AWASI in Bari, Italy     - Systems Packaging Workshop in Hakone, Japan - Report: TC on Electrical Contacts, Holm Conference

DECEMBER 2007 NEWSLETTER (continued) UPCOMING CONFERENCES: - Mar 16-20: Semiconductor Thermal Modeling, Measurement and Management Symposium (SEMI-THERM 24), San Jose, CA USA - May 7-11: Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008), Freiburg, Germany - Apr 20-23: International Spring Seminar on Electronics Technology (ISSE 2008), Budapest, Hungary - May 12-15: IEEE Workshop on Signal Propagation on Interconnects (SPI 2008), Avignon, France - May 27-30: 58th Electronic Components and Technology Conference (ECTC 2008), Orlando, FL USA - May 28-31: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM 2008), Orlando, FL USA - June 10-12: International Conference on Electronics Packaging (ICEP 2008), Tokyo, Japan CALLS FOR PAPERS: - June 8-11: IEEE Semiconductor Wafer Test Workshop (SWTW 2008), San Diego, CA USA (Due March 14) - July 28~31: International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Shanghai, China (Due April 11) - Aug 10-14: Intersociety Conference on Portable Information Devices (PORTABLE 2008), Jyvaskyla, Finland (Due March 15) - Aug 17—22: IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008), Garmisch-Partenkirken, Germany (Due March 15) - Sept 1-4: Electronics System-Integration Technology Conference (ESTC 2008), London UK (Due March 15) - Oct 1-3: Workshop on Accelerated Stress Testing & Reliability (ASTR), Portland, OR USA (Due April 28) - Nov 4-6: International Electronics Manufacturing Technology Symposium (IEMT 2008), Penang, Malaysia (Due April 15) - Dec 9-12: 10th Electronics Packaging Technology Conference (EPTC 2008), Singapore (Due May 15) - Dec 14-16: Electrical Design of Advanced Packaging and Systems (EDAPS 2008), Seoul, Korea (Due July 31) See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers. Non-members are welcomed to subscribe to this quarterly e-NEWSLETTER -- information

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