CPMT NEWSLETTER for MARCH 2008

- Full Newsletter (1 MB) INDEX to individual PDFs - President's Column: Society review - Officers & Chairs Listing - CPMT Society News     - Changes to the Constitution and Bylaws - IEEE Mentoring Program - Member Recognition: CP Wong - Chapter Reports: Singapore, UK&Ireland - Student Chapter Report: Chalmers Univ. - Conference Report: ECTC and Prof Dev Courses - Upcoming Conferences: 2008/2009     - with links to all conference web pages - Conference Announcements:     - ESTC in London, U.K.     - POLYTRONIC/PORTABLE 2008, in Garmish-Partenkirchen, Germany     - CFP: IEMT Symposium in Penang, Malaysia     - CFP: IMPACT/EMAP in Taipei, Taiwan     - CFP: VLSI Packaging Workshop in Japan, Kyoto     - CFP: EPTC in Singapore     - CFP: ThETA in Cairo, Egypt

MARCH 2008 NEWSLETTER (continued) UPCOMING CONFERENCES: - May 12-15: IEEE Workshop on Signal Propagation on Interconnects ((SPI 2008), Avignon, France - May 27-30: 58th Electronic Components and Technology Conference (ECTC 2008), Lake Buena Vista, Florida USA - May 28-31: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM 2008), Lake Buena Vista, Florida USA - June 8-11: 18th IEEE Semiconductor Wafer Test Workshop (SWTW 2008), San Diego, CA USA - June 10-12: Int'l Conference on Electronics Packaging (ICEP 2008), Tokyo, Japan - July 28~31: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Shanghai, China - August 10-14: PORTABLE 2008 with 7th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008), Garmisch-Partenkirken, Germany - September 1-4: Electronics System-Integration Technology Conference (ESTC 2008), London, UK - September 24-26: 4th International Workshop on Thermal Inverstigations of ICs and Systems (THERMINIC), Rome, Italy - October 1-3: 2008 Workshop on Accelerated Stress Testing & Reliability (ASTR), Portland, OR USA - October 27-29: 54th IEEE Holm Conference on Electrical Contacts (HOLM 2008), Orlando, FL USA CALLS FOR PAPERS: - October 22-24: Joint Event: 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, with the 10th International Conference on Electronics Materials and Packaging (EMAP), Taipei, Taiwan (Due May 31) - November 4-6: 33rd International Electronics Manufacturing Technology Symposium (IEMT 2008), Penang, Malaysia (Due June 15) - December 1-2: 9th VLSI Packaging Workshop in Japan (VPWJ 2008), Kyoto, Japan (Due May 31) - December 9-12: 10th Electronics Packaging Technology Conference (EPTC 2008), Singapore (Due June 15) - December 10-12: Electrical Design of Advanced Packaging and Systems (EDAPS 2008), Seoul, Korea (Due July 31) - June 14-17, 2009: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy (Due Dec 31) See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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