CPMT NEWSLETTER for JUNE 2008

Full Newsletter (1.6 MB) INDEX to individual PDFs: - President's Column - Officers, Committee Chairs - VP-Publications Column - CPMT Society News - Awards: Paul Totta, Karl Puttlitz - Call for Nominations: BOG - Chapters, Student Chapters - Conference reports:       - ECTC, 3D System Integration, Green Electronic Packaging, ITHERM - Conference Calendar: 2008/2009 - Conference Announcements:   - ESTC in London, U.K.   - Electronics Goes Green in Berlin, Germany   - POLYTRONIC/PORTABLE 2008, in Garmish, Germany   - Accelerated Stess Testing in Portland, OR USA   - Elec Design of Adv Packaging & Systems in Korea   - EDAPS and FDIP in San Jose, CA USA   - CFP: ECTC'09 in San Diego, CA USA   - Emerging Device & Pkg Tech in Phoenix, AZ USA   - IEMT Symposium in Penang, Malaysia   - CFP: SEMI-THERM in San Jose, CA USA   - IMPACT/EMAP in Taipei, Taiwan   - ThETA in Cairo, Egypt

JUNE 2008 NEWSLETTER (continued) UPCOMING CONFERENCES: - July 28~31: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Shanghai, China - August 10-14: PORTABLE 2008 with 7th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008), Garmisch-Partenkirken, Germany - September 1-4: Electronics System-Integration Technology Conference (ESTC 2008), London, UK - September 24-26: 4th International Workshop on Thermal Inverstigations of ICs and Systems (THERMINIC), Rome, Italy - October 1-3: 2008 Workshop on Accelerated Stress Testing & Reliability (ASTR), Portland, OR USA - October 22 - 24: Joint Event: 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, with the 10th International Conference on Electronics Materials and Packaging ((EMAP), Taipei, Taiwan - October 27-29: 54th IEEE Holm Conference on Electrical Contacts (HOLM 2008), Orlando, FL USA - October 27-29: Electrical Performance of Electronic Packaging (EPEP 2008), San Jose, CA USA - November 4-6: 33rd International Electronics Manufacturing Technology Symposium (IEMT 2008), Penang, Malaysia - December 1-2: 9th VLSI Packaging Workshop in Japan (IEMT 2008), Kyoto, Japan - December 9-12: 10th Electronics Packaging Technology Conference (EPTC 2008), Singapore CALLS FOR PAPERS: - December 10-12: Electrical Design of Advanced Packaging and Systems (EDAPS 2008), Seoul, Korea (Due July 31) - December 17–20: 2nd Int'l Conference on Thermal issues in Emerging Technologies, Theory and Applications (ThETA2), Cairo, Egypt (Due July 31) - June 14-17, 2009: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy (Due Dec 31) See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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