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CPMT NEWSLETTER for JUNE 2008

We invite you to download the full June CPMT Society NEWSLETTER, or any of the individual stories listed below. Circulate key articles and announcements to your co-workers.

Full Newsletter (1.6 MB)

INDEX to individual PDFs:
- President's Column

- Officers, Committee Chairs

- VP-Publications Column

- CPMT Society News

- Awards: Paul Totta, Karl Puttlitz

- Call for Nominations: BOG

- Chapters, Student Chapters

- Conference reports:
      - ECTC, 3D System Integration, Green Electronic Packaging, ITHERM

- Conference Calendar: 2008/2009

- Conference Announcements:
  - ESTC in London, U.K.
  - Electronics Goes Green in Berlin, Germany
  - POLYTRONIC/PORTABLE 2008, in Garmish, Germany
  - Accelerated Stess Testing in Portland, OR USA
  - Elec Design of Adv Packaging & Systems in Korea
  - EDAPS and FDIP in San Jose, CA USA
  - CFP: ECTC'09 in San Diego, CA USA
  - Emerging Device & Pkg Tech in Phoenix, AZ USA
  - IEMT Symposium in Penang, Malaysia
  - CFP: SEMI-THERM in San Jose, CA USA
  - IMPACT/EMAP in Taipei, Taiwan
  - ThETA in Cairo, Egypt

JUNE 2008 NEWSLETTER (continued)

UPCOMING CONFERENCES:
- July 28~31: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Shanghai, China

- August 10-14: PORTABLE 2008 with 7th Int'l IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (POLYTRONIC 2008), Garmisch-Partenkirken, Germany

- September 1-4: Electronics System-Integration Technology Conference (ESTC 2008), London, UK

- September 24-26: 4th International Workshop on Thermal Inverstigations of ICs and Systems (THERMINIC), Rome, Italy

- October 1-3: 2008 Workshop on Accelerated Stress Testing & Reliability (ASTR), Portland, OR USA

- October 22 - 24: Joint Event: 3rd International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) Conference, with the 10th International Conference on Electronics Materials and Packaging ((EMAP), Taipei, Taiwan

- October 27-29: 54th IEEE Holm Conference on Electrical Contacts (HOLM 2008), Orlando, FL USA

- October 27-29: Electrical Performance of Electronic Packaging (EPEP 2008), San Jose, CA USA

- November 4-6: 33rd International Electronics Manufacturing Technology Symposium (IEMT 2008), Penang, Malaysia

- December 1-2: 9th VLSI Packaging Workshop in Japan (IEMT 2008), Kyoto, Japan

- December 9-12: 10th Electronics Packaging Technology Conference (EPTC 2008), Singapore

CALLS FOR PAPERS:
- December 10-12: Electrical Design of Advanced Packaging and Systems (EDAPS 2008), Seoul, Korea (Due July 31)

- December 17–20: 2nd Int'l Conference on Thermal issues in Emerging Technologies, Theory and Applications (ThETA2), Cairo, Egypt (Due July 31)

- June 14-17, 2009: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy (Due Dec 31)

See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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