SEPTEMBER 2008 NEWSLETTER (continued)
UPCOMING CONFERENCES:
- November 13: 2nd Int’l Symposium on Photonic Packaging, Munich, Germany
- December 1-2: 9th VLSI Packaging Workshop in Japan, Kyoto, Japan
- December 9-12: 10th Electronics Packaging Technology Conference (EPTC 2008), Singapore
- December 10-12: Electrical Design of Advanced Packaging and Systems (EDAPS 2008), Seoul, Korea
- December 17-20: 2nd Int'l Conference on Thermal issues in Emerging Technologies, Theory and Applications (ThETA 2008), Cairo, Egypt
- February 2-4: 2009 European Systems Packaging Workshop (ESPW), Kinsale, Ireland
- February 2-5: 8th Annual FLEXIBLE Electronics & Displays Conference & Exhibition, Phoenix, AZ, USA
- March 15-19: 2009 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 25), San Jose, CA USA
- April 1-3: Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 25), Rome, Italy
- May 25-29: 59th Electronic Components and Technology Conference (ECTC 2009), San Diego, CA USA
CALLS FOR PAPERS:
- April 14-16: International Conference on Electronics Packaging (ICEP), Kyoto, Japan (Due Nov. 15)
- April 26-29: 10th Int'l Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Delft, The Netherlands (Due Nov. 15)
- May 12-15: Workshop on Signal Propagation on Interconnects (SPI), Strasbourg, France (Due Feb. 7)
- June 14-17: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy (Due Dec 31)
- June 25-26: IEEE International Workshop on Advances in Sensors and Interfaces (IWASI'09), Trani, Italy (Due Feb 28)
- Sept. 14-16: 2009 IEEE Holm Conference on Electrical Contacts (Holm 2009), Vancouver, BC, Canada (Due Jan 9)
See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.
