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Full Newsletter (800 kB)
INDEX to individual PDFs:
- President's Column: The Nobel Prize
- Officers, Committee Chairs
- Society news: Awards, GOLD
- Conference News: EPTC, SIITME, Flex
- Chapter News: Singapore, Saratov/Penza, Finland, SJSU Students
- Papers from Recent Conferences: ECTC, EMPC, ICEPT, SPI, more
- Upcoming conferences/events:
- Electronic Packaging Technology Conference (EPTC 2009)
- CFP: IEEE CPMT Symposium Japan
- CFP: Advanced Packaging Materials Conference (APM)
- CFP: Electronic Systemintegration Technology Conference (ESTC 2010)
- CFP: Signal Propagation on Interconnects (SPI 2010)
- Faculty Positions: Univ of Utah (Packaging)
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SEPTEMBER 2009 NEWSLETTER (continued)
UPCOMING CONFERENCES:
- Dec. 1-3: 11th Electronic Materials and Packaging Conference (EMAP 2009), Penang, Malaysia
- Dec. 2-4: 2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China
- Dec. 9-11: 2009 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore
- Feb. 21-25: 26th Thermal Measurement, Modeling and Management Symposium (SEMI-THERM 2010), Santa Clara, CA
- April 25-28: Int'l Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems (EuroSimE 2010), Bordeaux, France
- June 1-4: 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, NV
- Sept 13-16: Electronics System-Integration Technology Conference (ESTC 2010, Berlin, Germany
See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.
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