Advance
Program
2004 Systems Packaging Japan Workshop
Hotel
de YAMA, Hakone
January
30,
Monday to February 1, Wednesday, 2006
January 29, Sunday
Evening (18:00 --
19:30): Registration
January 30, Monday
Morning (9:00 --
10:00): Registration
(10:00 --
10:10)
Opening
Remarks
(10:10 --
12:00)
Keynote Session
Chair: Fumiyuki
Kobayashi (Hitachi)
Co-Chair: Erich Klink
(IBM Germany)
Chip Innovations & Market Convergence (Tentative)
Tsugio Makimoto (TechnoVision, and
former Corporate Advisor at Sony)
Technology Challenges for High-density
Power Supplies for Computer/Telecom Applications
Milan Jovanovic (Delta)
Evolution of Mainframe Technologies
& Future Challenges for
High Performance Computing Systems
Vijay Lund (IBM USA)
Group Photo
Lunch
Afternoon (13:00 --
18:20)
Session 1:
Communication Systems
Chair: Tohru Kishimoto
(NTT)
Co-Chairs:
Seiichi
Saito (Mitsubishi)
Robert Pfahl
(iNEMI)
Leonard Schaper (U. of Arkansas)
Integrated Optical Waveguides for
Board-to-Board Interconnect
Yoichi Taira (IBM Japan)
A Compact Triplexer Using a PLC Platform
for 3-Wavelength Multiplexing Systems
Keisuke Yamamoto (NEC)
Technologies
for Hardware & Software
Reconfigurable Radios
Eric Beyne (IMEC)
The Design of an Optimal RF System within a
Packaging Solution
Chris Barratt (Insight SiP)
Coffee Break
10 Gb/s Signal Transmission Using a
Backplane for Communication Equipment
Shinji Tanabe (Mitsubishi Electric)
Development of Applications for
Multi-Gb/s CMOS High-speed Interfaces (Tentative)
Hirotaka Tamura (Fujitsu)
Session
2: Automotive & Robotics
Chair: Yoshitaka Fukuoka
(WEISTI)
Co-Chair: Cian
Ó Mathúna (Tyndall National Institute - Ireland)
The Development of Eliica, a
High-performance Electric Vehicle
Kikuo Emoto (Keio University)
Packaging Technolgy for Automobiles
Takashi Nagasaka (Denso)
High Heat-dissipation Packaging Technology
for Automotive ECUs
Masahide Harada (Hitachi)
A 3-D SiP Solution for a Humanoid Robot
Takao Fujitsu (J-SiP)
Evening (19:00 --
21:30)
Special
Dinner Session
Dinner Talk
The Packaging Workshop Over Time: a
History of Learning and Camaraderie
Evan Davidson (IEEE)
After
Dinner Entertainment
Edo-Daikagura:
A kimono-clad male juggling all sorts of things!
(See photo of
juggler)
January 31, Tuesday
Morning (8:00 --
12:10)
Session 3: Digital Consumer Products & Mobile Information Systems
Chair: Yuzo Shimada (NEC)
Co-Chairs: Yutaka
Tsukada
(Kyocera SLC)
Aroon Tungare
(Motorola)
Miniaturization
Technologies for Handheld Communication Devices
Aroon Tungare (Motorola)
System Packaging Design for the Cell
Processor
Tadashi Ishikawa (Toshiba)
Ultra-thin Packaging Technologies for
the
World's Thinnest Mobile Phone
Toshinobu Ogatsu (NEC)
LTCC RF/Digital Module Using Embedded
Decoupling Capacitors
Yunhwi Park (Samsung)
Coffee
Break
Evolving LTCC Technologies for
Wireless Communications
Chihiro Makihara (Kyocera)
Mobile Phone Technology & Business
Trends
Yoshikatsu Nakagawa (Nokia Japan)
Session 4: High Performance Servers
Chair: Haruhiko
Yamamoto (Fujitsu)
Co-chair: George
Katopis (IBM USA)
System Packaging & Technology for
the IBM High-end Z9 Server
Hubert Harrer (IBM Germany)
Thermal Management for a Fujitsu
High-end Server
Jie Wei (Fujitsu)
Lunch
Afternoon (13:00 --
14:30) -- Session 4 (continued)
Packaging
Technology for the NEC SX-8
Supercomputer
Toshiharu Sobue (NEC)
Hardware
Technology for the SR-11000 Computer
Akio Idei (Hitachi)
Packaging Challenges & Performance
Achievments of the
Blue Gene Supercomputer System
George Chiu (IBM USA)
Coffee Break
(14:40 -- 18:20)
Session
5: Fundamental Components:
Support for Systems
Chair:
Michitaka
Kimura (Renesas)
Co-chairs: Robert
Guernsey (IBM USA)
Rolf Aschenbrenner (Fraunhofer IZM)
System Package Technology
Demands to Support Multi-core Chips &
Packages and the Gigabit Signals that Feed Them
Dale Becker (IBM USA)
Solder Electromigration in Flip-chip
Joints
Kimihiro Yamanaka (Kyocera SLC)
Server AC/DC Power Supply Market
Trends and their Development Focus
J. S. Huang (Delta)
GHz High-speed Transmission &
Power/Ground Characteristics of Flip-chip BGA Packages
Kazuyuki Nakagawa (Renesas Technology)
Break
Two-terabyte
Memory System Packaging
Edmund Blackshear (IBM USA)
Polymer Composite Containing Ag
Nano-particles & their Photoinduced
Catalytic Effect for Printing Electronics on 3-D Mechanical Parts
Kenichi Hashizume (Nokia NRC)
Magnetics on Silicon for a Power
Supply-on-Chip
Cian
Ó Mathúna (Tyndall National Institute - Ireland)
Evening (18:20 --
21:30)
Banquet
Banquet Speech
Recent Topics in Brain Science and its
Influence on Education (Tentative)
Hideaki Koizumi (Hitachi)
February
1, Wednesday
Morning (8:00 --
10:10) -- Session 5 (continued)
Innovation Priorities for 2015
Robert Pfahl (iNEMI)
First Results for the
European Project: "Hiding Dies"
Rolf Aschenbrenner (Fraunhofer IZM)
SiP Solutions for the Products of
Today & Tomorrow
Jan Vardaman (TechSearch)
3-D
Electronics
Leonard Schaper (U. of Arkansas)
Closing
Remarks
Technical Tour (11:00
-- 18:00)
A
technical tour to Hitachi's Central
Research Labs in Tokyo is
scheduled for those that wish to participate. Lunch will be provided to
those on the bus.
At the
end of the tour,
the bus will drop people off at the follow points: Kokubunji or
Shinjuku Stations on the JR Chuo Line and the Century Hyatt Tokyo
Hotel in Shinjuku.
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