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"2010 SPJW" CALL FOR PAPERS"
2010 IEEE Systems Packaging Japan Workshop, Kyoto, Japan
January 25- 27, 2010


Dear Colleagues and Friends,
We would like to invite you to submit a presentation and participate to the upcoming 2010 SPJW "Systems Packaging Japan Workshop" that will be held in Kyoto, Japan on January 25 27, 2010.

SCOPE
In recent years, technological progress in packaging design and materials has become critical to allow the operation of systems at higher frequencies and obtain better performance. This workshop is held every other year and 2010 SPJW will be the thirteenth one since the first meeting, then called "IEEE Japan Computer Packaging Workshop", was held in 1986. State-of-the- art technologies in all areas of systems packaging, ranging from LSI packages to super high performance system, will be covered. In presentations during the Workshop, the discussion time will be arranged to allow interactive and frank exchange among participants, with room for questions and answers. The Workshop official language is English and the special features are as follows:
TOPICS
(1) MEMS
(2) Environmental Aspects
(3) High Speed Signal Integrity
(4) Digital Consumer Products & Mobile Information Systems, IT Network Systems
(5) Advanced Packaging and Components
(6) High Performance Servers
(7) Advanced Materials

IMPORTANT DATES
Abstract submission: Nov. 20, 2009
Registration: Dec. 4, 2009 (Fee : ¥48,000 )

VENUE
"Mielparque Kyoto" which is close to the JR Kyoto station (Central exit)
Hotels near "Mielparque Kyoto" can be reserved at the WEB. http;www***** (T.B.D)
 
ORGANISERS
General Chair: Seiichi Saito, Mitsubishi Electric Corporation
Co-General Chair: Michitaka Kimura, Renesas Technology Corp.
Vice General Chair: Shigeyuki Ogata, Oki Printed Circuit Co., Ltd.,
Program Chair: Yoichi Taira, IBM Japan Co.,Ltd
Treasurer: Hideki Ohashi, Mitsubishi Electric Corporation

Japanese Committee:
Yoshitaka Fukuoka,WEISTI
Yuzo Shimada, NEC Patent Service, Ltd
Tohru Kishimoto, NTT Advanced Technology
Yutaka Tsukada, i-Packs
Kenji Terada, Kyocera SLC Technologies Corp.
Ryoji Ninomiya, Toshiba Corporation
Hiroshi Go, Hitachi Ltd
Haruhiko Yamamoto, Fujitsu ICT, Ltd
(Kishio Yokouchi, Fujitsu ICT, Ltd )
Secretariat (Mitsubishi Electric Corporation)
Kouichiro Misu
 Tamotsu Nishino
Keitaro Yamagishi

US/European/Asian Committe
George A. Katopis, IBM Corporation
Robert C. Pfahl, National Electronics Manufacturing Initiative
Thomas-Michael Winkel, IBM Germany
Rolf Aschenbrenner, Fraunhofer IZM.
Eric Beyne, IMEC
Ricky Lee, The Hong Kong University of Science and Technology
Kim, Seo Young, Korea Institute of Science and Technology
Shlomo Novotny, Vette Corp.
Carlo Cognetti, STMicroelectronics
Stefano Oggioni, IBM Italy
Christian Schuster, Technical University Hamburg-Harburg (TUHH)
For Inquires contact: Tamotsu Nishino  at Mitsubishi Electric Corporation
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