2001 Montréal EMC Symposium Demonstrations and a “Call for Experiments” for the 2002 Minneapolis EMC Symposium
	By Andy Drozd, Vice Chair, EMC Society Education and Student Activities Committee

Mike Slocum (left) of the Naval Surface Warfare Center in Dahlgren, Virginia is all smiles on the third and final day of the demonstrations held during the EMC Symposium in Montréal. Dan Merriam of Eastman Kodak (right) appreciated Mike’s enthusiasm for the innovative mode stirred chamber he was demonstrating.

The Big Picture

The winning formula for this year’s experiment demonstrations session in Montréal was one part diversity of topics, one part first-rate presentations, and one part super location. Our thanks to Benoît Nadeau of Matrox and the Montréal Symposium steering committee for arranging an ideal venue within the main Exhibit area of the Palais des Congrès de Montréal and for providing all the logistical support on behalf of the demonstrations. Complementing the hardware experiments for the first time this year was a suite of interactive computer modeling and simulation demonstrations conducted over the three main days of the Symposium. We adapted the tried and true format used for the experiments to launch this new special session aimed at demonstrating computational electromagnetics (CEM) problem solving methods for EMC. The EMC Society Education and Student Activities Committee sponsored both events, held in parallel.

Greg Brox of Enterasys Networks, Bob Martin of Intertek Testing Services, and Len Carlson of NW Emetek Services (L-R) are shown in the demonstrations area. Bob provided a demonstration entitled “Methods of Doing ESD and Conducted Immunity Tests.”	Marina Koledintseva (center), a visiting Associate Professor with the University of Missouri-Rolla, got a hands-on demonstration tutorial from the father and son team of Richard (left) and Pierre Briet (right). Richard, of LT-MP Applications, presented “The Grounded Franklin Rod: How it Does and How it Does Not Work.”	New to the Demonstrations format this year were computer modeling and simulation demonstrations covering a range of subassembly to large, complex system-level EMC concerns. Colin Brench (seated) of Compaq Computer Corporation provided a demonstration entitled “Gaining an Insight into Complex Coupling Phenomena Through the Use of Modeling” for Paul Cook of Alpha EMC Inc.

We are approaching our 10th year of conducting the experiment demonstrations. The experiments helped raise awareness of engineers to the importance of implementing good EMC design and measurement practices and provided keen insights into electromagnetic phenomena and effects. We expect the modeling and simulation demonstrations to achieve the same results.

This year we had a group of new presenters and demonstrations covering a broad range of topics related to the measurement of cable crosstalk and interference, noise suppression techniques on PCBs, enclosure shielding, lightning and transient effects, and power bus noise. This year’s agenda consisted of 23 experiments. Some were partially based on the EMC Society Education Committee’s EMC Experiments and Demonstrations Manual, Volume 1 originally compiled and reviewed by Clayton Paul and Henry Ott (a PDF version of this document can be downloaded from the IEEE EMC Society Web Site at www.emcs.org). Contributions this year included:

Parasitic Effects in Circuit Elements and the Effect on Signal Spectra by Clayton Paul of Mercer University’s School of Engineering, Macon, GA

Canned Shielding by James Muccioli of X2Y Attenuators, LLC, Farmington Hills, MI

Shielding Effectiveness Compromised by Bill Duff of the Sentel Corporation, Alexandria, VA

Surge and Lightning Suppression Fundamentals by Norman Violette of Violette Engineering Corporation, McLean, VA and Mike Violette of Washington Laboratories, Gaithersburg, MD

Reducing ESD Effects on a Timing Circuit by Ahmad Fallah of CIENA CSD, Cupertino, CA (experiment originally developed under the supervision of Dr. Robert Nelson from North Dakota State University)

Reactive Terminations on Transmission Lines and Developing Lumped Element Models for Parasitics Using Time Domain Reflectometry by Xiaoining Ye of the University of Missouri, Rolla, MO and the Intel Enterprise Architecture Labs (EAL), Hillsboro, OR

Circuit and Transmission Line Characterization and Signal Integrity Issues for Traces within PCBs by Mark Montrose of Montrose Compliance Services, Inc., Santa Clara, CA

Static to Dynamic Field Converter by Doug Smith of DC Smith Consultants, Los Gatos, CA

EMI Prediction of Rectangular and Trapezoidal Pulse Signals by John Flinn of Lockheed Martin Systems Integration, Owego, NY

Electromagnetic Leakage Through Seams by Ron Brewer of Laird Technologies, Delaware Water Gap, PA

Non Ideal Behavior of Capacitors by Elya Joffe of KTM Project Engineering, Ltd., KFAR Sava, Israel

How Parasitic Effects in Inductors and Capacitors Affect Electrical Equipment by James J. Whalen, Department of Electrical Engineering, University of New York at Buffalo, Buffalo, NY

Electromagnetic Field Containment Using the Principle of Self Shielding by Thomas Van Doren

Lightning Effects by Fred Heather of the Naval Air Warfare Center, Patuxent River, MD

Product Safety and the Use of EMC Techniques to Evaluate the 30-Amp Ground Continuity Test by Richard Georgerian of Carrier Access Corporation, Boulder, CO and Ron Duffy of Agilent Technologies, Inc., Colorado Springs, CO

Methods of Doing ESD and Conducted Immunity Tests by Robert Martin of Intertek Testing Services NA, Inc., Boxborough, MA

An Innovative Mode Stirred Chamber by Mike Hatfield of the Naval Surface Warfare Center, Dahlgren, VA

Immunity Testing of Electronic Systems Using an Impulse Noise Source and the Effects of Electrostatic Discharge on Electronic Systems by Fumihiko Mitani, Masaharu Tsukada and Goh Furukawa of Noise Laboratory Co. Ltd., Kawasaki, Kanagawa City, Japan

Fundamentals of Noise Coupling in Cables by Lee Hill of Silent Solutions LLC, Amherst, NH

PCB Power Bus Behavior by Randall Vaughn of Silent Solutions LLC, Amherst, NH

Effects of Component Lead Lengths and Grounding Aspects in Filter Designs by Greg Snyder of Washington Laboratories, Ltd, Gaithersburg, MD

The Grounded Franklin Rod: How it Does and How it Does Not Work by Richard Briet of LT-MP Applications, Cypress, CA.

These experiments concentrated on issues pertaining to printed circuit boards, equipment, and subassembly EMC by implementing good design practices and effectively measuring radiated and conducted electromagnetic emission/immunity characteristics.

Additionally, we had demonstrations given on site by the winners of the Student Design Competition, also sponsored by the Education and Student Activities Committee. The 2001 winners were Richard Chairez, Gaurav Khalsa, and Cynthia Abundabar of the ECE Department at California State University, Chico, CA and Christos Kinezos of the ECE Department at Florida Atlantic University, Boca Raton, FL. The objective of the competition was to develop the best solution to a standardized broadband EMI problem using a design kit while maintaining the capability to perform required electronic functions for the 100 kHz to 100 MHz frequency range.

Whereas the experiment demonstrations mainly addressed important sub-unit level issues, the computer modeling and simulation demos covered a range of subassembly to large, complex system-level EMC concerns.

The computer demonstrations are meant to illustrate the application of practical EMC modeling approaches and simulation techniques to simple canonical-type problems to show how EMC problems are analytically solved. These include the application of discrete analytical models as well as rigorous numerical techniques based on the moment method (MoM), uniform theory of diffraction (UTD) and variations on the asymptotic ray tracing method, finite difference time-domain (FDTD), finite element modeling (FEM), transmission line (TL) theory, and other approaches. The computer demonstrations were conducted using general-purpose university codes and several commercial programs. The presenters were permitted their choice of computer codes, tools, or techniques for the demos. (Note: the IEEE EMC Society does not endorse the use of any particular software code, tool, or technique used in the demonstrations, and commercial presentations or endorsements of any type were strongly discouraged.) The emphasis was on demonstrating the efficacy of analytical, computer-based problem solving methodologies.

The premiere agenda of modeling and simulation demos included:

Shielding Effectiveness Simulation Using the FDTD Method by Bruce Archambeault of IBM, Research Triangle Park, NC

Modeling the Shielding Effectiveness of Metallic Enclosures With Slots Using Integral Equation Techniques by Ulrich Jakobus of Electromagnetic Software & Systems (EMSS), Stellenbosch, South Africa

Understanding the Physics of Radiation Through Apertures, Gaskets and Joints by Omar M. Ramahi of University of Maryland, Department of Mechanical and Electrical Engineering, College Park, MD

Large Complex System Analysis from Static to Microwave Frequencies by Using MLFMA by Weng Chew, Jun-Sheng Zhao (Presenter), T. J. Cui, J. M. Song, H. Y. Chao and Y. C. Pan of the Center for Computational Electromagnetics, Electromagnetics Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL System-Level EMC Analysis by David Johns of Flomerics, Ltd., Southborough, MA

System-Level EMC Antenna Coupling Analysis for Large, Complex Structure Topologies Using A Multi-Fidelity Modeling and Simulation Method by Andy Drozd and Irina Kasperovich of ANDRO Computational Solutions, Rome, NY

Modeling of Simultaneous Switching Noise in High Speed Systems by Sungjun Chun and Madhavan Swaminathan of Georgia Institute of Technology, Atlanta, GA

Simulation of Heat Plate Radiation Using the Method of Moments (MoM) by Toshihiko Matsuura of Fujitsu Ltd., Chiba, Japan

Power Bus Resonance and Associated EMI Simulations for PCBs by Z. L. Wang, O. Wada, A. Namba, T. Watanabe, Y. Toyota and R. Koga of the Communication Network Department, Okayama University, Japan

EMC Simulation Techniques for Printed Circuit Boards by Al Wexler, President of Quantic EMC Inc., Winnipeg, Manitoba, Canada

Simulations to Aid Hospitals in Evaluating Wireless EMC Interaction Risks by Glenn Kuriger of the Wireless EMC Center, University of Oklahoma, Norman, OK

Demonstration of Power and Ground Voltage Fluctuations and Effects of Decoupling Capacitors on PCBs by Jiayuan Fang of Sigrity, Inc., Santa Clara, CA

FDTD Modeling of DC Power-Bus with Dispersive Media and SMT Components by Xiaoning Ye, Intel Enterprise Architecture Labs (EAL), Hillsboro, OR

Real-Time Calculation and Plotting of 2-D or 3-D Theoretical NSA Calculations by Manny Barron of Tandem EMC Laboratory, Compaq Computer Corporation, Cupertino, CA

Emitter Threat Analysis and Reporting by Fred Heather of the Naval Air Warfare Center Aircraft Division, Patuxent River, MD

FEM Analysis of Printed Circuit Board Signal Coupling by John Howard, EMC Consultant, Sunnyvale, CA

Demonstrating the Necessity of Model Validation for Electromagnetic Codes by Maqsood Mohd of Sverdrup Technology, Eglin AFB, FL

Printed Circuit Board Edge Effects by Franz Gisin of the EMC/Signal Integrity Department, Sanmina Corporation, San Jose, CA and Zorica Pantic-Tanner of the School of Engineering, San Francisco State University, San Francisco, CA

Simple Visualization of Fields in Radiated Test Sites by David Mawdsley of Laplace Instruments, Ltd. North Walsham, Norfolk, UK

Characterization and Optimization of 3D-TEM Cells by Jean Rioult and Marco Klingler of INRETS-LEOST — France, Branko Kolundzija of the University of Belgrade, Yugoslavia and Tapan Sarkar of Syracuse University, Syracuse, NY

Simulation of EMC Chambers Behavior at Low Frequency by José Basterrechea Verdeja of the Dpto. Ingeniería de Comunicaciones, Universidad de Cantabria

Gaining an Insight into Complex Coupling Phenomena Through the Use of Modeling by Colin Brench of Compaq Computer Corporation, Marlborough, MA

DC Power Bus Modeling with CEMPIE, a (Cp, L, MLD) PEEC Method by Jun Fan of NCR, San Diego, CA.

Once again, our thanks go out to each of the presenters for their skilled tutorials and for contributing to the overall success of the demonstrations.

Acknowledgements

We are indebted to the behind the scenes supporters who helped coordinate and make the detailed arrangements for this year’s experiment demonstrations. Included are Larry Cohen of NRL, Greg Snyder and Mike Violette of Washington Laboratories, and Howie Mende of the Defence Research Establishment Ottawa who in team fashion helped to schedule the experiments and acquire or supply the various test stands and other hardware. We are also very grateful to Tektronix, Rohde & Schwarz, Advantest, Agilent/Hewlett-Packard, KeyTek, and Schaffner for providing the oscilloscopes, spectrum and network analyzers, EMI receivers, signal and function generators, meters and probes, and other hardware for the demonstrations. I say it every year, but it’s a fact that we cannot have a successful event without the cooperation of these organizations. We appreciate it folks!

Call for Experiments

We have already begun planning for the 2002 IEEE International Symposium on EMC in Minneapolis. We are in the process of soliciting a Call for Experiments in an attempt to identify novel ideas. If you have ideas for an experiment and want to have it considered, please visit the EMC Society home page at www.emcs.org and follow the Call for Experiments link. Our goal is to establish a preliminary agenda of experiments by December 2001. Although not a requirement, we are interested in scheduling experiment demonstrations that may have a modeling and simulation or technical paper session counterpart. EMC

Return to contents

© Copyright 2001, IEEE. Terms & Conditions. Privacy & Security