Following are abstracts of papers from
previous EMC symposia, related conferences, meetings and
publications.
EMCABS COMMITTEE
Bob Hunter, Consultant
r.d.hunter@ieee.org
Sha Fei, EMC Research Section, Northern Jiatong
University, Beijing, China
emclab@center.njtu.edu.cn
Ferdy Mayer, 7, rue Paul Barruel, F-75015 Paris, France
ferdymayer@free.fr
Maria Sabrina Sarto, Department of Electrical Engineering,
University of Rome, Italy
sarto@elettrica.ing.uniroma1.it
“How Can I Get a Copy of an Abstracted Article?”
Engineering college/university libraries, public libraries,
company or corporate libraries, National Technical Information
Services (NTIS), or the Defense Technical Information Center
(DTIC) are all possible sources for copies of abstracted
articles or papers. If the library you visit does not own
the source document, the librarian can probably request
the material or a copy from another library through interlibrary
loan, or for a small fee, you can order it from NTIS or
DTIC. Recently it became clear that EMCABs were more timely
than publications which were being listed in data files.
Therefore, additional information will be included, when
available, to assist in obtaining desired articles or papers.
Examples are: IEEE, SAE, ISBN, and Library of Congress identification
numbers.
As the EMC Society becomes more international, we will be
adding additional worldwide abstractors who will be reviewing
articles and papers in many languages. We will continue
to set up these informal cooperation networks to assist
members in getting the information or contacting the author(s).
We are particularly interested in symposium proceedings
which have not been available for review in the past. Thank
you for any assistance you can give to expand the EMCS knowledge
base. EMC |
EMCABS: 01-05-2006
EMC COMPUTER MODELING OF DISTRIBUTED WIRELESS SYSTEMS TO ASSURE
EFFICIENT UTILIZATION OF THE RF TRANSMISSION HYPERSPACE
A.L. Drozd
ANDRO Computational Solutions, NY, USA
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.9-14.
Abstract: New spectrum sharing techniques for assuring the EMC
of wireless systems have recently been investigated that enable
the joint utilization of all orthogonal electromagnetic (EM) transmission
resources, including, but not limited to time, frequency, geographic
space, modulation/code, and polarization. This multi-dimensional
environment is referred to as the Transmission Hyperspace (TH);
a term intended to convey the notion of a multidimensional resource
space in which each dimension allows orthogonality amongst users.
The challenges faced in the modeling and analyses of large-scale
TH-enabled problems are presented in terms of assigning an n-tuple
for the purpose of enhancing data throughput amongst a group of
intended transceivers. The key aspects of the TH for EMC and efficient
spectrum management are discussed. The TH approach is anticipated
to provide several orders of magnitude improvement in RF resource
utilization and aggregate data throughput.
Index terms: Computational electromagnetics, wireless system,
spectrum sharing.
EMCABS: 02-05-2006
DESIGN METHODOLOGY TO LIMIT ELECTROMAGNETIC COUPLING BETWEEN BOARD
TRACKS ON PCB LEVEL IN REAL TIME
+ A. Stadler, + M. Albach, + H. Roßmanith and ++ G. Schubert
+ University of Erlangen-Nuremberg, 91058 Erlangen, Germany
++ Conti-TEMIC Microelectronic GmbH, 90411 Nuremberg, Germany
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.65-68
Abstract: The paper describes a future trend of EMC simulation
on PCB level. The coupling of multi-conductor multi-layered transmission
lines in modern automotive control units is calculated in real
time during the layout process. Serving as an example, a tri-plate
structure with parallel planar microstrip lines is investigated.
A forward function is developed to calculate the coupling factor
between the microstrip lines. The data for all occurring configurations
is stored in a lookup table. The table is used to solve the inverse
electromagnetic problem. Forward and inverse functions are verified
and already proven in the industrial application.
Index terms: Automatic EMC, PCB, EM coupling.
EMCABS: 03-05-2006
THE THREAT OF INTENTIONAL ELECTROMAGNETIC INTERFERENCE (IEMI)
TO WIRED AND WIRELESS SYSTEMS
W.A. Radasky
Metatech Corporation, Goleta, California, USA
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.160-163.
Abstract: The threat of Intentional Electromagnetic Interference
(IEMI) has been presented and evaluated in conferences throughout
the world. This threat deals with the possibility that intense
electromagnetic disturbances may be delivered by criminals or
terrorists to the sophisticated electronic systems that are important
to our daily lives. This paper provides a summary of the EM threat,
a description of the types of threat generators that currently
exist, and a summary of the susceptibility levels of commercial
electronic equipment. This paper also describes the potential
impacts on both wired and wireless communications.
Index terms: High-power electromagnetics, intentional EMI, transients,
wireless systems.
EMCABS: 04-05-2006
SUSCEPTIBILITY OF SENSOR NETWORKS TO INTENTIONAL ELECTROMAGNETIC
INTERFERENCE
+J. Delsing, +J. Ekman, +J. Johansson, +S. Sundberg, ++M. Bäckström,
++T. Nilsson
+ Luleå University of Technology, Sweden
++ Swedish Defence Research Agency FOI, Sweden
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.172-175.
Abstract: It is reasonable to think that sensor networks might
be part of society critical systems in the future. Therefore,
this paper discusses and shows the vulnerabilities of sensor networks
to intentional electromagnetic interference (IEMI). Principle
ways of sensor network IEMI are addressed and followed by a discussion
on schemes for protection. Experimental results for both in-band
and ex-band interference from low- and high- level sources are
reported. It is obvious that more emphasis has to be put on sensor
networks susceptibility to IEMI, and in particular, more experimental
data is needed.
Index terms: Intentional EMI, susceptibility, sensor network.
EMCABS: 05-05-2006
A NEW ANALOG BEHAVIORAL MODULE LINKING FIELD AND PSPICE-CIRCUIT
SIMULATIONS FOR TRANSIENT ANALYSIS
+ H. Du, ++ D. Gorcea, +P.P.M. So and + W. J. R. Hoefer
+ University of Victoria, Victoria, BC, Canada
++ Flextronics, Ottawa, Ontario, Canada
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.246-249.
Abstract: This paper describes a new Analog Behavioral Module
(ABM) for two-port networks characterized by frequency domain
S-parameters. The proposed module has been implemented in the
PSPICE environment for transient circuit simulation. Comparing
the simulation results obtained with the ABM model and with the
original circuit has validated the accuracy of this model. This
approach can be used to build field-based device models for SPICE-based
circuit simulators.
Index terms: PSPICE device model, analog behavioral module, full-field
analysis.
EMCABS: 06-05-2006
A LECCS MODEL PARAMETER OPTIMIZATION ALGORITHM FOR EMC DESIGN
OF IC/LSI SYSTEMS
+ N. Funabiki, +Y. Nomura, +J. Kawashima, +Y. Minamisawa and ++
O. Wada
+ Okayama University, Okayama 700-8530, Japan
++ Kyoto University, Kyoto 615-8510, Japan
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.304-307.
Abstract: In this paper, we propose a parameter optimization algorithm
for EMC macro modeling of IC/LSI power currents called the LECCS
(Linear Equivalent Circuit and Current Source) model. The unnecessary
electro-magnetic wave from a digital electronics device may cause
the electromagnetic interference (EMI) to other apparatus. Thus,
its reduction has been regarded as one of the highest priority
issues in digital electronics device designs. In order to accurately
simulate high-frequency currents from power-supply sources that
are the primary sources of EMI, the LECCS model has been proposed
as a linear macro model of a power-supply circuit. A LECCS model
consists of multiple RLC-series circuits in parallel to represent
the equivalent circuit between the voltage source and the ground.
Given a set of measured impedances at various frequencies, our
proposed algorithm first finds the number of RLC-series circuits
corresponding to the number of valleys. Then, it searches optimal
values of RLC parameters by a local search method. The effectiveness
of our algorithm is verified through applications to a real system,
where the accuracy and the required processing time by our algorithm
are compared with the conventional method.
Index terms: IC EMC modeling, macro-model of IC/LSI power current,
parameter optimization.
EMCABS: 07-05-2006
CHARACTERIZATION OF SSN COUPLING TO SIGNAL VIA IN MULTI-LAYER
PCBS AND PACKAGES
+J. Park, ++H. Kim, +++J.S. Pak and +J. Kim
+ Korea Advanced Institute of Science and Technology, Daejon 305-701,
Korea
++ Hynix Semiconductor Inc., Korea
+++ National Institute of Advanced Industrial Science & Technology
(AIST), Japan
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.328-331.
Abstract: The signal via is a heavily utilized interconnection
structure in high-density System-on-Package (SoP) substrates and
PCBs. Vias facilitate complicated routings in these multilayer
structures. Significant Simultaneous Switching Noise (SSN) coupling
occurs through the signal via transition when the signal via suffers
return current interruption caused by reference plane exchange.
The coupled SSN decreases noise and timing margins of digital
and analog circuits, resulting in reduction of achievable jitter
performance, Bit Error Ratio (BER), and system reliability. We
introduce a modeling method to estimate SSN coupling based on
a balanced Transmission Line Matrix (TLM) method. The proposed
modeling method is successfully verified by the frequency domain
measurements of several via transition structures.
Index terms: Signal integrity, simultaneous switching noise, coupling.
EMCABS: 08-05-2006
POWER TRACKS INSTEAD OF PLANES TO REDUCE RADIATED ELECTROMAGNETIC
FIELDS
+/++ F.B.J. Leferink and ++W.C. van Etten
+ Thales Netherlands, Hengelo, The Netherlands
++ University of Twente, Enschede, The Netherlands
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.371-374.
Abstract: The noise voltage in the reference or ground of a printed
circuit board is often the cause of unwanted radiated emission.
Power supply planes contribute to the noise voltage. By replacing
the power supply planes by tracks, the noise voltage in the reference
or ground can be reduced, which leads to a considerable reduction
of the radiated electromagnetic fields. A potential disadvantage
of using power tracks is a decreased power quality due to a higher
ripple voltage. Actual circuits, fed via power planes or power
tracks, have been designed and measured showing the impact on
radiated electromagnetic fields with constant power quality.
Index terms: Power plane, inductance, radiated emission, noise
voltage.
EMCABS: 09-05-2006
AN EFFICIENT APPROACH FOR THE POWER/GROUND PLANE EQUIVALENT CIRCUIT
EXTRACTION
+Z.H. Liu, +K.Y. See, ++E.P. Li and +E.K. Chua
+ Nanyang Technological University, Singapore
++ Institute of High Performance Computing, Capricorn, Singapore
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.379-382.
Abstract: Power/ground plane structure is widely used for power
distribution purposes in multi-layer printed circuit board (PCB)
design. The characteristic of board cavity may cause signal resonance
at some frequencies and can lead to signal integrity (SI) and
electromagnetic interference (EMI) concerns. An efficient method
to extract the equivalent circuit of the power bus is proposed
in this paper. With extracted equivalent circuit, time domain
response of the power bus can be easily analyzed at the early
design stage so that necessary measures to eliminate or minimize
potential EMI problems can be implemented.
Index terms: PCB design, power/ground plane, equivalent circuit
extraction.
EMCABS: 10-05-2006
EMC ANALYSIS ON STACKED PACKAGES
+I. Kelander, ++M. Uusimäki and +A.N. Arslan
+ Nokia Corporation, Helsinki, Finland
++ Nokia Corporation, Tampere, Finland
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.602-605.
Abstract: In this paper, EMC analysis on stacked packages using
different simulation methods is presented. A large part of the
EMC control is the understanding of different resonances emerging
in the package. At the resonance frequencies, both the internal
noise sources inside the package and the external noise sources
outside the package are generating strong fields and voltages,
and the package is most vulnerable for EMC problems causing malfunction.
As the level of integration in mobile devices continues to grow,
the control of EMC/EMI performance in electronic packages becomes
more and more challenging. With well-defined EMC verification
simulations, the designs can be improved and many of the potential
problems can be avoided before manufacturing. After the resonance
analysis, interconnect bond wire simulation results using RLC
equivalent circuit models are presented. At the end, the validation
of simulation results is discussed.
Index terms: EMC modeling, IC package, resonance.
EMCABS: 11-05-2006
A SIMPLE METHOD FOR MEASURING COMPLEX TRANSFER IMPEDANCE AND ADMITTANCE
OF SHIELDED CABLE IN SUBSTATIONS
L. Qi, X. Cui and X. Gu
North China Electric Power University, Baoding, 071003 China
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.650-653.
Abstract: In substations, shielded cables are widely used to reduce
transient electromagnetic interference to relay and control equipment
due to the switch operation. Both the transfer impedance and transfer
admittance are quantities for expressing numerically the mechanism
that allows the passage of electromagnetic energy across the cable
shield. Theoretical models to compute both quantities often rely
on simplifying assumptions. This, together with the fact that
the transfer impedance and admittance can vary considerably between
cable samples of the same type, means that measurements become
necessary. In this paper, based on the transmission line theory,
we present a simple method to measure the transfer impedance and
admittance of shielded cable in magnitude as well as in phase
over the frequency range 0.1MHz-10MHz, which covers the main interference
frequencies in the power system. To illustrate this method, a
coaxial cable with a braided shield has been measured and compared
with the existing method. As an application, the proposed method
is used to predict the induced voltage and current on the shielded
cable due to the switch operation in the substation.
Index Terms: EMI in substations, measurement, transfer impedance
and admittance, shielded cable.
EMCABS: 12-05-2006
ON THE MECHANISMS OF DIFFERENTIAL-MODE TO COMMON-MODE CONVERSION
IN THE BROADBAND OVER POWER LINE (BPL) FREQUENCY BAND
+A. Vukicevic, ++M. Rubinstein, +F. Rachidi and +++J. L. Bermudez
+ Swiss Federal Institute of Technology, Lausanne, Switzerland
++ University of Applied Sciences, Yverdon, Switzerland
+++ ABB Sécheron, Geneva, Switzerland
Proceedings of 17th International Zurich Symposium and Exhibition
on EMC in Singapore, Singapore, February 27 – March 3, 2006,
pp.658-661
Abstract: The conversion between the common and the differential
modes is of great importance in the transmission of data over
poorly balanced cables such as electrical wiring. In this paper,
we have studied some of the mechanisms involved in this conversion,
both experimentally and theoretically. The results show that along-the-line
variations in the line parameters, be it gradual or abrupt, are
responsible for part of the common mode in electric cables. Asymmetries
at the source are also responsible for part of the common mode
conversion and they can be dominant in certain cases.
Index terms: Power line, common mode, differential mode. EMC
EMCABS
