Following are abstracts of papers from previous EMC symposia, related conferences, meetings and publications.
Bob Hunter, Consultant
r.d.hunter@ieee.com
Sha Fei, EMC Research Section, Northern Jiatong University, Beijing, China
emclab@center.njtu.edu.cn
Ferdy Mayer, L.E.A.D., Maisons, Alfort France
FerdyMayerLEADFrance@compuserve.com
Maria Sabrina Sarto, Department of Electrical Engineering, University of Rome, Italy
sarto@elettrica.ing.uniroma1.it
Osamu Fujiwara
Associate Editor
Engineering college/university libraries, public libraries, company or corporate libraries, National Technical Information Services (NTIS), or the Defense Technical Information Center (DTIC) are all possible sources for copies of abstracted articles of papers. If the library you visit does not own the source document, the librarian can probably request the material or a copy from another library through interlibrary loan, or for a small fee, order it from NTIS or DTIC. Recently it became clear that EMCABs were more timely than publications which were being listed in data files. Therefore, additional information will be included, when available, to assist in obtaining desired articles or papers. Examples are: IEEE, SAE, ISBN, and Library of Congress identification numbers.
Also, the steering staffs of the Japan Technical Group and the EMC Japan Tokyo Chapter have offered to act as a central point for requests of papers abstracted here. Most of the papers will be available in Japanese only. Abstracts of papers from EMC Japan will be clearly identified. As a member of the steering staff, I will assist in routing your request to the author(s) but will not translate the papers.
Some of the Chinese papers are not available in English. Professor Sha Fei, EMC Research Section, Northern Jiatong University, has offered his time and assistance in routing requests for papers to appropriate author(s). He is not furnishing a translation service.
As the EMC Society becomes more international, we will be adding additional worldwide abstractors who will be reviewing articles and papers in many languages. We will continue to set up these informal cooperation networks to assist members in getting the information or contacting the author(s). We are particularly interested in symposium proceedings which have not been available for review in the past. Thank you for any assistance you can give to expand the EMCS knowledge base.
HUMAN EXPOSURE TO ELECTRIC AND MAGNETIC FIELDS FROM
RF SEALERS AND DIELECTRIC HEATERS – A COMAR TECHNICAL INFORMATION STATEMENT
IEEE-EMBS (Engineering in Medicine and Biology Society) Committee on Man
and Radiation (COMAR).
IEEE ENGINEERING IN MEDICINE AND BIOLOGY, January/February 1999, pp. 88-90
Abstract: RF energy at several assigned frequencies is used for industrial heating such as sealers and dielectric heaters. Concerns for the safety of such devices prompted studies to measure the fields of such devices; it was found that in some, operators were subject to fields in excess of certain standards, e.g., IEEE C95.1-1991. In this report, it is recommended that shielding between the operator and the devices and grounding of the devices be employed to reduce operator exposure be used. It is also recommended that operators be insulated from ground to reduce body to ground currents among other precautions. Numerous literature citations are included in this paper.
Index terms: RadHaz, nonionizing radiation, RF exposure guidelines, RF Heating
REDUCTION OF SAR IN HUMAN HEAD BY SUPPRESSION OF SURFACE CURRENTS DUE TO A PORTABLE TELEPHONE
J. Wang and O. Fujiwara
Principal contact: wang@odin.elcom.nitech.ac.jp
Wang@odin.elcom.nitech.ac.jp Nagoya
Institute of Technology, Nagoya 466-8555, Japan
Proceedings of 13th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.59-62
Abstract: To reduce the spatial peak specific absorption rate (SAR) in the human head, the authors previously proposed attaching a ferrite sheet to a portable telephone. In this paper, its mechanism is investigated by using the finite difference time domain (FDTD) method in conjunction with detailed models of a human head and portable telephone. The findings reveal that the SAR reduction by ferrite sheet attachment is due to the suppression of current flowing on the device surface close to the head. This leads that a low SAR portable telephone can be realized by controlling the current distribution on the device surface.
Index terms: Portable telephone, health hazard, SAR reduction, ferrite sheet attachment
ELECTROMAGNETIC INTERFERENCE INDUCED ON A TRANSMISSION LINE BY AN ELECTROSTATIC DISCHARGE INSIDE METALLIC ENCLOSURES
G. Cerri, R.De Leo, V. Mariani Primiani, M. Palmucci and A. Ciccolella*
University of Ancona, Ancona, Italy, * ESA-ESTEC, Noordwijk, Netherlands
Principal contact: r.deleo@ee.unian.it
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.83-86
Abstract: A lot of well documented operation anomalies, but also many catastrophic failures on board of orbiting spacecraft are due to electrostatic discharge (ESD). Moreover, the evolution of the electronic systems is leading to a denser packaging and to the use of lower intensity signals, increasing in this way the susceptibility of the electronic equipment. Therefore an accurate design is necessary to protect the circuitry from the effects of a board band disturbing field due to an ESD, but this can be achieved when effective simulation tools are available. In this sense, this paper presents a model for the evaluation of the disturbance induced in a transmission line by an ESD occurring inside a metallic enclosure, representing the metallic shield of an apparatus. The model highlights the effects of the resonant nature of the structure on the intensity and on the duration of the disturbance; theoretical results have been validated by measurements.
Index terms: Electrostatic discharge, electromagnetic interference, transmission line, metallic enclosure
A NEW METHOD TO EVALUATE THE IMPULSE RESPONSES OF LOSSY MULTICONDUCTOR TRANSMISSION LINES
A. Maffucci and G. Miano amaffucc@unina.it,
miano@unina.it Universita di Napoli “Federico
II”, Napoli, Italy
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.121-126
Abstract: This paper deals with the evaluation of the time-domain describing input and transfer impulse responses of linear lossy multiconductor transmission lines with frequency dependent parameters. These responses cannot be evaluated analytically and, due to the presence of “irregular” terms such as Dirac pulses, a brute numerical evaluation is not possible. In this paper an analytical method based on the perturbation theory of the spectrum of symmetric matrices is applied to evaluate exactly all the irregular terms. Once the irregular parts of the impulse responses are known, it is possible to evaluate accurately the regular ones through simple numerical methods, as shown through some examples.
Index terms: Lossy multiconductor transmission line, impulse response, perturbation theory, analytical method
INTRODUCING HEIGHT CORRECTION FACTORS FOR ACCURATE MEASUREMENTS WITH BICONICAL ANTENNAS ABOVE GROUNDPLANE
W. Mullner and M. Buchmayr Emc@arcs.ac.at
Austrian research center Seibersdorf, A-2444 Seibersdorf, Austria
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.153-157
Abstract: The antenna factor of the biconical antenna is a function of antenna height above a ground-plane. Variations in the antenna factor of up to 1.9dB are observed when the antenna is used in the typical height range of 1 m to 4 m on an open area test site (OATS). The magnitude of this variation depends on the impedance of the antenna balun from the antenna factor simulations we have derived height correlation factors which account for the coupling of biconical antennas above a ground plane. We have demonstrated with antenna calibration measurement what the simulated predictions show. The new method of height correction can be applied to all measurements with biconical antenna, when the balun impedance of the antenna is known. It removes the systematic error caused by the height depedance of the antenna factor. Examples are demonstrated for precision field strength measurements on an OATS, accuracy enhancement for antenna calibration according to the standard site method given ! in ANSI C63.5 and conversion of OATS antenna factors to free space antenna factors and vice-versa.
Index terms: Open area test site, antenna factor, biconical antenna, height correction factor
RESPONSE OF SHIELDED CABLES TO AN EXTERNAL ELECTROMAGNETIC FIELD EXCITATION—MODELING AND EXPERIMENTAL VALIDATION
D. Orzan, M. Ianoz and B. Nicoara*
Principal contact: michel.ianoz@epfl.ch Swiss
Federal Institute of Technology, Lausanne, Switzerland University <Politecnica>,
Bucarest, Rumania
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.185-190
Abstract: Two methods for the calculation of internal responses of shielded cables submitted to an external impulse electromagnetic field are analyzed. One is the classical frequency-domain approach, the second is a new mixed frequency-time-domain model, which uses a link to a well-known transient analysis code. This last feature makes possible the application of the second model to complex networks with several branches. In both models, measured values of the cable transfer impedance values have been used. The comparison between internal currents and voltages calculated with both models and measurements using an EMP simulator shows a reasonable good agreement. These comparisons validate the analyzed models and in particular the new combined frequency-time domain approach.
Index terms: Shielded cable, electromagnetic field excitation, impulse response, frequency-time-domain approach
COMMON-MODE CURRENTS AND PRINTED CIRCUIT BOARDS
F.B.M. van Horck, A.P.J. van Deursen* and P.C.T. van der Laan * Philips
Components, 5600 JB Eindhoven, the Netherlands
Principal contact: a.p.j.v.deursen@ele.tue.nl
*Eindhoven University of Technplogy, 5600 MB Eindhoven, the Netherlands
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.227-232
Abstract: Common-mode (CM) currents through cables attached to printed circuit boards are often the main cause of interference and many even dominate the direct radiation of the board. In this contribution we predict the coupling between the differential-mode (DM) circuit on the board and the CM circuit in a Bersier setup, by means of a rapid transmission-line model. This coupling is expressed as the ratio of the CM current and the DM current. Several boards with different complexity were studied in the frequency domain. For demonstration purposes a board with modern digital electronics was developed. Measurements between 100 KHz - 1 GHz agree with the TL models.
Index terms: Printed circuit board, common-mode current, circuit coupling, transmission-line model
ELECTRICAL PACKAGE MODELING INCLUDING VOLTAGE AND GROUND REFERENCE PLANES USING THE PARTIAL ELEMENT EQUIVALENT CIRCUIT (PEEC) METHOD
B. Archambeault and A. Ruehli* IBM Personal Systems Division, NC 27709,
USA, *IBM Research Division, T.J. Watson Research Center, NY 10598, USA
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.233-238
Abstract: Proper decoupling of power and ground plane structures has been a subject of much controversy. Some EMC engineers believe proper decoupling design should be performed one way, and others will believe a different approach to decoupling design is best. Measurement of the effectiveness of different decoupling strategies is difficult and very time consuming. Today’s focus is on rapid product design, and the need to have an effective design the first time. It is important to be able to analyze decoupling design strategies rather than employing the trial and error process which is often used. The need to be able to simulate the effectiveness of decoupling design approach is obvious. However, by it’s very nature, this type of analysis is difficult since it includes metal planes coupled to a large number of circuit elements. Many modeling techniques are not well suited to this type of problem. We show that Partial Element Equivalent Circuit (PEEC) technique is useful for the solution of this type of problem. This paper describes work performed using PEEC to model large decoupling structures. Results show great promise for further work using PEEC for decoupling simulations.
Index terms: Decoupling design, decoupling simulation, package modeling, partial element equivalent circuit technique
DIAKOPTICS: AN EFFICIENT TECHNIQUE FOR EMC APPLICATIONS
M.M. Ney and S. Le Maguer, michel.ney@enst-bretagne.fr
Ecole Nationale Superieure des Telecommunications de bretagne, France,
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.339-344
Abstract: The paper describes a numerical procedure, called diakoptics, that allows one to solve for sub-domains of a large structure in a rigorous manner. Hence, one can optimize such a sub-domain during subsequent simulations without meshing the whole structure. This feature is very attractive for EMC applications that involve, for instance, shielding apertures. In addition, the technique is naturally well suited for transmission-line matrix (TLM) computations. Although diakoptics is very demanding in terms of computer cost for three-dimensional cases, an accelerating procedure can substantially reduce the memory and CPU time requirement. Examples of applications related to shielding and radiation show the validity of the approach.
Index terms: Numerical technique, transmission-line-method, diakoptics, three-dimesional problem
EQUIVALENT CIRCUIT MODELS FOR THE TIME-DOMAIN SIMULATION OF FERRITE ELECTROMAGNETIC WAVE ABSORBERS
J. Paul, C. Christopoulos and D.W.P. Thomas, Principal contact: jdp@eee.nottingham.ac.uk, University of
Nottingham, UK
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.345-350
Abstract: In this paper, the reflectivities of various ferrite absorbing structures are analyzed in the frequency-domain and Z-transform techniques are applied to develop time-domain models. For flat tiles an equivalent circuit is developed to describe the surface impedance and thus the reflectivity. For grid tiles and wood-backed tiles, the frequency-domain Prony method is used the extract the coefficients of the model from the analytic data. The frequency-domain Prony method is reviewed and the structure of a general discrete time model is described. These methods offer a systematic and general approach to the modeling of reflectivity functions in transmission-line modelling (TLM) or the modeling of surface impedance functions in the finite-difference time-domain (FDTD) method. results are presented comparing the reflectivity performance of the models with analysis. Finally, the performance of a practical anechoic chamber modeled using this approach is compared with measurements.
Index terms: Ferrite electromagnetic wave absorber, reflectivity, transmission-line modeling, equivalent circuit
NEW FREQUENCY-DEPENDENT MODELS FOR CLOSE-SPACED MULTIWIRE LINES OVER A CONDUCTING PLANE
M. Kane, Ph. Auriol*, L. Krahenbuhl* and F. Buret*, Kanem@csa.ca ,
Canadian Standards Association, Ontario, M9W 1R3 Canada,
*Ecole Centrale de Lyon, 69131 Ecully Cedex, France
Proceedings of 13th International Zurich Symposium and Technical Exhibition on
Electromagnetic Compatibility, Zurich, Switzerland, February 16-18, 1999, pp.431-436
Abstract: Electrical systems are often interconnected by wires arranged over ground or over a conducting plane. The paper highlights the importance of proximity effect consideration. Matrix impedances and admittances of very close spaced conductors over a ground plane are determined. The proposed model has been evaluated in a wide frequency range and compared to the case in which skin effect alone is considered. The results obtained are in good agreement with expectations. The model can obviously complete existing analytical models, which often neglect proximity effects.
Index terms: Close-spaced multiwire-line, proximity effect, impedance matrix, frequency-dependent model
CAPACITIVE VOLTAGE PROBE FOR NON-CONTACT MEASUREMENT OF COMMON-MODE VOLTAGER.
Kobayashi, K. Tajima*, Y. Hiroshima* and N. Kuwabara
*NTT Technical Assistance & Support Center, Japan
*NTT Multimedia Networks Laboratories, Japan, Proceedings of 13th International Zurich
Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland,
February 16-18, 1999, pp.545-550
Abstract: Capacitive voltage probe is described that can measure the common-mode voltage on a cable without touching its conductor. This capacitive voltage probe has with two coaxial electrodes; the inner electrode works as a voltage pickup, and the outer one shields the inner electrode. These electrodes separate into two parts for clamping to the cable. Using a high input impedance circuit, this probe measures the common-mode voltage by detecting the voltage difference between the two electrodes. The probe’s characteristics were evaluated by measuring its linearity and frequency response. The results show that this probe has a dynamic range of 100 dB and flat frequency response from 10 kHz to 30 MHz. Errors in measurement due to the position of the clamped cable in the inner electrode and to differences in the cable radius were evaluated theoretically and experimentally. The results indicate that the influence of the cable position is small and the deviation in sensitivity induced by differences in the cable radius can be calibrated using compensatory data.
Index terms: Common-mode voltage, non-contact measurement, capacitive voltage probe, calibration