Organizing committee 
General Chair
Bin Yao, Purdue Univ, USA
 
Program Chair
George Chiu, Purdue Univ, USA
 
General Co-Chairs
Clarence de Silva, U. British Columbia, Canada
Peter Korondi, Academy of Sciences, Hungary
 
Program Co-Chairs
Nicolas Chaillet, U. of Franche-Comté, France
Sergej Fatikow, Univ of Oldenburg, Germany
Hiroshi Fujimoto, Yokohama Natl. Univ, Japan
Peter Liu, Carleton Univ, Canada
Marcia O'Malley, Rice Univ, USA
Huayong Yang, Zhejiang Univ, China


Local Arrangement Chairs
Chun-Yi Su, Concordia Univ, Canada

Finance Chair
Jianghai Hu,  Purdue Univ, USA

Tutorials Chair
Jordan Berg, Texas Tech Univ, USA

Workshops Chairs
Gursel Alici, U. of Wollongong, Australia
Metin Sitti, Carnegie Mellon University, USA
 
Focused Sessions Chairs
Sunil K. Agrawal, U. of Delaware, USA (Biomedical Mechatronic Systems)
Xin Fu, Zhejiang Univ, China  (Fluid Power Mechatronic Systems)
Robert X. Gao, U. of Connecticut, USA  (Manufacturing Mechatronic Systems)
Guillaume Morel, U. P&M Curie, France (Health Care Applications)
Gangbing Song, U. of Huston, USA (Smart Structure Mechatronic Systems)
Koichi Suzumori, Okayama Univ, Japan (Actuators)
Xiaobo Tan, Michigan State Univ, USA (Sensors)
Qian Wang, Penn State University, USA (Network)
Canjun Yang, Zhejiang University, China (Ocean Engineering Applications)
George Zhu, Michigan State Univ, USA (Automotive)
Publication Chairs
Yaoyu Li, U. of Wisconsin-Milwaukee, USA
Chao-Chieh Lan, National Cheng Kung Univ

Publicity Chairs
Mohammed AlMajed, KACST, Saudi Arabia
Marvin Cheng, West Virginia Univ, USA
Stefano Chiaverini, Univ. di Cassino, Italy
JangMyung Lee, Pusan Nat'l Univ, Korea
Kouhei Ohnishi, Keio Univ, Japan
Stefano Stramigioli, U. Twente, Netherlands
Danwei Wang, Nanyang Tech. U, Singapore
Qingfeng Wang, Zhejiang Univ, China
Takashi Yoshimi, Shibaura Inst of Tech, Japan
 
Exhibits and Industrial Sponsorship Chair
Qinghui Yuan, Eaton, USA
 
RAS Liason Officer
Shigeki Sugano, Waseda Univ, Japan
 
IES Liaison Officer
Mo-Yuen Chow, N Carolina State Univ, USA
 
ASME Liaison Officer
Kok-Meng Lee, Georgia Tech, USA
 
Registration Chair
Ying Feng, Concordia Univ, Canada
 
Program committee 

Gursel Alici, University of Wollongong, Australia
Wei Tech Ang, Nanyang Technological University, Singapore
Marco Ceccarelli, University of Cassino, Italy
Jen-Yuan (James) Chang, Massey University, New Zeland
Cheng-Lun Chen, National Chung Hsin University, Taiwan
Cheng-Yi Chen, Cheng Shiu University, Taiwan
Maggie Chen, Univeristy of Texas at Austin, US
Pei-Ju Chiang, Purdue University, US
Makoto Iwasaki, Nagoya Institute of Technology, Japan
Fakhri Karray, Univerisity of Waterloo, Canada
Kyungsoo Kim, KAIST, S. Korea
Bob Koch, University of Alberta, Canada
Kyoungchul Kong, University of California at Berkeley, US
Guangjun Liu, Ryerson University, Canada
John Y. Liu, Boeing Co., US
Feng Liu, Cummins Co., US

Ahmad A. Masoud, King Fahd University of Petroleum & Minerals, Saudi Arabia

Sarthak, Misra, University of Twente, Netherland

Moeed Mukhtar, Whirlpool Co., US
Sehoon Oh, University of Tokyo, Japan
Paolo Rocco, Politecnico di Milano, Italy
Weihua Sheng, Oklahoma State University, US
Tomoyuki Shimono, Yokohama National University, Japan
Jorge Solis, Waseda Univeristy, Japan
Kimberly Wang, Tyco Electronics, US
Keith Willams, University of Alabama, US
ShangTeh Wu, National Yunlin University of Science and Technology, Taiwan
Zeyang Xia, IUPUI, US
Yongqiang Ye, Nanjing University of Aeronautics and Astronautics, China
Jingang Yi, Rutgers University, US
Yuenkuan Yong, University of Newcastle, Australia
Henry Zhang, Purdue University, US
Guchuan Zhu, ECOLE Polytechnique Montreal, Canada
Advisory committee 

Honorary Advisory Committee

Fumio Harashima, Univ of Tokyo, Japan
T.-J. Tarn, Washington Univ, USA
Toshio Fukuda, Nagoya Univ, Japan
Ren C. Lou, Nat'l Taiwan Univ, Taiwan
Masayoshi Tomizuka, UC Berkeley, USA
Okyay Kaynak, Bogazici Univ, Turkey

AIM Advisory Committee

Hideki Hashimoto, Univ of Tokyo, Japan
Kok-Meng Lee, Georgia Tech, USA
Bruno Siciliano, Univ of Naples, Italy
Shigeki Sugano, Waseda Univ, Japan
Ning Xi, Michigan State Univ, USA
Roland Siegwart, ETH, Switzerland
Max Meng, Chinese Univ Hong Kong, HK
I-Ming Chen, Nanyang Tech Univ, Singapore
 

 


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