Description
ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Society. ECTC paper comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
Call for paper
Please check the above Conference Description for CFP information.
Any questions, please contact the conference organizer. The contact(s) can be found on the right Contact .