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Technical Seminar

Distinguished Lecturer Series


Scalability of RF CMOS

DATE/TIME  Thursday,,August 14, 2008 (4:30pm to 6:00pm)
PLACE  AMD Fort Collins Campus (Fort Collins, CO)
DIRECTIONS

From I-25, take Harmony Road Exit (Exit 265) westbound, and enter AMD campus on right immediately following Harmony/Ziegler intersection.  AMD is located on the NW corner of Harmony Road and Ziegler Road.  Proceed to 3rd floor for escort to seminar auditorium.  Non-AMD employees:  please arrive at 4:15pm for security sign-in and escort.

COST    Free.  As always, food & drinks will be provided.
RSVP    Send e-mail to Tin Tin Wee at tintin.wee@amd.com.

ABSTRACT

The scalability of advanced CMOS technology for radio frequency (RF) applications is discussed.  The impact of transistor scaling and advanced interconnect technology on active device performance and passive component quality is examined.  Due to the limiting scaling of RF circuit area, most advanced CMOS technology can only be justified for products integrating RF circuits with large baseband digital blocks, or products integrating multiple RF applications.

PRESENTATION SLIDES  pdf

PROF. SIMON WONG (Stanford University, Stanford, CA)

Prof. Wong studies the fabrication and design of high performance integrated systems.  His group focuses on understanding and overcoming the limitations of circuit performance imposed by device, interconnection and on-chip components.  Wong received the BEE and BME degrees from the University of Minnesota at Minneapolis in 1975 and 1976 respectively, and the MS and PhD degrees from the University of California at Berkeley in 1978 and 1983 respectively.  From 1978 to 1980, he was with National Semiconductor Corporation designing MOS dynamic memories.  From 1980 to 1985, he was with Hewlett Packard Laboratories working on advanced MOS technologies.  From 1985 to 1988, he was an Assistant Professor in the School of Electrical Engineering at Cornell University.  In 1988, he joined Stanford University where he is now Professor of Electrical Engineering.  He is a Fellow of IEEE.

PHOTOS  Courtesy of Tin Tin Wee