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Technical Program Committee

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Technical Program Committee

Mohamed AbdelmoneumIntel Corporation, USA
Pamela AbshireUniversity of Maryland, USA
Ahmed Al-Shamma'aLiverpool John Moores University, UK
David ArnoldUniversity of Florida, USA
Francisco J. ArreguiUniversidad Publica de Navarra, SPAIN
Massood AtashbarWestern Michigan University, USA
Farrokh AyaziGeorgia Institute of Technology, USA
István BársonyHungarian Academy of Sciences, HUNGARY
Stephen BartAnalog Devices, USA
Rajashree BaskaranIntel Corporation, USA
Sarah BergbreiterUniversity of Maryland, USA
Pamela BhattiGeorgia Institute of Technology, USA
Andre BosscheDelft University of Technology, NETHERLANDS
Oliver BrandGeorgia Institute of Technology, USA
Danick BriandUniversity of Neuchatel, SWITZERLAND
Victor BrightUniversity of Colorado, Boulder, USA
Jong-Uk BuSenPlus Inc., KOREA, SOUTH
Edwin CarlenUniversity of Twente, NETHERLANDS
Richard CernosekSandia National Laboratories, USA
Jin-Chern ChiouNational Chiao Tung University, TAIWAN
Kukjin ChunSeoul National University, KOREA, SOUTH
Marina ColeUniversity of Warwick, UK
Elisabetta CominiBrescia University, ITALY
Olga CondeUniversity of Cantabria, SPAIN
Frederik CreemerDelft University of Technology, NETHERLANDS
Vasile DadarlatUniversitatea Tehnica Cluj-Napoca, ROMANIA
Amy DuwelCharles Stark Draper Laboratory, USA
Martin EickhoffJustus Liebig-Universitat Geissen, GERMANY
David ElataTechnion - Israel Institute of Technology, ISRAEL
Lorenzo FaraoneUniversity of Western Australia, AUSTRALIA
Vittorio FerrariUniversity of Brescia, ITALY
Colin FitzpatrickUniversity of Limerick, IRELAND
Paddy FrenchDelft University of Technology, NETHERLANDS
Anton FuchsTechnical University of Graz, AUSTRIA
Gianluca GagliardiCNR Naples, ITALY
Ann Garrison DarrinJohns Hopkins University Applied Physics Laboratory, USA
Elena GauraCoventry University, UK
Nima GhalichechianFormFactor, USA
Peter HauptmannOtto-von-Guericke-University Magdeburg, GERMANY
Amy HerrUniversity of California, Berkeley, USA
Eiji HigurashiUniversity of Tokyo, JAPAN
Matthew HopcroftHewlett Packard, USA
David HorsleyUniversity of California, Davis, USA
Jerwei HsiehAsia Pacific Microsystems Inc., TAIWAN
I-Yu HuangNational Sun-Yet-Sen University, TAIWAN
Qing-An HuangSoutheast University, CHINA
Makoto IshidaToyohashi University of Technology, JAPAN
Bernhard JakobyJohannes Kepler University Linz, AUSTRIA
Stephen JamesCranfield University, UK
Shin-Won KangKyungpook National University, KOREA, SOUTH
Youn Tae KimChosun University, KOREA, SOUTH
Martin KraftCarinthian Tech Research, AUSTRIA
Hiroki KuwanoTohoku University, JAPAN
Chee-Yee KwokUniversity of New South Wales, AUSTRALIA
Jae Wan KwonUniversity of Missouri, USA
Sukhan LeeSungkyun Kwan University, KOREA, SOUTH
Elfed LewisUniversity of Limerick, IRELAND
Xinxin LiShanghai Institue of Microsystem and Information Technology, CHINA
Zhihong LiPeking University, CHINA
Pinyen LinXerox Research Center Webster, USA
Yu-Cheng LinNational Cheng Kung University, TAIWAN
Carol LivermoreMassachusetts Institute of Technology, USA
Shiang-Cheng (Michael) LuNational Tsing Hua University, TAIWAN
Ralf LucklumJohannes Kepler University Linz, AUSTRIA
William LyonsCity University London, UK
Piero MalcovatiUniversity of Pavia, ITALY
Ellis MengUniversity of Southern California, USA
Jianmin MiaoNanyang Technological University, SINGAPORE
Anna Grazia MignaniCNR IFAC, ITALY
Phan Ngoc MinhVietnam Academy of Science and Technology, VIETNAM
Boris MizaikoffUniversity of Ulm, GERMANY
Brian MorganUS Army Research Laboratory, USA
Takamichi NakamotoTokyo Institute of Technology, JAPAN
Thomas NeweUniversity of Limerick, IRELAND
Gary O'BrienRobert Bosch LLC, USA
Shinji OhyamaTokyo Institute of Technology, JAPAN
Krikor OzanyanUniversity of Manchester, UK
Jae Y. ParkKwangwoon University, KOREA, SOUTH
Gary PickrellVirginia Tech, USA
Marcel PruessnerNaval Research Laboratory, USA
Beth PruittStanford University, USA
Konandur RajannaIndian Institute of Science, INDIA
Pavel RipkaCzech Technical University, CZECH REPUBLIC
Taher SaifUniversity of Illinois, Urbana-Champaign, USA
Ulrich SchmidVienna University of Technology, AUSTRIA
Uwe SchnakenbergRWTH Aachen University, GERMANY
Pietro SicilianoNational Research Council (CNR), ITALY
Elisabeth SmelaUniversity of Maryland, USA
Sameer SonkusaleTufts University, USA
Daoheng SunXiamen University, CHINA
Tong SunCity University London, UK
Hiroaki SuzukiUniversity of Tsukuba, JAPAN
Osamu TabataKyoto University, JAPAN
Svetlana Tatic-LucicLehigh University, USA
Adisorn TuantranontNational Electronics and Computer Technology Center, THAILAND
Kimberly TurnerUniversity of California, Santa Barbara, USA
Toshitsugu UedaWaseda University, JAPAN
Michiel VellekoopVienna University of Technology, AUSTRIA
James WalkerDeMont & Breyer, LLC, USA
Qing-Ming WangUniversity of Pittsburgh, USA
Zheyao WangTsinghua University, CHINA
Dana WeinsteinMassachusetts Institute of Technology, USA
Denise WilsonUniversity of Washington, USA
Wojtek WlodarskiRMIT University, AUSTRALIA
Man WongHong Kong University of Science & Technology, HONG KONG
Shanhong XiaInstitute of Electronics, Chinese Academy of Sciences, CHINA
Huikai XieUniversity of Florida, USA
Yong XuWayne State University, USA
Sang Sik YangAjou University, KOREA, SOUTH
Yong-Kyu YoonUniversity at Buffalo, The State University of New York, USA
Mona ZaghloulGeorge Washington University, USA
Xin ZhangBoston University, USA
Maryam Ziaei-MoayyedSandia National Laboratory, USA



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