General Co-Chairs

Danijela Cabric, UCLA, USA
Onur Altintas, Toyota Motor North America R&D

TPC Co-Chairs

Tim Leinmueller, DENSO International Europe, Germany
Hongwei Zhang, Iowa State University, USA

Poster/Demo and Student Travel Grant Co-Chairs

Ashwin Ashok, Georgia State University, USA
Miguel Sepulcre, Universidad Miguel Hernández de Elche, Spain

Panel Chair

Jim Lansford, Qualcomm, USA

Publication Chair

Takamasa Higuchi, Toyota Motor North America R&D

Publicity Co-Chairs

Ala'a Al-Momani, Ulm University, Germany
Sinem Coleri Ergen, Koc University, Turkey
Qiao Xiang, Yale University, USA

Web Chair

Seyhan Ucar, Toyota Motor North America R&D

Local Arrangement Co-Chairs

Benjamin Domae, UCLA, USA
Enes Krijestorac, UCLA, USA
Agon Memedi, Paderborn/UCLA

Finance Chair

Bruce Worthman, IEEE

Steering Committee

Onur Altintas, Toyota Motor North America R&D
Wai Chen, China Mobile Research Institute, China
Falko Dressler, University of Paderborn, Germany
Geert Heijenk, University of Twente, The Netherlands
Thomas Luckenbach, FOKUS, Germany
Hyun Seo Oh, ETRI, South Korea
Umit Ozguner, Ohio State University, USA
Tadao Saito, Professor Emeritus, The University of Tokyo, Japan

Technical Program Committee

Taimoor Abbas, ICV-TECH, Sweden
Ana Aguiar, University of Porto, Portugal
Ashwin Ashok, Georgia State University, USA
Fan Bai, General Motors, USA
Ali Balador, Mälardalen University, Sweden
Bastian Bloessl, TU Darmstadt, Germany
Mate Boban, Huawei German Research Center, Germany
Maria Calderon, Universidad Carlos III de Madrid, Spain
Claudia Campolo, University Mediterranea of Reggio Calabria, Italy
Claudio Casetti, Politecnico di Torino, Italy
Sandra Céspedes, Universidad de Chile, Chile
Yingying Chen, Rutgers University, USA
Yu Chen, Aptiv PLC
Sinem Coleri, Koc University, Turkey
Pedro d'Orey, Instituto de Telecomunicações, Portugal
Falko Dressler, Paderborn University, Germany
Eylem Ekici, The Ohio State University, USA
Andreas Festag, Technische Hochschule Ingolstadt, Germany
Marco Fiore, National Research Council, Italy
Raphael Frank, University of Luxembourg, Luxembourg
Takeo Fujii, The University of Electro-Communications, Japan
Mohamed Gharba, Huawei Technologies Duesseldorf GmbH, European Research Center (ERC), Germany
Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
Qingwen Han, Chongqing University, P.R. China
Jérôme Härri, EURECOM, France
Sonia Heemstra de Groot, Eindhoven Technical University, The Netherlands
Geert Heijenk, University of Twente, The Netherlands
Albert Held, Daimler AG, Germany
Teruo Higashino, Osaka University, Japan
Takamasa Higuchi, Toyota InfoTech Labs, USA
Hsu-Chun Hsiao, National Taiwan University, Taiwan
Jinling Hu, China Academic of Telecommunication & Technology, P.R. China
Chin-Ya Huang, National Taiwan University of Science and Technology, Taiwan
Susumu Ishihara, Shizuoka University, Japan
Frank Kargl, Ulm University, Germany
Florian Klingler, Paderborn University, Germany
Haris Kremo, International University of Sarajevo, Bosnia and Herzegovina
Jian-Jhih Kuo, National Chung Cheng University, Taiwan
Jim Lansford, Qualcomm, Inc., USA
Victor Lee, City University of Hong Kong, P.R. China
Shengbo Li, Tsinghua University, P.R. China
Chung-Wei Lin, National Taiwan University, Taiwan
Kate Ching-Ju Lin, National Chiao Tung University, Taiwan
Thomas Little, Boston University, USA
Jian Liu, University of Tennessee, Knoxville, USA
Kai Liu, Chongqing University, P.R. China
Renato Lo Cigno, University of Brescia, Italy
Hongsheng Lu, Toyota Motor North America InfoTech Labs, USA
Pietro Manzoni, Universitat Politècnica de València, Spain
Christoph Mecklenbräuker, Vienna University of Technology, Austria
Rui Meireles, Vassar College, USA
Klaus Mößner, TU Chemnitz
Yaser P. Fallah, University of Central Florida, USA
Sooksan Panichpapiboon, King Mongkut's Institute of Technology Ladkrabang, Thailand
Panagiotis Papadimitratos, KTH, Sweden
Jonathan Petit, Qualcomm, USA
Ravi Prakash, University of Texas at Dallas, USA
Jayanthi Rao, Ford Motor Company, USA
Marco Roccetti, University of Bologna, Italy
Michele Rondinone, Hyundai Motor Europe Technical Center, Germany
Ahmed Sakr, Toyota Motor North America R&D, USA
Matthias Sander-Frigau, Iowa State University, USA
Paolo Santi, IIT-CNR, Italy
Pedro Santos, CISTER/ISEP, Polytechnic Institute of Porto, Portugal
Susana Sargento, Instituto de Telecomunicações, Universidade de Aveiro, Portugal
Björn Scheuermann, Humboldt University of Berlin, Germany
Thomas Schmidt, Hamburg University of Applied Sciences, Germany
Elmar Schoch, BMW Group, Germany
Michele Segata, University of Trento, Italy
Miguel Sepulcre, Universidad Miguel Hernandez de Elche, Spain
Hiroshi Shigeno, Keio University, Japan
Takayuki Shimizu, Toyota Motor North America, Inc., USA
Christoph Sommer, Paderborn University, Germany
Jonathan Sprinkle, University of Arizona, USA
Daniel Stancil, North Carolina State University, USA
Thomas Strang, German Aerospace Center (DLR), Germany
Hsin-Mu Tsai, National Taiwan University, Taiwan
Kazuya Tsukamoto, Kyushu Institute of Technology, Japan
Guan-Hua Tu, Michigan State Unversity, USA
Joao P. Vilela, University of Coimbra, Portugal
Leandro Villas, UNICAMP, Brazil
Alexey Vinel, Halmstad University, Sweden
Isabel Wagner, De Montfort University, United Kingdom (Great Britain)
Chen Wang, Louisiana State University, USA
Kuang-Ching Wang, Clemson University, USA
Yuehua Wang, Texas A & M University - Commerce, USA
Yunsheng Wang, Kettering University USA Andre Weimerskirch, Lear Corporation, USA
Charles H.-P. Wen, National Chiao Tung University, Taiwan
Lars Wischhof, Munich University of Applied Sciences, Germany
Lars Wolf, Technische Universität Braunschweig, Germany
Qiao Xiang, Yale University, USA
Yaling Yang, Virginia Tech, USA
Tomoyuki Yashiro, Chiba Institute of Technology, Japan
Nairan Zhang, Facebook, Inc., USA

Poster/Demo Program Committee

Alessandro Bazzi, University of Bologna, Italy
Anu Bourgeois, Georgia State University, USA
Ravishankar Chamarajnagar, VMWare, USA
Baldomero Coll-Perales, Universidad Miguel Hernandez de Elche, Spain
Arturo González, Technische Universität Dresden, Germany
Shubham Jain, Old Dominion University, USA
Prajwal Keshavamurthy, Huawei Technologies Duesseldorf GmbH, Germany
Vuk Marojevic, Mississippi State University, USA
Vincent Martinez, NXP, The Netherlands
Ioannis Mavromatis, Toshiba Research Europe Limited, UK
Evangelos Mintsis, Centre for Research and Technology Hellas, Greece
Prasant Misra, TATA Consultancy Services, India
Vetrivelan P, VIT University, India
Guruguhanathan Venkataramanan, Intel, USA
Zhisheng Yan, Georgia State University, USA