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Tutorial 2
8:00am
– 12 :15pm, Monday, September 2009
THERMAL STRESS FAILURES
IN ELECTRONICS: PREDICTION AND PREVENTION
Dr. E. Suhir, University of
California, Santa Cruz, CA,
University of Maryland,
College Park, MD, and ERS Co., Los Altos, CA, USA
SuhirE@aol.com
Thermal loading takes
place, and thermal stresses occur, during the normal operation
of the system, as well as during its fabrication, testing,
transportation or storage. Such a loading is particularly
high in power electronics. Thermally induced failures in
microelectronic equipment can be prevented only provided that
predictive modeling and accelerated life testing is
consistently used in addition (and, desirably, prior) to the
qualification testing.
This
presentation will describe the thermal stress problem(s) in
electronic packaging and reliability engineering, and provide
recommendations for the physical design for reliability of
electronic assemblies and packages.
The topics include
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Thermal Stress Problem
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Thermal Stress Modeling
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Thermal Stress Evaluation and
Reduction
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“Global” and “Local” Thermal
Mismatch Induced Stress
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Thermally Matched Assemblies
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Thermal Stress in Thin Films
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Thermal Stress and Thermal Stress
Induced Bow in Plastic Packages of IC Devices
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Thermal Stress in Opto-Electronic
and Photonic Structures
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Accelerated Life Testing (ALT)
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Accelerated Life Testing of an
Assembly Subjected to Thermal Stresses
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(Probabilistic) Physical Design
for Reliability of Electronic Devices and Systems
Biography: Dr. Suhir is
Distinguished Member of Technical Staff (ret), Basic Research,
Physical Sciences and Engineering Research Division, Bell
Labs, Murray Hill, NJ. Dr. Suhir is currently on the faculty
of the Electrical Engineering Department, University of
California at Santa Cruz, CA. He is also Visiting Professor
with the Department of Mechanical Engineering, University of
Maryland at College Park, MD. Dr. Suhir is a founder, CEO and
President of the ERS Co., which is funded through the
Government grants. He is Fellow of the American Physical
Society (APS), the Institute of Electrical and Electronics
Engineers (IEEE), the American Society of Mechanical Engineers
(ASME), and the Society of Plastics Engineers (SPE). Dr. Suhir
is co-founder (with Dr. Peter Engel) of the ASME Journal of
Electronic Packaging and served as its Technical Editor for
eight years (1993-2001). He has authored about 250 technical
publications (papers, book chapters, books, patents),
including monographs “Structural Analysis of Microelectronic
nad Fiber Optic Systems”, Van-Nostrand, 1991 and “Applied
Probability for Engineers and Scientists”, McGraw-Hill, 1997.
Springer is planning now to issue the second edition of this
monograph. Dr. Suhir is Distinguished Lecturer of the IEEE
CPMT Society and Member of the Editorial Board of the IEEE
CPMT Transactions on Advanced Packaging.
Dr. Suhir has presented
numerous invited and keynote talks and taught many
professional development courses on various topics of
materials, structural, reliability, electrical, optical and
mechanical engineering. Dr. Suhir organized many successful
conferences and symposia worldwide, and received numerous
distinguished service and professional awards. Some of his
recent professional awards are: 2004 ASME Worcester Read
Warner Medal for outstanding contributions to the
permanent literature of engineering through a series of papers
in Mechanical, Microelectronic, and Optoelectronic
Engineering, which established a new discipline known as the
Structural Analysis of Microelectronic and Photonic Systems;
2001 IMAPS John A. Wagnon Technical Achievement Award
for outstanding contributions to the technical knowledge of
the microelectronics, optoelectronics, and packaging industry;
2000 IEEE-CPMT Outstanding Sustained Technical Contribution
Award for outstanding, sustained and continuing
contributions to the technologies in fields encompassed by the
CPMT Society; 2000 SPE International
Engineering/Technology (Fred O. Conley) Award for
outstanding pioneering and continuing contributions to
plastics engineering; and 1999 ASME and Pi-Tau-Sigma
Charles Russ Richards Memorial Award for outstanding
contributions to mechanical engineering.
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