Date: Tuesday, Jan 29, 2002
Dallas Texins Association at Texas Instruments 13900 N Central Expwy.
(north-bound access road between Midpark Rd. & Spring Valley Rd.)
Conference Room 1 and 2
Complimentary Dinner 6:30PM, 7:00PM Program.
Mixed Signal Behavioral Modeling in the IC Industry
Program Summary:
A brief history of modeling and simulation in the semiconductor industry is presented,
with an emphasis on mixed signal / analog ICs. This will be followed by a review of current trends
and standards. An overview of modeling methods for mixed signal ICs will be provided. A
question and answer session will conclude the presentation.
Education:
B.S.E.E. 1990 University of Connecticut
M.S.E.E. 1992 University of Connecticut
Work Experience:
1992-Pres: Texas Instruments, Inc. - Dallas, Texas 1999 Elected Member, Group Technical Staff
Technical Expertise:
Mixed Signal Behavioral Modeling
MAST, C, C++, SystemC, ADFMI, Verilog-AMS, VHDL-AMS
Publications:
Cover article "Mixed Signal Modeling for ICs", ISN Magazine June, 1997
IEEE BMAS Oct 98, Panelist
IEEE ICCAD Dec 99, Tutorial Speaker on Top Down Design
IEEE MSICD Nov 99, Invited Speaker on Top Down Design
For a copy of the trasparencies click here
(8.47M)
For any further information please contact:
Jim Holmes
Texas Instruments Inc.
Dallas, TX 75243
email:jim-holmes@ti.com
Date: Tuesday, Feb 26, 2002
Dallas Texins Association at Texas Instruments 13900 N Central Expwy.
(north-bound access road between Midpark Rd. & Spring Valley Rd.)
Conference Room 1 and 2
Complimentary Dinner 6:30PM, 7:00PM Program.
USB Full Speed, Slow Speed Transceiver Design
Program Summary: This introduction to USB transceiver design will give a brief description of USB and then delve
into details about the full-speed/slow-speed transceiver and its implementation on some TI
products. Sub-topics include USB transceiver specs, certification requirements, example circuits,
and design issues. The high-speed transceiver will be very briefly discussed.
Steve Krzentz received his Bachelors and Masters degrees in Electrical Engineering from Rice
University in 1988, and 1990, respectively. Steve worked at Texas Instruments in flash memory
design from 1990 till 1998, focusing the majority of his work on the design of creative test
circuitry. Since 1998, Steve has worked in mixed signal wireless design, working on USB
transceivers and PMOS low-dropout voltage regulators.
For a copy of the trasparencies click here
(almost 72K)
For any further information please contact:
Steve Krzentz
Texas Instruments Inc.
P.O.Box 660199, MS 8727
Dallas, TX 75266-0199
email:skrzentz@ti.com
Date: Friday, Apr 26, 2002
Dallas Texins Association at Texas Instruments 13900 N Central Expwy.
(north-bound access road between Midpark Rd. & Spring Valley Rd.)
Conference Room 1 and 2
Complimentary Dinner 6:30PM, 7:00PM Program.
The Challenge of Converting From Aluminum to Copper Interconnects With Low-K Dielectrics
26 April 2002, Friday, Texins Activity Center, Conference Room 1&2, Dinner 6.30pm, Seminar 7.00pm
Program Summary: The Semiconductor Industry in now in transition, from the scaling of existing interconnect systems that utilize
the same materials, to a systematic introduction of new materials almost every generation. This "inflection point"
in technology development is being driven by the need to improve device performance, in addition to cost reduction.
In order to stay on the Moore's Law curve, new, manufacturing worthy processes and integration approaches are
required. To further insure device reliability at low costs, it becomes essential to factor in manufacturing
concerns during technology definition.
In this talk we will discuss the driving forces and the changes in interconnect technology, describe the
current process integration challenges, with an emphasis on manufacturability, and lastly, predict future
interconnect development trends and alternatives.
Satish Lakshmanan graduated from the Indian Institute of Technology, Kanpur, India, with a Bachelor's degree in
Chemical Engineering in 1993. His graduate research in the Chemical Vapor Deposition of Copper for interconnect
applications, was funded initially by the SEMATECH Center of Excellence and later by the Semiconductor Research
Corporation, at the Rensselaer Polytechnic Institute Interconnect Science Center. After receiving a Ph.D. in
Chemical Engineering, he joined Texas Instruments in 1998 to start work on TI's interconnect development program.
He has been instrumental in the development of TI's 0.18um and 0.13um Copper interconnect system and has been
responsible for the fanout of this technology to TI's 200mm FAB's. He is currently a Program Manager in TI's ASIC
Internet Infrastructure Business Unit.
For a copy of the trasparencies click here
(almost 6.4M)
For any further information please contact:
Satish Lakshmanan
Texas Instruments Inc.
P.O.Box 660199, PFLC
Dallas, TX 75266-0199
email:s-lakshmanan1@ti.com
