Description

EDTM - a Brief History

Launched in 2017 in Toyama, Japan, and sponsored by the IEEE Electron Devices Society (EDS). EDTM is fast becoming a flagship conference of IEEE EDS, with expanded focus on Advanced Technology Manufacturing. In 2018, EDTM was successfully held in Kobe, Japan, and it was very well attended by more than 300 attendees and supported by close to 40 companies. EDTM is rapidly becoming a premier conference for the electron devices community, providing an unique forum to focus on research and development from leading universities and manufacturing companies worldwide on a broad range of device-related topics including materials, processes, devices, packaging, modeling, reliability, manufacturing, and yield. The conference location rotates among countries in Asia, coming to Singapore for the first time in 2019.

Mission of EDTM 2019

The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019 is a full four-day conference to be held in Singapore from March 12th to 15th, 2019, fully sponsored by the IEEE Electron Devices Society (EDS).
As semiconductor technology scaling challenges continues to grow, so should the industries collaborative efforts to overcome them must increase. The EDTM is intended to serve as a forum for the electron devices community to collaborate on topics ranging from devices, process/tools, materials, modeling/simulation, packaging and manufacturing, to create new and innovative technologies.

Call for paper

Important Dates

Draft paper submission deadline:2018-10-16

Topics of submission

We cordially invite you to submit papers for the 2019 IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2019). Papers are sought on any topic within the scope of the conference.

EDTM aims for highest quality, and all papers accepted would be subject to IEEE-EDS standard review processes and conference publishing guidelines.
Accepted and presented papers will be published in EDTM proceedings and will be included in IEEE Xplore. A selected number of high impact EDTM papers would be invited for the consideration of publication in the IEEE Journal of Electron Devices Society (J-EDS) as extended version of EDTM conference papers following the IEEE publication policy and J-EDS author guidelines.
Authors of accepted papers will be requested to submit the IEEE copyright form by due date. Details will be announced in a notification of acceptance.

Presentation formats of contributed papers are oral or poster, and authors can choose it in the process of online paper submission. However please note that the Technical Program Committee has the right to make a final decision on the type of presentation associated with each paper.

Topics for EDTM 2019

  1. Packaging

  2. Devices

  3. Manufacturing/Yield

  4. Process/Tools

  5. Materials

  6. Reliability/Modeling

Committee

Steering Committee
EDS Vice President of Technical Committees & Meetings (Chair) Ravi Todi GLOBALFOUNDRIES
EDS President-Elect Fernando Guarrin GLOBALFOUNDRIES
EDS President Samar Saha Prospicient Devices
EDS Junior Past President Albert Wang University of California, Riverside
EDS Treasurer Subramanian S. Iyer University of California, Los Angeles
Past General Chair Shuji Ikeda Tei Solutions
Past General Chair Hitoshi Wakabayashi Tokyo Institute of Technology
General Co-Chair Geok Ing Ng Nanyang Technological University
General Co-Chair MK Radhakrishnan NanoRel
 
Executive Committee
General Co-Chair Geok Ing Ng Nanyang Technological University
General Co-Chair MK Radhakrishnan NanoRel
Technical Program Chair Don Disney GLOBALFOUNDRIES
Support Relations Chair Edwin Teo Nanyang Technological University
Publicity Chair Xiao Gong National University of Singapore
Publicity Vice Chair Dennis Polla Agency for Science, Technology and Research 
Financial Chair Kenneth Lee Singapore-MIT Alliance for Research and Technology
Publication Chair Chuan Seng Tan Nanyang Technological University
Exhibition/Sponsorship Chair Aaron Thean National University of Singapore
Exhibition/Sponsorship Vice Chair Arjun Kumar Kanthimahanti Silterra
Local Arrangement Chair Kah Wee Ang National University of Singapore
Short Course/Tutorial Chair Nagarajan Raghavan Singapore University of Technology and Design 
Secretary Mary Teng A’Tenga C.E.
 
International Advisory Committee
International Advisory Chair Meyya Meyyappan (EDS President-Elect)
International Advisory Vice Chair Yoon Soon Fatt Nanyang Technological University
Pey Kin Leong Singapore University of Technology and Design
Andrew Wee National University of Singapore
Member Shu Ikeda Tei Solutions
Hitoshi Wakabayashi Tokyo Institute of Technology
Bin Zhao ON semiconductor
Mikael Ostling KTH
Stefan de Grant IMEC
Ramgopal Rao Indian Institute of Technology, Delhi
Kazunari Ishimaru Toshiba
Arokia Nathan Cambridge University
 
Technical Program Committee
Sub-Committee: Devices (Group IV)
Chair Naoto Horiguchi Imec
Vice-chair Yukinori Morita AIST
Members Kejun Xia NXP Semiconductors
Gong Xiao National University of Singapore
Minsoo Yoo SK Hynix
Yu Hongyu Southern University of Science and Tech
Masumi Saitoh Toshiba Memory Corp.
Hyungcheol Shin Seoul National University
Abhisek Dixit IIT Delhi
Sub-Committee: Devices (Not Group IV)
Chair Jong-Ho Lee Seoul National University
Vice-chair Carlo Reita CEA-LETI
Members Yi Yang Tsinghua University
Tian-Li Wu National Chiao Tung University
Navakanta Bhat Indian Institute of Science, Bangalore
Wang Hong Nanyang Technological University
Susthitha Menon UKM
 
Sub-Committee: Materials
Chair Iriya Muneta Tokyo Institute of Technology
Vice-chair Pei-Wen Li National Chiao Tung University
Members Paul Berger Ohio State University
  Kazuhito Matsukawa SUMCO
Yang Xu Zhejiang University
Hiroyasu Yamahara The University of Tokyo
Tsang Tony Nanyang Technological University
Saptarshi Das Pennsylvania State University
Zengfeng Di SIMIT
Chun-Jung Su National Nano Device Labs
 
 
Sub-Committee: Modeling
Chair Dondee Navarro Hiroshima University
Vice-Chair Risho Koh Renesas
Members Paul Lining Zhang Hong Kong University of Sci. and Tech.
Xian-Ping Chen Chongqing University
Yogesh Singh Chauhan Indian Institute of Technology, Kanpur
Takeshi Naito Toshiba Memory Corp.
Michael Loong Peng Tan Universiti Teknologi Malaysia
Darsen Lu National Cheng Kung University
Andreas Schenk ETH
Liang Gengchiau National University of Singapore
 
Sub-Committee: Reliability
Chair Mahadeva Iyer Natarajan GLOBALFOUNDRIES
Vice-Chair Nagarajan Raghavan SUTD
Members Muhammad Ashraf Alam Purdue University
Durga Misra New Jersey Inst. of Tech.
Kin Leong Pey Singapore University of Tech. and Design
Tibor Grasser TU Wien
Jiaw-Ren Shih TSMC
Runsheng Wang Peking University
Mayank Srivastava Indian Institute of Science, Bangalore
Yung-Huei Lee TSMC
Norhayati Binti Soin University of Malaya
Thomas Kauerauf Samsung
 
Sub-Committee: Process
Chair Makoto Miura Hitachi High-Technologies Corp.
Vice-chair Yasutoshi Okuno TSMC
Members Xiaojun Guo Shanghai Jiao Tong University
Kazuo Nojiri Lam Research Co., Ltd.
Yasushi Akasaka Tokyo Electron Technology Solutions Ltd.
Byoung Hun Lee Gwangju Inst. of Sci. and Tech.
Sean Kang Applied Materials
Keiichi Nakazawa Sony Semiconductor
Yao-Jen Lee NDL
Subhash Rustogi Silterra
Kah Wee Ang NUS
Saurabh Lodha IIT Bombay
 
Sub-Committee: Packaging
Chair Piyush Gupta Qualcomm
Vice-chair Kamal Sikka IBM
Members Yoichiro Kurita Toshiba
Jin Kim Google
Kyeong Sool Seong J-Devices
Chih Hang TUNG TSMC
Eric Beyne imec
Kamal Sikka IBM
Naoki Oka Applied Materials Japan, Inc
Kriss Lee Amkor
Andrew Tay SUTD
Jian Cai Tsinghua University
Mukta Farooq  
Jiann Min Chin AMD
 
Sub-Committee: Manufacturing
Chair Angelo Pinto Qualcomm
Vice-chair Tomasz Brozek PDF Solutions
Members William Nehrer Consultant
Sanjiv Mittal Applied Materials
Coming Chen Silicon Intellectual Property Technology
Keizo Hiraga Sony
Steve Poon Apple Inc.
Hein Mun Lam GLOBALFOUNDRIES
Rebecca Mih Lam Research Co., Ltd.
Kim Sang-Cheon LG Electronics

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Important dates

  • Conference Dates

    12 Mar.

    2019

    TO

    15 Mar.

    2019

  • 16 Oct.

    2018

    Draft paper submission deadline

Contact information

  • eging@ntu.edu.sg
  • edtm2019.sec@atenga.sg

Sponsored By

  • IEEE Electron Devices Society