Description
EDTM - a Brief History
Launched in 2017 in Toyama, Japan, and sponsored by the IEEE Electron Devices Society (EDS). EDTM is fast becoming a flagship conference of IEEE EDS, with expanded focus on Advanced Technology Manufacturing. In 2018, EDTM was successfully held in Kobe, Japan, and it was very well attended by more than 300 attendees and supported by close to 40 companies. EDTM is rapidly becoming a premier conference for the electron devices community, providing an unique forum to focus on research and development from leading universities and manufacturing companies worldwide on a broad range of device-related topics including materials, processes, devices, packaging, modeling, reliability, manufacturing, and yield. The conference location rotates among countries in Asia, coming to Singapore for the first time in 2019.
Mission of EDTM 2019
The 3rd Electron Devices Technology and Manufacturing (EDTM) Conference 2019 is a full four-day conference to be held in Singapore from March 12th to 15th, 2019, fully sponsored by the IEEE Electron Devices Society (EDS).
As semiconductor technology scaling challenges continues to grow, so should the industries collaborative efforts to overcome them must increase. The EDTM is intended to serve as a forum for the electron devices community to collaborate on topics ranging from devices, process/tools, materials, modeling/simulation, packaging and manufacturing, to create new and innovative technologies.
Call for paper
Important Dates
Draft paper submission deadline：2018-10-16
Topics of submission
We cordially invite you to submit papers for the 2019 IEEE Electron Devices Technology and Manufacturing Conference (EDTM 2019). Papers are sought on any topic within the scope of the conference.
EDTM aims for highest quality, and all papers accepted would be subject to IEEE-EDS standard review processes and conference publishing guidelines.
Accepted and presented papers will be published in EDTM proceedings and will be included in IEEE Xplore. A selected number of high impact EDTM papers would be invited for the consideration of publication in the IEEE Journal of Electron Devices Society (J-EDS) as extended version of EDTM conference papers following the IEEE publication policy and J-EDS author guidelines.
Authors of accepted papers will be requested to submit the IEEE copyright form by due date. Details will be announced in a notification of acceptance.
Presentation formats of contributed papers are oral or poster, and authors can choose it in the process of online paper submission. However please note that the Technical Program Committee has the right to make a final decision on the type of presentation associated with each paper.
Topics for EDTM 2019
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Packaging
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Devices
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Manufacturing/Yield
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Process/Tools
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Materials
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Reliability/Modeling
Committee
| Steering Committee | ||
|---|---|---|
| EDS Vice President of Technical Committees & Meetings (Chair) | Ravi Todi | GLOBALFOUNDRIES |
| EDS President-Elect | Fernando Guarrin | GLOBALFOUNDRIES |
| EDS President | Samar Saha | Prospicient Devices |
| EDS Junior Past President | Albert Wang | University of California, Riverside |
| EDS Treasurer | Subramanian S. Iyer | University of California, Los Angeles |
| Past General Chair | Shuji Ikeda | Tei Solutions |
| Past General Chair | Hitoshi Wakabayashi | Tokyo Institute of Technology |
| General Co-Chair | Geok Ing Ng | Nanyang Technological University |
| General Co-Chair | MK Radhakrishnan | NanoRel |
| Executive Committee | ||
| General Co-Chair | Geok Ing Ng | Nanyang Technological University |
| General Co-Chair | MK Radhakrishnan | NanoRel |
| Technical Program Chair | Don Disney | GLOBALFOUNDRIES |
| Support Relations Chair | Edwin Teo | Nanyang Technological University |
| Publicity Chair | Xiao Gong | National University of Singapore |
| Publicity Vice Chair | Dennis Polla | Agency for Science, Technology and Research |
| Financial Chair | Kenneth Lee | Singapore-MIT Alliance for Research and Technology |
| Publication Chair | Chuan Seng Tan | Nanyang Technological University |
| Exhibition/Sponsorship Chair | Aaron Thean | National University of Singapore |
| Exhibition/Sponsorship Vice Chair | Arjun Kumar Kanthimahanti | Silterra |
| Local Arrangement Chair | Kah Wee Ang | National University of Singapore |
| Short Course/Tutorial Chair | Nagarajan Raghavan | Singapore University of Technology and Design |
| Secretary | Mary Teng | A’Tenga C.E. |
| International Advisory Committee | ||
| International Advisory Chair | Meyya Meyyappan | (EDS President-Elect) |
| International Advisory Vice Chair | Yoon Soon Fatt | Nanyang Technological University |
| Pey Kin Leong | Singapore University of Technology and Design | |
| Andrew Wee | National University of Singapore | |
| Member | Shu Ikeda | Tei Solutions |
| Hitoshi Wakabayashi | Tokyo Institute of Technology | |
| Bin Zhao | ON semiconductor | |
| Mikael Ostling | KTH | |
| Stefan de Grant | IMEC | |
| Ramgopal Rao | Indian Institute of Technology, Delhi | |
| Kazunari Ishimaru | Toshiba | |
| Arokia Nathan | Cambridge University | |
| Technical Program Committee | ||
| Sub-Committee: Devices (Group IV) | ||
| Chair | Naoto Horiguchi | Imec |
| Vice-chair | Yukinori Morita | AIST |
| Members | Kejun Xia | NXP Semiconductors |
| Gong Xiao | National University of Singapore | |
| Minsoo Yoo | SK Hynix | |
| Yu Hongyu | Southern University of Science and Tech | |
| Masumi Saitoh | Toshiba Memory Corp. | |
| Hyungcheol Shin | Seoul National University | |
| Abhisek Dixit | IIT Delhi | |
| Sub-Committee: Devices (Not Group IV) | ||
| Chair | Jong-Ho Lee | Seoul National University |
| Vice-chair | Carlo Reita | CEA-LETI |
| Members | Yi Yang | Tsinghua University |
| Tian-Li Wu | National Chiao Tung University | |
| Navakanta Bhat | Indian Institute of Science, Bangalore | |
| Wang Hong | Nanyang Technological University | |
| Susthitha Menon | UKM | |
| Sub-Committee: Materials | ||
| Chair | Iriya Muneta | Tokyo Institute of Technology |
| Vice-chair | Pei-Wen Li | National Chiao Tung University |
| Members | Paul Berger | Ohio State University |
| Kazuhito Matsukawa | SUMCO | |
| Yang Xu | Zhejiang University | |
| Hiroyasu Yamahara | The University of Tokyo | |
| Tsang Tony | Nanyang Technological University | |
| Saptarshi Das | Pennsylvania State University | |
| Zengfeng Di | SIMIT | |
| Chun-Jung Su | National Nano Device Labs | |
| Sub-Committee: Modeling | ||
| Chair | Dondee Navarro | Hiroshima University |
| Vice-Chair | Risho Koh | Renesas |
| Members | Paul Lining Zhang | Hong Kong University of Sci. and Tech. |
| Xian-Ping Chen | Chongqing University | |
| Yogesh Singh Chauhan | Indian Institute of Technology, Kanpur | |
| Takeshi Naito | Toshiba Memory Corp. | |
| Michael Loong Peng Tan | Universiti Teknologi Malaysia | |
| Darsen Lu | National Cheng Kung University | |
| Andreas Schenk | ETH | |
| Liang Gengchiau | National University of Singapore | |
| Sub-Committee: Reliability | ||
| Chair | Mahadeva Iyer Natarajan | GLOBALFOUNDRIES |
| Vice-Chair | Nagarajan Raghavan | SUTD |
| Members | Muhammad Ashraf Alam | Purdue University |
| Durga Misra | New Jersey Inst. of Tech. | |
| Kin Leong Pey | Singapore University of Tech. and Design | |
| Tibor Grasser | TU Wien | |
| Jiaw-Ren Shih | TSMC | |
| Runsheng Wang | Peking University | |
| Mayank Srivastava | Indian Institute of Science, Bangalore | |
| Yung-Huei Lee | TSMC | |
| Norhayati Binti Soin | University of Malaya | |
| Thomas Kauerauf | Samsung | |
| Sub-Committee: Process | ||
| Chair | Makoto Miura | Hitachi High-Technologies Corp. |
| Vice-chair | Yasutoshi Okuno | TSMC |
| Members | Xiaojun Guo | Shanghai Jiao Tong University |
| Kazuo Nojiri | Lam Research Co., Ltd. | |
| Yasushi Akasaka | Tokyo Electron Technology Solutions Ltd. | |
| Byoung Hun Lee | Gwangju Inst. of Sci. and Tech. | |
| Sean Kang | Applied Materials | |
| Keiichi Nakazawa | Sony Semiconductor | |
| Yao-Jen Lee | NDL | |
| Subhash Rustogi | Silterra | |
| Kah Wee Ang | NUS | |
| Saurabh Lodha | IIT Bombay | |
| Sub-Committee: Packaging | ||
| Chair | Piyush Gupta | Qualcomm |
| Vice-chair | Kamal Sikka | IBM |
| Members | Yoichiro Kurita | Toshiba |
| Jin Kim | ||
| Kyeong Sool Seong | J-Devices | |
| Chih Hang TUNG | TSMC | |
| Eric Beyne | imec | |
| Kamal Sikka | IBM | |
| Naoki Oka | Applied Materials Japan, Inc | |
| Kriss Lee | Amkor | |
| Andrew Tay | SUTD | |
| Jian Cai | Tsinghua University | |
| Mukta Farooq | ||
| Jiann Min Chin | AMD | |
| Sub-Committee: Manufacturing | ||
| Chair | Angelo Pinto | Qualcomm |
| Vice-chair | Tomasz Brozek | PDF Solutions |
| Members | William Nehrer | Consultant |
| Sanjiv Mittal | Applied Materials | |
| Coming Chen | Silicon Intellectual Property Technology | |
| Keizo Hiraga | Sony | |
| Steve Poon | Apple Inc. | |
| Hein Mun Lam | GLOBALFOUNDRIES | |
| Rebecca Mih | Lam Research Co., Ltd. | |
| Kim Sang-Cheon | LG Electronics | |