Description
Materials and technologies - semiconductor and dielectric materials - quantum heterostructures - MS and MIS structures - nanostructures and nanotubes, low-dimensional structures - organic electronics Structures and devices - Si-based heterostructure devices - III-V and III-N heterostructure devices - quantum and resonance devices, microwave devices, nanodevices - lasers and photodetectors - power electronics Characterization, modelling and simulation - 2-D and 3-D process, structure and device simulation - heterostructure device modelling - structural, optical and electrical characterization of materials, structures and devices - reliability evaluation and modelling Sensors and microsystems - advanced concepts in lithography, plasma etching and deposition techniques - design and fabrication - surface and bulk micromachining - micro(nano)mechanical structures, micro(nano)electro-mechanical systems (MEMS, NEMS) - SMART Sensors - sensor characterization, modelling and simulation
Call for paper
Important Dates
Draft paper submission deadline：2018-06-08
Please check the above Conference Description for CFP information.
Any questions, please contact the conference organizer. The contact(s) can be found on the right Contact .