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Technical Seminar


Challenges in Serial Electrical Interconnects at 5 to 10 Gb/s and Beyond

DATE/TIME  Thursday, March 29, 2007 (4:30pm to 6:00pm)
PLACE  AMD Fort Collins Campus (Fort Collins, CO)
DIRECTIONS

From I-25, take Harmony Road Exit (Exit 265) westbound, and enter AMD campus on right immediately following Harmony/Ziegler intersection.  AMD is located on the NW corner of Harmony Road and Ziegler Road.  Proceed to 3rd floor for escort to seminar auditorium.  Non-AMD employees:  please arrive at 4:15pm for security sign-in and escort.

COST    Free.  As always, food & drinks will be provided.
RSVP    Send e-mail to Tin Tin Wee at tintin.wee@amd.com.

ABSTRACT

Modern high-performance computing and networking system designs are pushing data
rates for inter-chip communications to unprecedented speeds.  Both on-board buses such
as CPU-Memory and CPU-Coprocessor and backplane buses in blade systems, storage,
and networking gear are being increased in data rate to a range of 5 to 10Gb/s in modern system designs.  These high data rates require the design of advanced equalization I/O cores which are capable of operating in the challenging high frequency channel with higher loss, higher crosstalk, and more reflection distortion compared to lower data rate systems.  This talk will cover highlights from a study of equalization performance on 10Gb/s IEEE 802.3ap backplanes presented by the author at the 2006 ISSCC ATAC.  Topics covered include an overview of the challenges presented by the electrical interconnect  channel at high data rates, including channel characteristics of a range of informative backplanes  presented to the IEEE 802.3ap "Ethernet over Backplane" standard.   Both transmitter and receiver  (typically FFE and DFE) equalization will be compared and contrasted.  The system level
architecture  and performance of a modern 10Gb/s I/O core which realizes FFE and DFE equalization will be discussed.  An overview of behavioral link simulation will be presented, illustrating components of a typical link simulation tool along with important I/O core parameters which need to be modeled to accurately predict system performance.  Example simulation results which summarize expected performance as a function of various system design parameters such as FFE and DFE length and I/O core degradations are given with a focus on the IEEE 802.3ap application channels.  Conclusions are drawn summarizing major challenges facing modern high data rate I/O system designs.

PRESENTATION SLIDES  pdf
REFERENCES

TROY BEUKEMA (IBM Research, Yorktown Heights, NY)

Troy Beukema received the BSEE and MSEE degrees from Michigan Technological University, Houghton, in 1984 and 1988, respectively.  His industry experience includes digital and analog circuit design and firmware development at Hewlett-Packard in the area of communications test equipment from 1984 to 1988, and digital signal processing algorithm design and firmware development at Motorola applied to digital wireless communications systems from 1989 to 1995.  In 1996, he joined IBM Research in Yorktown Heights, NY, where he is involved in both wireless and wireline communication systems research.  His most recent activity at IBM focuses on decision-feedback-equalization based transceiver designs for IBM high speed serial I/O ASIC cores which operate in the 5Gb/s to 10Gb/s+ range.

As part of this effort, he works closely with both IBM ASIC development groups and colleagues in research at Yorktown in the design of receiver analog front end architecture, clock-and-data recovery algorithms, and equalization adaptation algorithms.  He has written a fast behavioral serial link simulator which is in use at IBM research and product development groups to both assist in the development of advanced I/O core architectures and provide a tool to system level designers for analysis of end-to-end serial link performance for a wide range of high speed I/O applications.


PHOTOS  Courtesy of Tin Tin Wee