COMMITTEE

 
Steering Committee
EDS Vice President of Technical Committees & Meetings (Chair)Ravi TodiWestern Digital
EDS PresidentFernando GuarrinGLOBALFOUNDRIES
EDS President-ElectMeyya MeyyappanNASA
EDS Jr Past PresidentSamar SahaProspicient Devices
EDS Sr Past President Albert WangUniversity of California, Riverside
EDS Treasurer Subramanian S. Iyer University of California, Los Angeles
Past General Chair Shuji Ikeda Tei Solutions
Past General Chair Hitoshi Wakabayashi Tokyo Institute of Technology
General Co-Chair Geok Ing Ng Nanyang Technological University
General Co-Chair MK Radhakrishnan NanoRel
 
Executive Committee
General Co-Chair Geok Ing Ng Nanyang Technological University
General Co-Chair MK Radhakrishnan NanoRel
Technical Program Chair Don Disney Infineon
Support Relations Chair Edwin Teo Nanyang Technological University
Publicity Chair Xiao Gong National University of Singapore
Publicity Vice Chair Dennis Polla Agency for Science, Technology and Research 
Financial Chair Kenneth Lee Singapore-MIT Alliance for Research and Technology
Publication Chair Chuan Seng Tan Nanyang Technological University
Exhibition/Sponsorship Chair Aaron Thean National University of Singapore
Tech Program Co-Chair Arjun Kumar Kanthimahanti Silterra
Local Arrangement Chair Kah Wee Ang National University of Singapore
Short Course/Tutorial Chair Nagarajan Raghavan Singapore University of Technology and Design 
Secretary Mary Teng A’Tenga C.E.
 
International Advisory Committee
International Advisory ChairMeyya Meyyappan (EDS President-Elect)
International Advisory Vice Chair Yoon Soon Fatt Nanyang Technological University
Pey Kin LeongSingapore University of Technology and Design
Andrew WeeNational University of Singapore
Member Shu Ikeda Tei Solutions
Hitoshi Wakabayashi Tokyo Institute of Technology
Bin Zhao ON semiconductor
Mikael Ostling KTH
Stefan de Grant IMEC
Ramgopal Rao Indian Institute of Technology, Delhi
Kazunari Ishimaru Toshiba
Arokia Nathan Cambridge University
 
Technical Program Committee
Sub-Committee: Devices (Group IV)
ChairNaoto HoriguchiImec
Vice-chairYukinori MoritaAIST
MembersKejun XiaNXP Semiconductors
Gong XiaoNational University of Singapore
Minsoo YooSK Hynix
Yu HongyuSouthern University of Science and Tech
Masumi SaitohToshiba Memory Corp.
Hyungcheol Shin Seoul National University
Abhisek Dixit IIT Delhi
Sub-Committee: Devices (Not Group IV)
Chair Jong-Ho Lee Seoul National University
Vice-chair Carlo Reita CEA-LETI
Members Yi Yang Tsinghua University
Tian-Li Wu National Chiao Tung University
Navakanta Bhat Indian Institute of Science, Bangalore
Wang Hong Nanyang Technological University
Susthitha Menon UKM
 
Sub-Committee: Materials
ChairIriya Muneta Tokyo Institute of Technology
Vice-chair Pei-Wen Li National Chiao Tung University
Members Paul Berger Ohio State University
Kazuhito Matsukawa SUMCO
Yang Xu Zhejiang University
Hiroyasu Yamahara The University of Tokyo
Tsang Tony Nanyang Technological University
Saptarshi Das Pennsylvania State University
Zengfeng DiSIMIT
Chun-Jung SuNational Nano Device Labs
 
 
Sub-Committee: Modeling
ChairDondee NavarroHiroshima University
Vice-ChairRisho KohRenesas
Members Paul Lining Zhang Hong Kong University of Sci. and Tech.
Xian-Ping Chen Chongqing University
Yogesh Singh Chauhan Indian Institute of Technology, Kanpur
Takeshi Naito Toshiba Memory Corp.
Michael Loong Peng Tan Universiti Teknologi Malaysia
Darsen Lu National Cheng Kung University
Andreas Schenk ETH
Liang Gengchiau National University of Singapore
 
Sub-Committee: Reliability
ChairMahadeva Iyer NatarajanGLOBALFOUNDRIES
Vice-Chair Nagarajan Raghavan SUTD
Members Muhammad Ashraf Alam Purdue University
Durga Misra New Jersey Inst. of Tech.
Kin Leong Pey Singapore University of Tech. and Design
Tibor Grasser TU Wien
Jiaw-Ren Shih TSMC
Runsheng Wang Peking University
Mayank Srivastava Indian Institute of Science, Bangalore
Yung-Huei Lee TSMC
Norhayati Binti Soin University of Malaya
Thomas Kauerauf Samsung
 
Sub-Committee: Process
Chair Makoto Miura Hitachi High-Technologies Corp.
Vice-chair Yasutoshi Okuno TSMC
Members Xiaojun Guo Shanghai Jiao Tong University
Kazuo Nojiri Lam Research Co., Ltd.
Yasushi Akasaka Tokyo Electron Technology Solutions Ltd.
Byoung Hun Lee Gwangju Inst. of Sci. and Tech.
Sean Kang Applied Materials
Keiichi Nakazawa Sony Semiconductor
Yao-Jen Lee NDL
Subhash Rustogi Silterra
Kah Wee Ang NUS
Saurabh Lodha IIT Bombay
 
Sub-Committee: Packaging
Chair Piyush Gupta Qualcomm
Vice-chair Kamal Sikka IBM
Members Yoichiro Kurita Toshiba
Jin Kim Google
Chih Hang TUNG TSMC
Eric Beyne imec
Kamal Sikka IBM
Naoki Oka Applied Materials Japan, Inc
Kriss Lee SK Hynix
Andrew Tay SUTD
Jian Cai Tsinghua University
Mukta Farooq  
Jiann Min Chin AMD
 
Sub-Committee: Manufacturing
Chair Angelo Pinto Qualcomm
Vice-chair Tomasz Brozek PDF Solutions
Members William Nehrer Consultant
Sanjiv Mittal Applied Materials
Coming Chen Silicon Intellectual Property Technology
Keizo Hiraga Sony
Steve Poon Apple Inc.
Rebecca Mih Lam Research Co., Ltd.
Kim Sang-Cheon LG Electronics