| 1. Si Device |
| Yuri Masuoka |
Samsung Electronics |
| |
| 2. Non-Si Device |
| Prof Sung Hun Jin |
Incheon National University |
| Prof Ki Jun Yu |
Yonsei University |
| Prof. Donguk Nam |
Nanyang Technological University |
| |
| 3. Materials |
| Suman Datta |
University of Notre Dame |
| Navakanta Bhat |
Indian Institute of Science |
| Yasumitsu Miyata |
Department of Physics, Tokyo Metropolitan University, Japan |
| |
| 4. Process |
| Masaru Kurihara |
Hitachi |
| Aaron Thean |
National University of Singapore |
| Perrine Batude |
CEA-LETI |
| Takeshi Nogami |
IBM |
| |
| 5. Modeling |
| Shaloo Rakheja |
NYU |
| Pierpaolo Palestri |
University of Udine |
| Kenichiro Sonoda |
Renesas |
| Saurabh Lodha |
IIT Bombay |
| Shigeyasu Uno |
Ritsumeikan University |
| |
| 6. Reliability |
| Prof. Gaudenzio Meneghesso |
University of Padova |
| Andrew Kim |
IBM |
| Kin Leong Pey |
Singapore University of Technology and Design |
| Jacopo Franco |
imec |
| Maria Toledano |
GLOBALFOUNDRIES |
| Albert Wang |
University of California Riverside |
| Chee Lip Gan |
Nanyang Technological University |
| |
| 7. Packaging |
| Yonghoon Kim |
Samsung Electro-Mechanical |
| Prof. Tadahiro Kuroda |
Keio University |
| Milind Shah |
Qualcomm |
| Hideyuki Nasu |
Furukawa Electric Co., Ltd |
| Hiroyuki Mori |
IBM |
| Luke England |
GLOBALFOUNDRIES |
| |
| 8. Manufacturing |
| Andrzej Strojwas |
Carnegie-Mellon University (CMU) |
| Hardy Chen |
KLA-Tencor |
| Julien Ryckaert |
IMEC |
| Ya-Chieh Lai |
Cadence |
| Patrick Lo Guo-Qiang |
IBM |
| |
