Group 1: Medical Ultrasonics
Vice Chair
Georg Schmitz
Ruhr–Universitaet
Bochum, Germany

Members

• Ayache Bouakaz, INSERM, France
• Lori Bridal, University Pierre and Marie Curie, France
• Charles A. Cain, University of Michigan, USA
• Jean-Yves Chapelon, INSERM, France
• Paul A. Dayton, University North Carolina/NCSU, USA
• Nico de Jong, Erasmus Medical Centre, The Netherlands
• Chris de Korte, Catholic University of Nijmegen, The Netherlands
• Jan Dhooge, Catholic University of Leuven, Belgium
• Emad Ebbini, University of Minnesota, USA
• Stanislav Emelianov, Georgia Institute of Technology and Emory University, USA
• Kathy Ferrara, University of California Davis, USA
• Stuart Foster, University of Toronto, Canada
• Steven Freear, University of Leeds, UK
• Caterina Gallipi, University of North Carolina, USA
• James Greenleaf, Mayo Clinic, USA
• Christopher Hall, Philips Research, USA
• Peter Hoskins, University of Edinburgh, UK
• John Hossak, University of Virginia, USA
• Kullervo Hynynen, University of Toronto, Canada
• Jørgen Arendt Jensen, Technical University Denmark , Denmark
• Hiroshi Kanai, Tohoku University, Japan
• Jeff Ketterling, Riverside Research , USA
• Michael Kolios, Ryerson University, Canada
• Elisa Konofagou, Columbia University, USA
• Nobuki Kudo, Hokkaido University, Japan
• Pai-Chi Li, National Taiwan University, Taiwan
• Hervé Liebgott, CREATIS, France
• Jian-yu Lu, University of Toledo, USA
• Tom Matula, University of Washington, USA
• James G. Miller, Washington University, USA
• Helen Mulvana, University of Glasgow, UK
• Kathy Nightingale, Duke University, USA
• Svetoslav Nikolov, BK Medical, Denmark
• William D. O'Brien, University of Illinois, USA
• Michael Oelze, University of Illinois, USA
• Georg Schmitz, Ruhr-Universität Bochum, Germany
• Ralf Seip, Philips Research, USA
• Mickael Tanter, INSERM, France
• Kai Thomenius, GE Corporate R&D, USA
• Hans Torp, University of Science and Technology, Norway
• Piero Tortoli, University Firenze, Italy
• Ton van der Steen, Erasmus Medical Centre, The Netherlands
• Kendall Waters, Silicon Valley Medical Instruments, USA
• Keith Wear, Food and Drug Administration, USA
• Wilko G. Wilkening, Siemens Medical Solutions , USA
• Chih-Kuang Yeh, National Tsing Hua University, Taiwan
• Hairong Zheng, Shenzhen Institutes of Advanced Technology, China
  

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Group 2: Sensors, NDE, and Industrial Application
Vice Chair
David Greve
Carnegie Mellon University
USA

Members

• Robert C. Addison, Rockwell Science Center
• Walter Arnold, Fraunhofer Institute for NDT
• James Blackshire, Air Force Research Laboratory
• Ramazan Demirli, Villanova University
• James Friend,UCSD
• Eric S. Furgason, Purdue University
• David Greve, Carnegie Mellon University
• Edward Haeggstrom, University of Helsinki
• Jacqueline Hines, Applied Sensor R&D Corporation
• Patrick Johnston, NASA Langley Research Center
• Lawrence W. Kessler, Sonoscan Inc.
• Pierre T. Khuri-Yakub, Stanford University
• Mario Kupnik, Technische Universität Darmstadt
• Roman Maev, University of Windsor
• Kentaro Nakamura, Tokyo Institute of Technology
• Erdal Oruklu, Illinois Institute of Technology
• Nishal Ramadas,Elster Instromet
• Jafar Saniie, Illinois Institute of Technology
• Gangbing Song,University of Houston
• Bernhard Tittman, Pennsylvania State University
• Jiromaru Tsujino, Kanagawa University
• John F. Vetelino, University of Maine
• Paul Wilcox, University of Bristol
• William Wright, University College Cork
• Donald E. Yuhas, Industrial Measurement Systems
• Jennifer Michaels,Georgia Tech

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Group 3: Physical Acoustics
Vice Chair
Vincent Laude
Centre National de la Recherche
Scientifique, France

Members

• Arthur Ballato, Clemson University, USA
• Anne Bernassau, University of Glasgow, UK
• Jan Brown, JB Consulting, USA
• Charles Courtney, University of Bath, UK
• Emmanuel Defay, CRP G. Lippmann, Luxemburg
• Jianke Du, Shanghai Jiaotong University, China
• David Feld, Avago Technologies, USA
• Tao Han, Shanghai Jiao Tong University, China
• Fred Hickernell, Motorolla, Inc., USA
• Takefumi Kanda, Okayama University, Japan
• Eun Sok Kim, University of Southern California, USA
• Minoru K. Kurosawa, Tokyo Institute of Technology, Japan
• Amit Lal, Cornell University, USA
• John Larson, Avago Technologies, USA
• Vincent Laude, FEMTO-ST / CNRS, France
• Andreas Mayer, Hochschule Offenburg, Germany
• Farid G. Mitri, Chevron, USA
• Roy H. Olsson III, Sandia National Laboratories, USA
• Mihir Patel, Schlumberger-Doll Research,, USA
• Yan Pennec, IEMN / Universite de Lille 1, France
• Susan Schneider, Marquette University, USA
• Bikash Sinha, Schlumberger-Doll Research,, USA
• Masaya Takasaki, Muroran Institute of Technology, Japan
• Koen W.A. Van Dongen, Delft University of Technology, Netherlands
• Jorg Wallaschek, Leibniz Universitat Hannover, Germany
• Ji Wang, Ningbo University, China
• Tsung-Tsong Wu, National Taiwan University, Taiwan
• Takahiko Yanagitani, Nagoya Institute of Technology, Japan
• Yook-Kong Yong, Rutgers University, USA
• Jiun Der Yu, Epson Research & Development Inc., USA

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Group 4: Microacoustics - SAW, FBAR, MEMS
Vice Chair
Karl Wagner
TDK Corporation
Munich, Germany

Members

• Ben Abbott, Qorvo Inc. , USA
• Robert Aigner, Qorvo Inc. , USA
• Sylvain Ballandras, freq 'n' sys SAS, France
• Kushal Bhattacharjee, Qorvo Inc. , USA
• Sunil Bhave, Cornell University, USA
• Sergey Biryukov, IFW Dresden, Germany
• Paul Bradley, Avago Technologies, USA
• Jidong Dai, Murata Electronics, Inc., USA
• Omar Elmazria, Universite de Lorraine, France
• Gernot Fattinger, Qorvo Inc., USA
• Gerhard Fischerauer, University of Bayreuth, Germany
• Ken-ya Hashimoto, Chiba University, Japan
• Shitang He, IACAS, China
• Michio Kadota, Tohoku University, Japan
• Jyrki Kaitila, Avago Technologies, Germany
• Kimmo Kokkonen, Aalto University, Finland
• Jan Kuypers, Qorvo Inc. , USA
• Don Malocha, University of Central Florida, USA
• Hiroyuki Nakamura, Skyworks-Panasonic Corp., Japan/USA
• Natalya Naumenko, Nat. University of Science & Techology MISIS, Russia
• Tuomas Pensala, VTT, Finland
• Mauricio Pereira da Cunha, University of Maine, USA
• Maximilian Pitschi, TDK Corporation, Germany
• Leonard Reindl, Albert-Ludwigs-University Freiburg, Germany
• Richard Ruby, Avago Technologies, USA
• Marc Solal, Qorvo, Inc , USA
• Shuji Tanaka, Tohoku University, Japan
• Masanori Ueda, Taiyo Yuden, Japan
• Karl Wagner, TDK Corporation, Germany
• Robert Weigel, University of Erlangen-Nuremberg, Germany
• Sergei Zhgoon, National Research University, Russia

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Group 5: Transducers and Transducer Materials
Vice Chair
Sandy Cochran
University of Dundee
UK

Members

• Sandy Cochran, University of Dundee, UK
• David Cowell, University of Leeds, UK
• Christopher Daft, River Sonic Solutions, USA
• Loriann Davidsen, Philips Healthcare , USA
• Levent Degertekin, Georgia Institute of Technology, USA
• Christine Démoré, University of Dundee, UK
• Charles Emery, Ulthera Inc., USA
• Arif Sanli Ergun, TOBB University, Turkey
• Lynn Ewart-Paine, NUWC, USA
• Tomas Gomez, CSIC, Madrid, Spain
• Anne-Christine Hladky, Institut Supérieur d'Electronique et du Numérique, France
• Xiaoning Jiang, North Carolina State University, USA
• Ho-yong Lee, Ceracomp Co., Ltd, Korea
• Reinhard Lerch, Friedrich-Alexander-Universität Erlangen-Nuremberg, Germany
• Richard O'Leary, University of Strathclyde, UK
• Omer Oralkan, North Carolina State University, USA
• Wei Ren, Xi’an Jiaotong University, China
• Paul Reynolds, uBeam, USA
• Yongrae Roh, Kyungpook National University, Korea
• Ahmad Safari, Rutgers University, USA
• Jean-Francois Saillant, Areva, France
• Mark Schafer, Sonic Tech Inc., USA
• Scott Smith, GE Global Research, USA
• Wallace Smith, Office of Naval Research, USA
• Yasuhito Takeuchi, Kagoshima University, Japan
• Susan Trolier-McKinstry, Pennsylvania State University, USA
• Jian Yuan, Philips Shanghai Apex, USA
• Shujun Zhang, Pennsylvania State University, USA
• Qifa Zhou, University of Southern California, USA