2005 IEEE International Ultrasonics Symposium-Technical Program Committee

TECHNICAL PROGRAM COMMITTEE

GROUP 1: Medical Ultrasonics
Vice Chair: Stanislav Emelianov: Univeristy of Texas of Austin, USA

Olivier Basset: INSA, France
Geneviève Berger: Laboratorie Imagerie Parametrique, France
Richard Chiao: Ultrasound Group, Siemens Medical Solutions, USA
Lawrence A. Crum: University of Washington, USA
Emad Ebbini: University of Minnesota, USA
Helmut Emert: Electrical Engineering Department, Ruhr University, Germany
David Evans: Department of Medical Physics, Leicester Royal Infirmary, UK
Kathy Ferrara: Biomedical Engineering, University of California, USA
Stuart Foster: Department of Medical Physics, Sunnybrook Health Sciences Centre, Canada
James Greenleaf: Ultrasound Research, Mayo Clinic, USA
John Hossack, Department of Biomedical Engineering, School of Engineering & Applied Sciences, University of Virginia, USA
Kullervo Hynynen: Brigham and Women's Hospital, USA
Peter Hoskins: Senior Research Fellow, Medical Physics, The University of Edinburgh, Scotland
Michael F. Insana: Biomedical Engineering, University of California, USA
Jorgen Jensen: Department of Information Technology, Technical University of Denmark
Nico de Jong: Biomedical Engineering, Erasmus University Rotterdam, The Netherlands
Hiroshi Kanai: Tohoku University, Japan
Jian-yu Lu: The University of Toledo, USA
Leonardo Masotti: Dipartimento di Ingegneria Elettronica, University di Firenze, Italy
James G. Miller: Physics Department, Washington University, USA
Kathy Nightingale: Biomedical Engineering Department, Duke University, USA
William O'Brien: Director of Bioacoustics Research Lab, Department of Electrical & Computer Engineering, University of Illinois, USA
Helen Routh: Philips Research, USA
Ton van der Steen: Head of Biomedical Engineering, Erasmus University Rotterdam, The Netherlands
Tom Thomas: Siemens
Kai Thomenius: GE CRD, USA
Peirro Tortoli: Electronic Engineering Department, University of Florence, Italy
Keith Wear: FDA Center for Devices and Radiological Health, USA

GROUP 2: Sensors, NDE, and Industrial Application
Vice Chair: Jafar Saniie: Department of Electrical & Computer Engineering, Illinois Institute of Technology, USA

Robert C. Addison: Rockwell Science Center, USA
Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
Narendra K. Batra
Eric S. Furgason: School of Electrical & Computer Engineering, Purdue University, USA
Donna C. Hurley: National Institute of Standards & Technology, USA
David A. Hutchins: School of Engineering, University of Warwick, England
Bernhard Jakoby: Institute of Industrial Electronics and Material Science, Vienna University of Technology, Austria
Lawrence W. Kessler: Sonoscan Inc., USA
Pierre T. Khuri-Yakub: Stanford University, USA
Jun-ishi Kushibike: Department of Electrical Engineering, Graduate School of Engineering, Tohoku University, Japan
Lawrence C. Lynnworth: Chief Technologist, GE Panametrics, USA
Roman Gr. Maev: Professor & Director, Center for Imaging Research & Advanced Material Characterization, Department of Physics, University of Windsor, Canada
Massimo Pappalardo: Lab of Acustoelectronics, Dipartimento di Ingegneria Elettronica, University di Roma TRE, Italy
Tony Sinclair: Professor of Mechanical & Industrial Engineering, Department of Mechanical Engineering, University of Toronto, Canada
Bernhard R. Tittman: Department of Engineering & Mechanics, Pennsylvania State University, USA
Jiromaru Tsujino: Faculty of Engineering, Kanagawa University, Japan
Donald E. Yuhas: Industrial Measurement Systems, Inc., USA
John F. Vetelino: Lab for Surface Science & Technology, University of Maine, USA

GROUP 3: Physical Acoustics
Vice Chair: Kenneth Lakin: TFR Technologies, Inc., USA

Art Ballato: Chief Scientist, US Army CECOM RDEC AMSEL-RD-CS, USA
Mack Brezaeale: Department of Physics, University of Mississippi, USA
Jan Brown: JB Consulting, USA
David Hecht
Fred Hickernell
Amit Lal: Assistant Professor, School of Electrical & Computer Engineering, Cornell University, USA
John Larson
Moises Levy: Department of Physics, Naples, Florida, USA
George Mansfield: Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Russia
Kiyoshi Nakamura: Department of Electrical & Communication Engineering, Graduate School of Engineering, Tohuku University, Japan
Valeri Proklov: Institute of Radio Engineering & Electricity, Russia
Edgar Schmidhammer
Susan Schnieder: Department of Electrical & Computer Engineering, Marquette University, USA
Bikash Sinha, Schlumberger-Doll Research, USA
Yook-Kong Yong: Department of Civil & Environmental Engineering, Rutgers University, USA
John Vig: US Army CECOM, AMSEL-RD-C2-PT, USA
Smaine Zeroug: Program Manager, Schlumberger-Doll Research, USA

GROUP 4: Surface Acoustic Waves
Vice Chair: Don Malocha, School of Electrical Engineering & Computer Science, University of Central Florida, USA

Benjamin Abbott: Sawteck Inc., USA
Ali Bagi-Wadji: Vienna University of Technology, Austria
Kushal Bhattacharjee: Clarisay, USA
Serguey Biryukov: Surfaces and Interfaces Department, Leibniz Institute for Solid State and Materials Research Dresden (IFW), Germany
Yasuo Cho: Research Institute of Electrical Communications, Tohoku University, Japan
Yasuo Ebata: Director of SAW Core Technology, Fujitsu Media Device Ltd., Japan
Ken-ya Hashimoto: Department of Electronic & Mechanical Engineering, Chiba University, Japan
Daniel Hauden: CNRS_LPMO, France
Mitsutaka Hikita: Communications Systems Research Department, Central Research Laboratory, Hitachi, Ltd., Japan
William D. Hunt: School of Electrical & Computer Engineering, Georgia Institure of Technology, USA
Shen Jen: RF Monolithics Inc., USA
John A. Kosinski: US Army RDE Command, USA
David Morgan: Impulse Consulting, UK
Mauricio Pereira da Cunha: Assistant Professor, Department of Electrical & Computer Engineering, University of Maine, USA
Viktor Plesski: SAW Design Bureau, Thomson Microsonics, Switzerland
Bob R. Potter: Vectron International, USA
Arne Ronnekleiv: Division of Physical Electronics, Norwegian Institute of Technology, Norway
Clemens C. W. Ruppel: EPCOS AG - SAW RD SAM, Germany
Peter Smith: McMaster University, Canada
Robert Weigel: University of Erlangen-Nuremberg, Germany

GROUP 5: Transducers and Transducer Materials
Vice Chair: Scott Smith, GE Corporate Research & Development, USA

Levent Degertekin: Woodruff School of Mechanical Engineering, Georgia Institute of Technology, USA
Jean-Francois Gelly: Thomson Microsonics, France
Hal Kunkel: Philips Ultrasound, USA
Reinhard Lerch: Friedrich-Alexander-Universitat Erlangen-Nurnberg Lehrstuhl fur Sensorik, Germany
Geoff Lockwood: Stirling Hall, Department of Physics, Queen's University, Canada
Clyde Oakley: Vice-president of Probe Development, Tetrad Corporation, USA
Mark E. Schafer: Sonic Tech Inc., USA
K. Kirk Shung: Bioengineering Department, Pennsylvania State University, USA
Stephen W. Smith: Department of Biomedical Engineering, Duke University, USA
Wallace A. Smith: Materials Division, Office of Naval Research, USA
Yasuhito Takeuchi: Professor, Department of Information & Computer Science, Faculty of Engineering, Kagoshima University, Japan
Roger H. Tancrell: Aimar Technology Corporation, USA
Vasandara Varadan: Pennsylvania State University, USA
Qiming Zhang: Materials Research Lab, Pennsylvania State University, USA
Yongrae Roh: Kyungpook National University, Korea
Thomas Shrout: Materials Research Lab, Pennsylvania State University, USA
Christopher Daft: Sensant Corporation, USA


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EXTERNAL LINKS IEEE UFFC Society UFFC Officers Other UFFC Meetings Past Proceedings UFFC Transactions Join UFFC Join IEEE	TECHNICAL PROGRAM COMMITTEE GROUP 1: Medical Ultrasonics Vice Chair: Stanislav Emelianov: Univeristy of Texas of Austin, USA Olivier Basset: INSA, France Geneviève Berger: Laboratorie Imagerie Parametrique, France Richard Chiao: Ultrasound Group, Siemens Medical Solutions, USA Lawrence A. Crum: University of Washington, USA Emad Ebbini: University of Minnesota, USA Helmut Emert: Electrical Engineering Department, Ruhr University, Germany David Evans: Department of Medical Physics, Leicester Royal Infirmary, UK Kathy Ferrara: Biomedical Engineering, University of California, USA Stuart Foster: Department of Medical Physics, Sunnybrook Health Sciences Centre, Canada James Greenleaf: Ultrasound Research, Mayo Clinic, USA John Hossack, Department of Biomedical Engineering, School of Engineering & Applied Sciences, University of Virginia, USA Kullervo Hynynen: Brigham and Women's Hospital, USA Peter Hoskins: Senior Research Fellow, Medical Physics, The University of Edinburgh, Scotland Michael F. Insana: Biomedical Engineering, University of California, USA Jorgen Jensen: Department of Information Technology, Technical University of Denmark Nico de Jong: Biomedical Engineering, Erasmus University Rotterdam, The Netherlands Hiroshi Kanai: Tohoku University, Japan Jian-yu Lu: The University of Toledo, USA Leonardo Masotti: Dipartimento di Ingegneria Elettronica, University di Firenze, Italy James G. Miller: Physics Department, Washington University, USA Kathy Nightingale: Biomedical Engineering Department, Duke University, USA William O'Brien: Director of Bioacoustics Research Lab, Department of Electrical & Computer Engineering, University of Illinois, USA Helen Routh: Philips Research, USA Ton van der Steen: Head of Biomedical Engineering, Erasmus University Rotterdam, The Netherlands Tom Thomas: Siemens Kai Thomenius: GE CRD, USA Peirro Tortoli: Electronic Engineering Department, University of Florence, Italy Keith Wear: FDA Center for Devices and Radiological Health, USA GROUP 2: Sensors, NDE, and Industrial Application Vice Chair: Jafar Saniie: Department of Electrical & Computer Engineering, Illinois Institute of Technology, USA Robert C. Addison: Rockwell Science Center, USA Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany Narendra K. Batra Eric S. Furgason: School of Electrical & Computer Engineering, Purdue University, USA Donna C. Hurley: National Institute of Standards & Technology, USA David A. Hutchins: School of Engineering, University of Warwick, England Bernhard Jakoby: Institute of Industrial Electronics and Material Science, Vienna University of Technology, Austria Lawrence W. Kessler: Sonoscan Inc., USA Pierre T. Khuri-Yakub: Stanford University, USA Jun-ishi Kushibike: Department of Electrical Engineering, Graduate School of Engineering, Tohoku University, Japan Lawrence C. Lynnworth: Chief Technologist, GE Panametrics, USA Roman Gr. Maev: Professor & Director, Center for Imaging Research & Advanced Material Characterization, Department of Physics, University of Windsor, Canada Massimo Pappalardo: Lab of Acustoelectronics, Dipartimento di Ingegneria Elettronica, University di Roma TRE, Italy Tony Sinclair: Professor of Mechanical & Industrial Engineering, Department of Mechanical Engineering, University of Toronto, Canada Bernhard R. Tittman: Department of Engineering & Mechanics, Pennsylvania State University, USA Jiromaru Tsujino: Faculty of Engineering, Kanagawa University, Japan Donald E. Yuhas: Industrial Measurement Systems, Inc., USA John F. Vetelino: Lab for Surface Science & Technology, University of Maine, USA GROUP 3: Physical Acoustics Vice Chair: Kenneth Lakin: TFR Technologies, Inc., USA Art Ballato: Chief Scientist, US Army CECOM RDEC AMSEL-RD-CS, USA Mack Brezaeale: Department of Physics, University of Mississippi, USA Jan Brown: JB Consulting, USA David Hecht Fred Hickernell Amit Lal: Assistant Professor, School of Electrical & Computer Engineering, Cornell University, USA John Larson Moises Levy: Department of Physics, Naples, Florida, USA George Mansfield: Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Russia Kiyoshi Nakamura: Department of Electrical & Communication Engineering, Graduate School of Engineering, Tohuku University, Japan Valeri Proklov: Institute of Radio Engineering & Electricity, Russia Edgar Schmidhammer Susan Schnieder: Department of Electrical & Computer Engineering, Marquette University, USA Bikash Sinha, Schlumberger-Doll Research, USA Yook-Kong Yong: Department of Civil & Environmental Engineering, Rutgers University, USA John Vig: US Army CECOM, AMSEL-RD-C2-PT, USA Smaine Zeroug: Program Manager, Schlumberger-Doll Research, USA GROUP 4: Surface Acoustic Waves Vice Chair: Don Malocha, School of Electrical Engineering & Computer Science, University of Central Florida, USA Benjamin Abbott: Sawteck Inc., USA Ali Bagi-Wadji: Vienna University of Technology, Austria Kushal Bhattacharjee: Clarisay, USA Serguey Biryukov: Surfaces and Interfaces Department, Leibniz Institute for Solid State and Materials Research Dresden (IFW), Germany Yasuo Cho: Research Institute of Electrical Communications, Tohoku University, Japan Yasuo Ebata: Director of SAW Core Technology, Fujitsu Media Device Ltd., Japan Ken-ya Hashimoto: Department of Electronic & Mechanical Engineering, Chiba University, Japan Daniel Hauden: CNRS_LPMO, France Mitsutaka Hikita: Communications Systems Research Department, Central Research Laboratory, Hitachi, Ltd., Japan William D. Hunt: School of Electrical & Computer Engineering, Georgia Institure of Technology, USA Shen Jen: RF Monolithics Inc., USA John A. Kosinski: US Army RDE Command, USA David Morgan: Impulse Consulting, UK Mauricio Pereira da Cunha: Assistant Professor, Department of Electrical & Computer Engineering, University of Maine, USA Viktor Plesski: SAW Design Bureau, Thomson Microsonics, Switzerland Bob R. Potter: Vectron International, USA Arne Ronnekleiv: Division of Physical Electronics, Norwegian Institute of Technology, Norway Clemens C. W. Ruppel: EPCOS AG - SAW RD SAM, Germany Peter Smith: McMaster University, Canada Robert Weigel: University of Erlangen-Nuremberg, Germany GROUP 5: Transducers and Transducer Materials Vice Chair: Scott Smith, GE Corporate Research & Development, USA Levent Degertekin: Woodruff School of Mechanical Engineering, Georgia Institute of Technology, USA Jean-Francois Gelly: Thomson Microsonics, France Hal Kunkel: Philips Ultrasound, USA Reinhard Lerch: Friedrich-Alexander-Universitat Erlangen-Nurnberg Lehrstuhl fur Sensorik, Germany Geoff Lockwood: Stirling Hall, Department of Physics, Queen's University, Canada Clyde Oakley: Vice-president of Probe Development, Tetrad Corporation, USA Mark E. Schafer: Sonic Tech Inc., USA K. Kirk Shung: Bioengineering Department, Pennsylvania State University, USA Stephen W. Smith: Department of Biomedical Engineering, Duke University, USA Wallace A. Smith: Materials Division, Office of Naval Research, USA Yasuhito Takeuchi: Professor, Department of Information & Computer Science, Faculty of Engineering, Kagoshima University, Japan Roger H. Tancrell: Aimar Technology Corporation, USA Vasandara Varadan: Pennsylvania State University, USA Qiming Zhang: Materials Research Lab, Pennsylvania State University, USA Yongrae Roh: Kyungpook National University, Korea Thomas Shrout: Materials Research Lab, Pennsylvania State University, USA Christopher Daft: Sensant Corporation, USA