Technical Program Committee
GROUP 1: Medical Ultrasonics
Vice Chair: Stanislav Emelianov: University of Texas at Austin, USA
- Olivier Basset: CREATIS, Université Lyon I, France
- Geneviève Berger: National Centre for Scientific Research (CNRS), France
- Charles Cain, University of Michigan, USA
- Richard Chiao: Ultrasound Group, Siemens Medical Solutions, USA
- Lawrence A. Crum: Applied Physics Laboratory, University of Washington, USA
- Jan D'hooge: Catholic University Leuven, Belgium
- Emad Ebbini: University of Minnesota, USA
- David Evans: Department of Cardiovascular Sciences, University of Leicester, UK
- Kathy Ferrara: University of California Davis, USA
- Stuart Foster: University of Toronto, Canada
- James Greenleaf: Mayo Clinic College of Medicine, USA
- Anne Hall: General Electric Medical Systems, USA
- Christopher Hall: Philips Research North America, USA
- Peter Hoskins: The University of Edinburgh, UK
- John Hossack, University of Virginia, USA
- Kullervo Hynynen: University of Toronto, Canada
- Michael F. Insana: University of Illinois, Urbana-Champaign, USA
- Jorgen Jensen: Technical University of Denmark, Denmark
- Nico de Jong: Erasmus Medical Centre and University of Twente, The Netherlands
- Hiroshi Kanai: Tohoku University, Japan
- Jian-yu Lu: University of Toledo, USA
- Leonardo Masotti: Università degli Studi di Firenze, Italy
- James G. Miller: Washington University in Saint Louis, USA
- Kathy Nightingale: Duke University, USA
- William O'Brien: University of Illinois, Urbana-Champaign, USA
- Helen Routh: Philips Research North America, USA
- Georg Schmitz: Ruhr-Universität Bochum, Germany
- Ralf Seip: Focus Surgery, Inc., USA
- Mickael Tanter: Laboratoire Ondes et Acoustique, ESPCI, France
- Tom Thomas: Ultrasound Division, Siemens Medical Solutions, USA
- Kai Thomenius: General Electric's Corporate R&D, USA
- Hans Torp: Norwegian University of Science and Technology, Norway
- Piero Tortoli: Università degli Studi di Firenze, Italy
- Ton van der Steen: Erasmus Medical Center, The Netherlands
- Keith Wear: US Food and Drug Administration, USA
GROUP 2: Sensors, NDE, and Industrial Application
Vice Chair: Jafar Saniie: Department of Electrical & Computer Engineering, Illinois Institute of Technology, USA
- Robert C. Addison: Rockwell Science Center, USA
- Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
- Nihat M. Bilgutay: Department of Electrical and Computer Engineering, Drexel University, USA
- Eric S. Furgason: School of Electrical & Computer Engineering, Purdue University, USA
- Jacqueline H. Hines, Applied Sensor Research and Development Corporation, USA
- Bernhard Jakoby: Institute of Industrial Electronics and Material Science, Vienna University of Technology, Austria
- Fabien J. Josse: Department of Electrical, Computer and Biomedical Engineering, Marquette University, USA
- Lawrence W. Kessler: Sonoscan Inc., USA
- Pierre T. Khuri-Yakub: Stanford University, USA
- Jun-ishi Kushibike: Department of Electrical Engineering, Graduate School of Engineering, Tohoku University, Japan
- Lawrence C. Lynnworth: Lynnworth Technical Services, USA
- Roman Gr. Maev: Professor & Director, Center for Imaging Research & Advanced Material Characterization, Department of Physics, University of Windsor, Canada
- Massimo Pappalardo: Lab of Acustoelectronics, Dipartimento di Ingegneria Elettronica, University di Roma TRE, Italy
- Tony Sinclair: Professor of Mechanical & Industrial Engineering, Department of Mechanical Engineering, University of Toronto, Canada
- Bernhard R. Tittman: Department of Engineering & Mechanics, Pennsylvania State University, USA
- Jiromaru Tsujino: Faculty of Engineering, Kanagawa University, Japan
- Donald E. Yuhas: Industrial Measurement Systems, Inc., USA
- John F. Vetelino: Lab for Surface Science & Technology, University of Maine, USA
GROUP 3: Physical Acoustics
Vice Chair: Kenneth Lakin: TFR Technologies, Inc., USA
- Art Ballato: Chief Scientist, US Army CECOM RDEC AMSEL-RD-CS, USA
- Mack Brezaeale: Department of Physics, University of Mississippi, USA
- Jan Brown: JB Consulting, USA
- David Hecht
- Fred Hickernell
- Yoonkee Kim: US Army CERDEC, AMSRD-CER-C2, USA
- Amit Lal: Assistant Professor, School of Electrical & Computer Engineering, Cornell University, USA
- John Larson
- Moises Levy: Department of Physics, Naples, Florida, USA
- George Mansfield: Institute of Radio Engineering and Electronics, Russian Academy of Sciences, Russia
- Kiyoshi Nakamura: Department of Electrical & Communication Engineering, Graduate School of Engineering, Tohoku University, Japan
- Valeri Proklov: Institute of Radio Engineering & Electricity, Russia
- Rich Ruby: Avagotech, USA
- Edgar Schmidhammer
- Susan Schneider: Department of Electrical & Computer Engineering, Marquette University, USA
- Bikash Sinha, Schlumberger-Doll Research, USA
- Yook-Kong Yong: Department of Civil & Environmental Engineering, Rutgers University, USA
- John Vig: US Army CECOM, AMSEL-RD-C2-PT, USA
- Ji Wang: Department of Engineering Mechanics and Materials Science, Ningbo University, China
GROUP 4: Surface Acoustic Waves
Vice-Chair: Peter M. Smith: McMaster University, Canada
- Benjamin Abbott: SAWTEK, USA
- Sylvain J. Ballandras: LPMO, France
- Kushal Bhattacharjee: RF Microdevices, USA
- Sergey Biryukov: Sergey Biryukov: IFW Dresden, Germany
- Mauricio Pereira da Cunha: University of Maine, USA
- Yasuo Ebata: Fujitsu, Japan
- Gernot Fattinger: Infineon Technologies, Germany
- Ken-ya Hashimoto: Chiba University, Japan
- Daniel Hauden: CNRS-LPMO, France
- Mitsutaka Hikita: Kogakuin University, Japan
- Chunyun Jian: Nortel Networks, Canada
- John Kosinski: US Army, USA.
- Donald Malocha: University of Central Florida, USA
- David Morgan: Impulse Consulting, UK
- Hiroyuki Odagawa: Tohoku University, Japan
- Victor Plessky: GVR Trade SA, Switzerland
- Bob Potter: Vectron International, USA
- Leonhard Reindl: University of Freiburg, Germany
- Arne Ronnekleiv: Norwegian Institute of Technology, Norway
- Clemens Ruppel: Epcos, Germany
- Takahiro Sato: Samsung, Japan
- Marc Solal: SAWTEK, USA
- Robert Weigel: University of Erlangen-Nuremberg, Germany
GROUP 5: Transducers and Transducer Materials
Vice Chair: Scott Smith: GE Global Research, USA
- Christopher Daft: Siemens Medical Systems, USA
- Levent Degertekin: Woodruff School of Mechanical Engineering, Georgia Institute of Technology, USA
- John Fraser: Philips Medical Systems, USA
- Jean-Francois Gelly: GE Healthcare, France
- Reinhard Lerch: Department of Sensor Technology, Friedrich-Alexander-University of Erlangen-Nuremberg, Germany
- Geoff Lockwood: Department of Physics, Queen's University, Canada
- Clyde Oakley: W.L. Gore, USA
- Yongrae Roh: Kyungpook National University, Korea
- Mark E. Schafer: Sonic Tech Inc., USA
- Thomas Shrout: Materials Research Lab, Pennsylvania State University, USA
- K. Kirk Shung: Bioengineering Department, University of Southern California, USA
- Stephen W. Smith: Department of Biomedical Engineering, Duke University, USA
- Wallace A. Smith: Materials Division, Office of Naval Research, USA
- Yasuhito Takeuchi: Department of Information & Computer Science, Faculty of Engineering, Kagoshima University, Japan
- Vasundara Varadan: Department of Electrical Engineering, University of Arkansas, USA
- Jian Yuan: Boston Scientific, USA
- Qiming Zhang: Materials Research Lab, Pennsylvania State University, USA