Technical Program Committee

Group 1: Medical Ultrasonics »
Group 2: Sensors, NDE, and Industrial Application »
Group 3: Physical Acoustics »
Group 4: Microacoustics - SAW, FBAR, MEMS »
Group 5: Transducers and Transducer Materials »

Group 1: Medical Ultrasonics

Vice Chair
Georg Schmitz
Ruhr–Universitaet
Bochum, Germany

Members

  1. Olivier Basset, CREATIS, France
  2. Ayache Bouakaz, INSERM, France
  3. Lori Bridal, University Pierre and Marie Curie, France
  4. Charles A. Cain, University of Michigan, US
  5. Jean-Yves Chapelon, INSERM, France
  6. Paul A. Dayton, University North Carolina/NCSU, Chapel Hill, US
  7. Nico de Jong, Erasmus Medical Centre, Rotterdam, The Netherlands
  8. Chris de Korte, Catholic University of Nijmegen, The Netherlands
  9. Jan Dhooge, Catholic University of Leuven, Belgium
  10. Emad Ebbini, University of Minnesota, US
  11. Stas Emelianov, University of Texas at Austin, US
  12. Kathy Ferrara, University of California Davis, US
  13. Stuart Foster, University of Toronto, Canada
  14. Steven Freear, University of Leeds, UK
  15. Caterina Gallipi, University of North Carolina, US
  16. James Greenleaf, Mayo Clinic, US
  17. Christopher Hall, Philips Research, US
  18. Peter Hoskins, University of Edinburgh, UK
  19. John Hossak, University of Virginia, US
  20. Kullervo Hynynen, University of Toronto, Canada
  21. Jorgen Arendt Jensen, Technical University Denmark, Denmark
  22. Hiroshi Kanai, Tohoku University, Japan
  23. Jeff Ketterling, Riverside Research, US
  24. Michael Kolios, Ryerson University, Canada
  25. Elisa Konofagou, Columbia University, US
  26. Nobuki Kudo, Hokkaido University, Japan
  27. Pai Chi Li, National Taiwan University, Taiwan
  28. Jian-yu Lu, University of Toledo, US
  29. Tom Matula, University of Washington, US
  30. James G. Miller, Washington University, US
  31. Kathy Nightingale, Duke University, US
  32. Svetoslav Nikolov, BK Medical, Denmark
  33. William D. O'Brien, University of Illinois, US
  34. Michael Oelze, University of Illinois, US
  35. Georg Schmitz, Ruhr-Universitat Bochum, Germany
  36. Ralf Seip, Philips Research, US
  37. Mickael Tanter, INSERM, France
  38. Tom Thomas, Boston Scientific, US
  39. Kai Thomenius, GE Corporate R&D, US
  40. Hans Torp, University of Science and Technology, Norway
  41. Piero Tortoli, University Firenze, Italy
  42. Ton van der Steen, Erasmus Medical Centre, The Netherlands
  43. Kendall Waters, Silicon Valley Medical Instruments, US
  44. Keith Wear, Food and Drug Administration, US
  45. Wilko G. Wilkening, Siemens Medical Solutions, US
  46. Hairong Zheng, Shenzhen Institutes of Advanced Technology, China

Group 2: Sensors, NDE, and Industrial Application

Vice Chair
David Greve
Carnegie Mellon University
USA

Members

  1. Robert C. Addison, Rockwell Science Center, USA
  2. Walter Arnold, Fraunhofer Institute for NDT, Germany
  3. Michal Bezdek, Endress+Hauser Flowtec AG, Switzerland
  4. James Blackshire, Air Force Research Laboratory, USA
  5. Ramazan Demirli, Villanova University, USA
  6. James Friend, Monash University, Australia
  7. Eric S. Furgason, Purdue University, USA
  8. David Greve, Carnegie Mellon University, USA
  9. Edward Haeggstrom, University of Helsinki, Finland
  10. Jacqueline Hines, Applied Sensor R&D Corporation, USA
  11. Patrick Johnston, NASA Langley Research Center, USA
  12. Fabien J. Josse, Marquette University, USA
  13. Lawrence W. Kessler, Sonoscan Inc., USA
  14. Pierre T. Khuri-Yakub, Stanford University, USA
  15. Mario Kupnik, Brandenburg University of Technology, Germany
  16. Roman Maev, University of Windsor, Canada
  17. Kentaro Nakamura, Tokyo Institute of Technology, Japan
  18. Erdal Oruklu, Illinois Institute of Technology, USA
  19. Massimo Pappalardo, University di Roma TRE, Italy
  20. Jafar Saniie, Illinois Institute of Technology, USA
  21. Gangbing Song, University of Houston, USA
  22. Bernhard Tittman, Pennsylvania State University, USA
  23. Jiromaru Tsujino, Kanagawa University, Japan
  24. John F. Vetelino, University of Maine, USA
  25. Paul Wilcox, University of Bristol, UK
  26. William Wright, University College Cork, Ireland
  27. Donald E. Yuhas, Industrial Measurement Systems, USA

Group 3: Physical Acoustics

Vice Chair
Vincent Laude
Centre National de la Recherche
Scientifique, France

Members

  1. Manabu Aoyagi, Muroran Institute of Technology, Japan
  2. Arthur Ballato, Clemson University, USA
  3. Anne Bernassau, University of Glasgow, UK
  4. Jan Brown, JB Consulting, USA
  5. Charles Courtney, University of Bath, UK
  6. Emmanuel Defay, CEA LETI Minatec Campus, France
  7. Jianke Du, Shanghai Jiaotong University, China
  8. Tao Han, Ningbo University, China
  9. Fred Hickernell, Motorolla, Inc., USA
  10. Takefumi Kanda, Okayama University, Japan
  11. Yoonkee Kim, U.S. Army, USA
  12. Eun Sok Kim, University of Southern California, USA
  13. Minoru K. Kurosawa, Tokyo Institute of Technology, Japan
  14. Amit Lal, Cornell University, USA
  15. John Larson, Avago Technologies, USA
  16. Vincent Laude, FEMTO-ST / CNRS, France
  17. Andreas Mayer, Hochschule Offenburg, Germany
  18. Roy H. Olsson III, Sandia National Laboratories, USA
  19. Mihir Patel, Schlumberger-Doll Research,, USA
  20. Yan Pennec, IEMN / Universite de Lille 1, France
  21. Susan Schneider, Marquette University, USA
  22. Bikash Sinha, Schlumberger-Doll Research,, USA
  23. Takahiko Yanagitani, Nagoya Institute of Technology, Japan
  24. Koen W.A. Van Dongen, Delft University of Technology, Netherlands
  25. Jorg Wallaschek, Leibniz Universitat Hannover, Germany
  26. Ji Wang, Ningbo University, China
  27. Tsung-Tsong Wu, National Taiwan University, Taiwan
  28. Yook-Kong Yong, Rutgers University, USA
  29. Jiun Der Yu, Epson Research & Development Inc., USA

Group 4: Microacoustics - SAW, FBAR, MEMS

Vice Chair
Karl Wagner
TDK Corporation
Munich, Germany

Members

  1. Ben Abbott, Triquint Semiconductor, USA
  2. Robert Aigner, Triquint Semiconductor, USA
  3. Ivan Avramov, Institute of Solid State Physics, Bulgaria
  4. Sylvain Ballandras, freq 'n' sys SAS, France
  5. Kushal Bhattacharjee, RF Micro Devices, USA
  6. Sunil Bhave, Cornell University, USA
  7. Sergey Biryukov, IFW Dresden, Germany
  8. Paul Bradley, Avago Technologies, USA
  9. Jidong Dai, Murata Electronics, Inc., USA
  10. Omar Elmazria, Universite de Lorraine, France
  11. Gernot Fattinger, Triquint Semiconductor, USA
  12. Gerhard Fischerauer, University of Bayreuth, Germany
  13. Ken-ya Hashimoto, Chiba University, Japan
  14. Shitang He, IACAS, China
  15. Chunyun Jian, Ericsson, Canada
  16. Michio Kadota, Tohoku University, Japan
  17. Jyrki Kaitila, Avago Technologies, Germany
  18. Ilia Katardjiev, Uppsala University, Sweden
  19. Takaharu Kawakatsu, Murata Manufacturing, Japan
  20. Kimmo Kokkonen, Aalto University, Finland
  21. Jan Kuypers, Sands 9, Inc., USA
  22. Don Malocha, University of Central Florida, USA
  23. Natalya Naumenko, Nat. University of Science & Techology MISIS, Russia
  24. Hiroyuki Odagawa, Kumamoto National College of Technology, Japan
  25. Takeo Oita, University of Tokyo, Japan
  26. Tuomas Pensala, VTT, Finland
  27. Mauricio Pereira da Cunha, University of Maine, USA
  28. Maximilian Pitschi, TDK Corporation, Germany
  29. Leonard Reindl, Albert-Ludwigs-University Freiburg, Germany
  30. Richard Ruby, Avago Technologies, USA
  31. Clemens Ruppel, TDK Corporation, Germany
  32. Marc Solal, Triquint Semiconductor, USA
  33. Masanori Ueda, Taiyo Yuden, Japan
  34. Karl Wagner, TDK Corporation, Germany
  35. Robert Weigel, University of Erlangen-Nuremberg, Germany
  36. Sergei Zhgoon, National Research University, Russia

Group 5: Transducers and Transducer Materials

Vice Chair
Sandy Cochran
University of Dundee
UK

Members

  1. Sandy Cochran, University of Dundee, UK
  2. David Cowell, University of Leeds, UK
  3. Christopher Daft, River Sonic Solutions, USA
  4. Loriann Davidsen, Philips Healthcare , USA
  5. Levent Degertekin, Georgia Institute of Technology, USA
  6. Christine Demore, University of Dundee, UK
  7. Charles Emery, Ulthera Inc., USA
  8. Arif Sanli Ergun, TOBB University, Turkey
  9. Lynn Ewart-Paine, NUWC, USA
  10. Xiaoning Jiang, North Carolina State University, USA
  11. Reinhard Lerch, Friedrich-Alexander-Universitat Erlangen-Nuremberg, Germany
  12. Richard O'Leary, University of Strathclyde, UK
  13. Omer Oralkan, North Carolina State University, USA
  14. Wei Ren, Xi'an Jiaotong University, China
  15. Paul Reynolds, Cliqr, USA
  16. Yongrae Roh, Kyungpook National University, Korea
  17. Ahmad Safari, Rutgers University, USA
  18. Jean-Francois Saillant, Areva, France
  19. Mark Schafer, Sonic Tech Inc., USA
  20. Scott Smith, GE Global Research, USA
  21. Wallace Smith, Office of Naval Research, USA
  22. Yasuhito Takeuchi, Kagoshima University, Japan
  23. Susan Trolier-McKinstry, Pennsylvania State University, USA
  24. Jian Yuan, Philips Shanghai Apex, USA
  25. Qiming Zhang, Pennsylvania State University, USA
  26. Shujun Zhang, Pennsylvania State University, USA
  27. Qifa Zhou, University of Southern California, USA