Conference Organizing Committee

General Chair

Pietro Siciliano IMM-CNR, ITALY

Vice Co-Chair

Boris Mizaikoff University of Ulm, GERMANY

Subhas C. Mukhopadhyay Massey University, NEW ZEALAND

Technical Program Chair

Paddy J. French Delft University of Technology, THE NETHERLANDS

Regional Program Chairs

America

Chang Liu University of Illinois, Urbana-Champaign, USA

Asia/Oceania

Ooi Kiang Tan Nanyang Technological University, SINGAPORE

Europe/Africa

Andreas Hierlemann ETH Zurich, SWITZERLAND

Special Sessions Chair

Carles Canè CNM-CSIC, SPAIN

Publicity Chair

John Vig Consultant, USA

Tutorial Chair

Piero Malcovati University of Pavia, ITALY

Local Organizing Committee Chair

Giovanni Breglio University of Napoli, ITALY

Treasurer

Chris Schober Honeywell, USA

Technical Program Committee

• Andersson, Helene .
  KTH Stockholm, SWEDEN
• Arnold, David
  University of Florida, USA
• Arregui, Francisco J.
  Universidad Pública de Navarra, SPAIN
• Atashbar, Massood Z
  Western Michigan University, USA
• Barsan, Nicolae
  University of Tuebingen, GERMANY
• Barsony, Istvan .
  Hungarian Academy of Sciences, HUNGARY
• Bossche, Andre .
  Delft University of Technology, THE NETHERLANDS
• Briand, Danick
  University of Neuchatel, SWITZERLAND
• Carlen, Edwin .
  University of Twente, THE NETHERLANDS
• Cernosek, Richard
  Sandia National Laboratories, USA
• Chang, Pei-Zen
  National Taiwan University, TAIWAN
• Chou, Jung-Chuan .
  National Chi Nan University, TAIWAN
• Chun, Kukjin
  Seoul National University, KOREA
• Cole, Marina .
  University of Warwick, UK
• Comini, Elisabetta Università di Brescia, ITALY
• Creemer, Frederik
  Delft University of Technology, THE NETHERLANDS
• Cunningham, Brian
  University of Illinois, Urbana-Champaign, USA
• Demirci, Utkan .
  Massachusetts Institute of Technology, USA
• Diem, Bernard .
  CEA-Grenoble, FRANCE
• Ding, Xiaoyi
  Conti Automotive, USA
• Eickhoff, Martin .
  Technical University, Munich, GERMANY
• Engel, Jonathan
  Corventis, Inc., USA
• Esashi, Masayoshi
  Tohoku University, JAPAN
• Fedder, Gary
  Carnegie Mellon University, USA
• Frolik, Jeff .
  University of Vermont, USA
• Gao, Zhiqiang
  Institute of Bioengineering and Nanotechnology, SINGAPORE
• Gao, Robert .
  University of Massachusetts, USA
• Gutierrez Osuna, Ricardo.
  Texas A&M University, USA
• Hauptmann, Peter .
  Otto von Guericke University Magdeburg, GERMANY
• Higurashi, Eiji .
  Tokyo University, JAPAN
• Hu, Qing
  Massachusetts Institute of Technology, USA
• Huang, Qing-An
  South East University, CHINA
• Hwang, Hak-In .
  Korea Electronic Technology Institute, KOREA
• Jakoby, Bernhard
  Johannes Kepler University Linz, AUSTRIA
• Jiang, Hongrui .
  University of Wisconsin, USA
• Jiang, Xiaoning .
  TRS Technologies Inc., USA
• Jung, Hyo-il
  Yonsei University, KOREA
• Kang, Shin-Won
  Kyungpook National University, KOREA
• Khuri-Yakub, Pierre .
  University of Stanford, USA
• Kim, Chang-Soo .
  Missouri University of Science & Technology, USA
• Kim, Taesong
  Korea Institute of Science and Technology (KIST), KOREA
• Kim, Youn Tae
  Electronics Telecommunication Research Institute, KOREA
• Konishi, Satoshi
  Ritsumeikan University, JAPAN
• Koster, Sander
  University of Groningen, THE NETHERLANDS
• Kraft, Martin
  Carinthian Tech Research AG, AUSTRIA
• Kwok, Chee Yee
  University of New South Wales, AUSTRALIA
• Lang, Walter
  University of Bremen, GERMANY
• Lange, Dirk .
  General Electric, USA
• Lee, Dong-Weon
  Chonnam National University, KOREA
• Lee, Jong-Hyun .
  Gwangju Institute of Science and Technology (GIST), KOREA
• Lee, Sukhan
  Sungkyunkwan University, KOREA
• Lee, Jeong-Bong
  University of Texas, Dallas, USA
• Lerch, Reinhard .
  University of Erlangen, GERMANY
• Lewis, Elfed
  University of Limerick, IRELAND
• Li, Zhihong .
  Peking University, CHINA
• Li, Xinxin
  Shanghai Institute of Microsytem and Information Technology, CHINA
• Li, Wen J.
  Chinese University of Hong Kong, HONG KONG
• Li, Xiaochun
  University of Wisconsin, USA
• Lin, Yu-Cheng
  National Cheng Kung University, TAIWAN
• Lin, Qiao
  Columbia University, USA
• Lloyd-Spetz, Anita
  Linköping University, SWEDEN
• Lucklum, Ralf
  Otto von Guericke University Magdeburg, GERMANY
• Maher, Mary Ann
  SoftMEMS, USA
• Makinwa, Kofi
  Delft University of Technology, THE NETHERLANDS
• Malcovati, Piero
  University of Pavia, ITALY
• Matsumoto, Yoshinori
  Keio University, JAPAN
• Meng, Ellis
  University of Southern California, USA
• Minh, Phan Ngoc
  Institute of Materials Science, VIETNAM
• Miyahara, Yuji
  National Institute for Material Science, JAPAN
• Mokwa, Wilfried
  RWTH Aachen, GERMANY
• Morgan, Brian
  U.S. Army Research Laboratory, USA
• Mukhopadhyay, Subhas C.
  Massey University, NEW ZEALAND
• Nakamoto, Takamichi
  Tokyo Institute of Technology, JAPAN
• Nishida, Toshi
  University of Florida, USA
• Park, Jae Y.
  Kwangwoon University, KOREA
• Paul, Oliver
  University of Freiburg - IMTEK, GERMANY
• Persaud, Krishna
  University of Manchester, UK
• Pickrell, Gary
  Virginia Tech., USA
• Pijolat, Christophe .
  CNRS URA, FRANCE
• Pistre, Jaques
  IXL Talence, FRANCE
• Puiu, Poenar Daniel
  Nanyang Technological University, SINGAPORE
• Rajanna, Konandur .
  Indian Institute of Science, INDIA
• Renaud, Philippe
  Ecole Polytechnique Federale de Lausanne (EPFL), SWITZERLAND
• Ricco, Antonio .
  Stanford University, USA
• Ripka, Pavel
  Czech Technical University, CZECH REPUBLIC
• Ruther, Patrick
  University of Freiburg - IMTEK, GERMANY
• Schmid, Ulrich
  University of Saarland, GERMANY
• Selvakumar, Arjun
  Colibrys, USA
• Shastry, Ashutosh .
  University of Washington, USA
• Shaikh, Kashan
  University of Illinois, Urbana-Champaign, USA
• Sonkusale, Sameer .
  University of Pennsylvania, USA
• Stemme, Göran
  Royal Institute of Technology (KTH), SWEDEN
• Su, Ming .
  University of Central Florida, USA
• Subramanian, Kanakasabapathi
  General Electric, USA
• Sun, Yu
  University of Toronto, CANADA
• Suzuki, Hiroaki
  University of Tsukuba, JAPAN
• Szuber, Jacek
  Silesian University of Technology, POLAND
• Tang, Zilong
  Tsinghua University, CHINA
• Tatic-Lucic, Svetlana
  Lehigh University, USA
• Tay, Francis
  National University of Singapore, SINGAPORE
• Tjin, Swee Chuan
  Nanyang Technological University, SINGAPORE
• Tsutsumi, Kazuhiko .
  Mitsubishi Electric, JAPAN
• Tuantranont, Adisorn
  National Electronics and Computer Technology Center, THAILAND
• Ueda, Toshitsugu
  Waseda University, JAPAN
• Van Hoof, Chris .
  IMEC, BELGIUM
• Vellekoop, Michiel
  Vienna University of Technology, AUSTRIA
• Wachutka, Gerhard
  Technical University of Munich, GERMANY
• Wang, Ping
  Zhejiang University, CHINA
• Wang, Yuelin
  Shanghai Institute of Microsytem and Information Technology, CHINA
• Wang, Li-Peng .
  Intel, USA
• Wang, Xuefeng .
  General Electric, USA
• Wang, Zheyao
  Tsinghua University, CHINA
• Wiczer, James
  Sensor Synergy, USA
• Wlodarski, Wojtek .
  RMIT University, AUSTRALIA
• Xu, Yong .
  Wayne State University, USA
• Yang, Sang Sik .
  Ajou University, KOREA
• Yang, E.-H
  Stevens Institute of Technology, USA
• Ye, Xiongying
  Tsinghua University, CHINA
• Yeow, John .
  University of Waterloo, CANADA
• Yobas, Levent
  Institute of Microelectronics, SINGAPORE
• Zou, Jun
  Texas A&M University, USA
• Zribi, Anis
  GE Global Research, USA

Sensors Council Officials

• President (2008-2009)
  Mona E. Zaghloul, George Washington University, USA
• President Elect (2010-2011)
  Christina M. Schober, Honeywell, Inc., USA
• Vice President - Finances (2008-2nd year of vacated term)
  Pamela J. Hurst, Westerly, RI, USA
• Vice President - Publications (2007-2008)
  Michael S. Shur, Rensselaer Polytechnic Institute, USA
• Vice President - Conferences (2008-2009)
  Andrei Shkel, University of California, Irvine, USA
• Vice President - Technical Operations (2007-2008)
  Vladimir Lumelsky, NASA-Goddard Space Flight Center, USA
• Secretary- Treasurer (2008-2009)
  Brian T. Cunningham, University of Illinois, Urbana-Champaign, USA
• IEEE Sensors Journal Editor-In-Chief
  H. Troy Nagle, University of North Carolina, USA
• Sensors Council Newsletter EIC
  M. Nurul Abedin, NASA Langley Research Center, USA

Past Presidents (Previous)

• Past-President (Immediate) (2006-2007)
  Robert T. Bannon, Bannon International Consulting LLC, USA
• Past President (2004-2005)
  Thomas Freud Wiener, Alexandria, VA, USA
• Past President (2002-2003)
  Franco Maloberti, University of Texas, Dallas, USA
• Founding President (2000-2001)
  John R. Vig, SPC Consultant, USA

AdCom Members-at-Large

• Member-at-Large (2007-2008)
  Bernard Jakoby, Johannes Kepler University Linz, AUSTRIA
• Member-at-Large (2007-2008)
  Lina Sarro, Technical University of Delft, THE NETHERLANDS
• Member-at-Large (2008-2009)
  Michiel J. Vellekoop, Vienna University of Technology, AUSTRIA
• Member-at-Large (2008-2009)
  Evgeny Katz, Clarkson University, USA
• Member-at-Large (2008-2009)
  Gert Cauwenberghs, University of California, San Diego, USA

Council Support Staff

• IEEE LEOS Publications Manager
  Linda C. Matarazzo
• Publications Coordinator
  Eileen Murray
• Administrative Assistant (P/T)
  Lisa Jess

Conference Chairs

• 2008 Conference Chair
  Pietro Siciliano, IMM-CNR, ITALY
• 2009 Conference Chair
  Subhas Mukhopadhyay, Massey University, NEW ZEALAND
• 2011 Conference Chair
  Elfed Lewis, University of Limerich, IRELAND

AdCom Members

• Aerospace and Electronic Systems
  Myron Greenbaum, ITT Avionics, USA
• Broadcast Technology
  Charles W. Einolf, Jr., USA
• Circuits and Systems
  Orly Yadid-Pecht, Ben-Gurion University, ISRAEL
• Communications
  Hussein Mouftah, University of Ottawa, CANADA
• Computer
  Murali Varanasi, University of North Texas, USA
• Components Packaging and Manufacturing Technology
  Erik Jung, FhG-IZM, GERMANY
• Dielectrics and Electrical Insulation
  Hulya Kirkici, Auburn University, USA
• Electromagnetic Compatibility
  Andrew Podgorski, ASR Technologies Inc., CANADA
• Electron Devices
  Brian T. Cunningham, University of Illinois, Urbana-Champaign, USA
• Engineering in Medicine and Biology
  Michael Mcshane, Institute for Micromanufacturing, USA
• Geoscience and Remote Sensing
  Jim Stiles, University of Kansas, USA
• Industrial Electronics
  Thilo Sauter, Research Unit for Integrated Sensor Systems, AUSTRIA
• Industry Applications
  Robert D. Lorenz, University of Wisconsin-Madison, USA
• Instrumentation and Measurement
  Kang Lee, National Institute of Standards and Technology, USA
• Lasers and Electro-Optics
  David Horsley, USA
• Magnetics Society
  Alan S. Edelstein, US Army, USA
• Microwave Theory and Techniques
  J. Stevenson Kenny, Georgia Tech University, USA
• Nuclear and Plasma Sciences
  Tony Lavietes, Lawrence Livermore Nuclear Laboratories, USA
• Oceanic Engineering
  James T. Barbera, Sr., IEEE OES, USA
• Power Engineering
  Arun G. Phadke, Virginia Technical University, USA
• Robotics and Automation
  Vladimir J. Lumelsky, NASA-Goddard Space Flight Center, USA
• Signal Processing
  Xiang-Gen Xia, University of Delaware, USA
• Solid State Circuits
  Darrin Young, Case Western Reserve University, USA
• Ultrasonics Ferroelectrics and Frequency Control
  John R. Vig, SPC Consultant, USA
• Vehicular Technology
  William Fleming, TRW Vehicle Safety Systems, USA