IEEE Orlando Section Monthly

Vol. 46, No. 08 - September 2013

IEEE Orlando Section Monthly - Vol. 46, No. 8 - September 2013

Section/Society Chapter/Affinity Group Events

Section News

Report/Newsletters

Employment Assistance

IEEE Conferences/Events

Other IEEE News/Events

IEEE Orlando Section Executive Committee Meeting

Date: Tuesday, September 3, 2013

Time: 6:30 - 7:00 pm - Social and Refreshments; 7:00 - 9:00 pm Executive Committee Meeting

Place: Orlando Business Development Center, District 2 (affiliated with the UCF and the S.B.A.) at 3218 East Colonial Drive, Suite #G, Orlando, FL 32802

Directions: In Herndon Plaza just east of Maguire Blvd. This is the shopping center across Colonial Drive from Fashion Square. It is on the west end of the building, around the building at the Southwest corner from the HH Gregg entrance.

Cost: Free to all IEEE members and Non-IEEE members

RSVP: mcorlovsky@ieee.org

Contact: Mike Orlovsky, mcorlovsky@ieee.org, tel. 410.979.0476 (Cell)

Website: www.ieee.org/orlando

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New Challenges in Electromagnetic Communication: Antenna Design, High-speed Data Transfer and Energy Harvesting

Host: IEEE MTT/AP Orlando Chapter

Speaker: Prof. Raj Mittra, Penn State University - Abstract and Biography

Date: Friday, September 27, 2013

Time: 10:00 - 11:00 AM

Place: University of Central Florida HCEC 101

Cost: Free to all IEEE members and Non-IEEE members

Contact: Kalyan Karnati, kalyan@knights.ucf.edu , tel. (407)569-6898

Website: www.ieee.org/orlando

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IEEE September Meeting with Sen Transformer

The Orlando IEEE PES/PELS/IAS chapter will be hosting a CEU approved event at OUC's Pershing facility. Dr. Sen is a distinguished IEEE PES lecturer, and an expert in the control of power flow. This is an event you don't want to miss. Click here - for all the details, also click here for the sub menu. Please make your sub orders to Dan Slack at: dslack@ouc.com

Website: www.ieee.org/orlando

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IEEE Orlando Section Executive Committee Meeting

Date: Tuesday, October 1, 2013

Time: 6:30 - 7:00 pm - Social and Refreshments; 7:00 - 9:00 pm Executive Committee Meeting

Place: Orlando Business Development Center, District 2 (affiliated with the UCF and the S.B.A.) at 3218 East Colonial Drive, Suite #G, Orlando, FL 32802

Directions: In Herndon Plaza just east of Maguire Blvd. This is the shopping center across Colonial Drive from Fashion Square. It is on the west end of the building, around the building at the Southwest corner from the HH Gregg entrance.

Cost: Free to all IEEE members and Non-IEEE members

RSVP: mcorlovsky@ieee.org

Contact: Mike Orlovsky, mcorlovsky@ieee.org, tel. 410.979.0476 (Cell)

Website: www.ieee.org/orlando

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CPMT Technical Meeting: 3D IC Packaging and 3D IC integration

Speaker: John Lau, an ASME and IEEE Fellow since 1994, will present a presentation and technical talk on 3D IC Packaging and 3D IC integration. John H. Lau has been an ITRI (Industrial Technology Research Institute) Fellow in Taiwan since January 2010. Prior to that, he was with HPL/Agilent in California, US for more than 25 years.

Abstract: 3D IC packaging and 3D IC integration are different. In general, the TSV (through-silicon via) separates 3D IC packaging from 3D IC integration because the latter use TSVs, but 3D IC packaging does not. TSV is the heart and most important key enabling technology of 3D IC integration. It provides the opportunity for the shortest chip-to-chip, and the smallest pad size and pitch of interconnects. The potential applications of 3D IC integration are: (1) memory-chip stacking, (2) wide I/O memory (or logic-on-logic), (3) wide I/O DRAM (or hybrid memory cube), and (4) wide I/O interface. In this presentation, the technology supply chains and the critical steps such as FEOL (front-end-of-line), MOL (middle-of-line), BEOL (back-end-of-line), TSV, MEOL (middle-end-of-line), assembly, and test and their ownerships for high-volume manufacturing for those 4 groups of 3D IC integration will be discussed. The 3D IC packaging, which has been keeping 3D IC integration away from volume production, will be briefly mentioned first.

Date: Tuesday, October 01, 2013

Time: 8:00 PM (Immediately after Section EXCOM Meeting)

Place: Orlando Business Development Center, District 2 (affiliated with the UCF and the S.B.A.) at 3218 East Colonial Drive, Suite #G, Orlando, FL 32802

Directions: In Herndon Plaza just east of Maguire Blvd. This is the shopping center across Colonial Drive from Fashion Square. It is on the west end of the building, around the building at the Southwest corner from the HH Gregg entrance.

Cost: Free to all IEEE members and Non-IEEE members

Contact: Scott Clary, scott.a.clary@lmco.com

Website: www.ieee.org/orlando

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AESS Technical Talk: Aircraft Avionics Equipage for FAA NextGen Flight Control System

Presenter: Ron T. Ogan, IEEE Senior Member IEEE Aerospace & Electronic Systems Society Board of Governors

Abstract: The Federal Aviation Administration (FAA) has authorized transformation of the United States Air Traffic Control System from a radar based technology to a system utilizing Global Positioning System (GPS) Technology over the time period 2013-2020 which will require all aircraft, commercial and general aviation, operating in controlled airspace to be in compliance on January 1, 2020. Current requirements for Automatic Dependent Surveillance – Broadcast (ADS-B) In are stated in AC 20-165, TSO-C154c and TSO-C166b. Aircraft transponders will be upgraded from Mode-C, radar based, to Mode-S, GPS based which will provide precise position, altitude, velocity, and flight direction. Aircraft equipped with ADS-B receivers and multi-function displays (referred to as “glass cockpit” equipment) will connect to ground stations to provide current weather and aircraft traffic graphically displayed for increased safety. The FAA Next Generation Air Transportation System is a transformative change in the management and operation of how we fly. NextGen enhances safety, reduces delays, saves fuel and reduces aviation’s adverse environmental impact.

Date: Thursday, October 3, 2013

Time: 6:30 - 7:00 pm - Social and Refreshments; 7:15 - 9:00 pm Presentation and Discussion

Place: Orlando Business Development Center, District 2 (affiliated with the UCF and the S.B.A.) at 3218 East Colonial Drive, Suite #G, Orlando, FL 32802

Directions: In Herndon Plaza just east of Maguire Blvd. This is the shopping center across Colonial Drive from Fashion Square. It is on the west end of the building, around the building at the Southwest corner from the HH Gregg entrance.

Cost: Free to all IEEE members and Non-IEEE members

RSVP: mcorlovsky@ieee.org

Contact: Mike Orlovsky, mcorlovsky@ieee.org, tel. 410.979.0476 (Cell)

Website: www.ieee.org/orlando

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Design, Analysis, and Applications of Waveguide-Fed Slot Arrays

Host: IEEE MTT/AP Orlando Chapter

Speaker: Prof. Sembiam Rengarajan, California State University, Northridge - Abstract and Biography

Date: Friday, October 4, 2013

Time: 5:00 - 6:00 PM

Place: University of Central Florida HCEC 101

Cost: Free to all IEEE members and Non-IEEE members

Contact: Kalyan Karnati, kalyan@knights.ucf.edu , tel. (407)569-6898

Website: www.ieee.org/orlando

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Senior Membership Elevation Drive

Date: Wednesday, October 16, 2013

Time: 5:30 - 7:00 pm

Place: Nova Southeastern University - Orlando Student Educational Center, Room 300, 4850 Millennia Blvd., Orlando, FL 32839

Are you an IEEE member with at least 10 years of professional practice and at least five years of significant performance, and haven't applied for Senior Member elevation? Come join us at the IEEE Orlando Section Senior Membership Drive to learn about the Senior Member benefits and to start the elevation process. Please bring your IEEE membership number as well as a copies of your CV so that we can help elevate you to senior member.

Contact: For more information, contact Joe Juisai at +1 415 260-1980 (Cell) or Joe.Juisai@IEEE.org

Website: www.ieee.org/orlando

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VOLUNTEERS NEEDED

The IEEE Senior Membership Elevation Drive seeks volunteers to assist with the senior membership elevation drive on Wednesday 16 October 2013. Those who are senior members or higher can assist with elevation recommendations, while those who are not can assist with logistics.

For more information, contact Joe Juisai at +1 415 260-1980 (Cell) or Joe.Juisai@IEEE.org

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IEEE Orlando Section 2013 Annual Awards Banquet

Speaker: Dr. Roger Smith, PhD, DM, MBA, MS (Cert: PMP, CMSP) Chief Technology Officer, Florida Hospital, Nicholson Center for Surgical Advancement Graduate Faculty Scholar, Modeling and Simulation Program, University of Central Florida Professor of Mathematics and Statistics, Adventist University of Health Sciences

Topic: Robotic Surgical System.

Date: Saturday, October 26th, 2013

Time: Starting at 6:00 pm with dinner being served at 7:00 p.m. with meeting and awards immediately after. Appetizers and beverages will be served from 6:00 p.m. till 7:00 p.m. A Cash bar will also be available.

Place: The venue will be the Renaissance Inn (the Normandie Suite) at 5445 Forbes Place (1/2 mile north of the airport, just off Hwy 436 or Semoran), Orlando, Florida, 32812. All participants will receive free parking.

Cost: The fees for attendance will be as follows:

If Purchased By 10/01/2013 After 10/01/2013
IEEE Member and Guest $25.00/person $35.00/person
IEEE Student Member and Guest $15.00/person $25.00/person
IEEE Life Member and Guest $15.00/person $25.00/person
Awards Winner and Guest Free Free
Student Scholarship Winner Free Free
Others $40.00/person $50.00/person

RSVP: Deadline for all reservations is C.O.B. October 21, 2013. Please confirm your intent to attend, along with your desired main course (Chicken, London Broil or vegetarian) to: stanbuchanan@IEEE.org or lynguthre@aol.com.

Menu: The menu will include Fresh Greens, starch, desert and vegetable and main course choice of Grilled Chicken or London Broil (vegetarian plates are available on request).

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MEMBER RECOGNITION: New Patent Granted to IEEE Orlando Section Member

Dr. Michael Hassan. IEEE Orlando Section PACE and Consultant Network Chair, was granted a new patent titled "Digital Communication Method and System" on Aug. 18, 2013.

The Orlando Section Monthly seeks member achievements: If an IEEE colleague received an award, promotion, appointment, or any other achievement, please inform The Orlando Section Monthly so it can run a notice in its monthly Member Recognition column. In addition to providing the member's name and membership number, please include a brief biography of the member's career and a description of the achievement. Send all notices to orlando@ieee.org

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STEAM Rocks! 6th Grade Event Dates

These 2 STEAM (science-technology-engineering-art-math) Rocks! 6th Grade event dates are official! Our target audience will be 6th graders involved in the Boys & Girls Clubs of Central Florida After School Zone.

Simply show up at the appointed time…you will be handed a T-shirt to pop on so that students may easily identify you as one of our “STEAM Rocks!” volunteers. We will be providing students with the hands on activities. All that you will need to bring is a willingness to help out, a positive attitude, and a smile!

Friday, October 4th, 4 PM to 6 PM
Robinswood Middle School
6305 Balboa Drive, Orlando, FL 32818
Contact on site: Jennifer Grow and Saceta Valentine

Friday, November 1st , 4 PM to 6 PM
Corner Lake Middle School
1700 Chuluota Road, Orlando, FL 32820
Contact on site: Shannon Kassim and Suzanne Lawe

Register at the link below: https://docs.google.com/spreadsheet/viewform?fromEmail=true&formkey=dDhuWmFnZmp3WXdTQXdMRG5zbF96Znc6MQ

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Part time STEM Program Assistant

A great opportunity for our IEEE members to powerfully give back to our community and if you wear your IEEE T-shirt while there, you will help us to better market IEEE around the Central Florida area!

Part time STEM Program Assistant for the Boys & Girls Clubs After School Zone :

https://www.bgccf.org/wp-content/uploads/2013/08/program-assistant-stem.pdf

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