CPMT NEWSLETTER for MARCH 2009

Full Newsletter (600 kB) INDEX to individual PDFs: - President's Column - Officers, Committee Chairs - Call for BOG Candidate Nominations - New Fellows and Senior Members - Student Branch News - Calls for Special Trans Sections:   - High-Speed I/O Channels   - Packaging for Micro/Nano-Scale Systems   - Wafer Level Packaging   - Solid-State Lighting Technologies - Conference Announcements:   - IEEE Semiconductor Wafer Test Workshop (SWTW 2009)   - CFP: Electronic Materials and Packaging Conference (EMAP 2009)   - Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009)   - IEEE NANO 2009   - Organic Microelectronics & Optoelectronics Workshop   - EMPC in Italy   - Int'l Conference on 3D System Integration (3D IC)   - Workshop on Accelerated Stress Testing & Reliability (ASTR)   - CFP: Electronics Packaging Technology Conference (EPTC 2009)   - Future Directions in IC and Package Design Workshop (FDIP)   - Electrical Performance of Electronic Packaging (EPEP 2009)

MARCH 2009 NEWSLETTER (continued) UPCOMING CONFERENCES: - May 25-29: 59th Electronic Components and Technology Conference (ECTC 2009), San Diego, CA USA - June 7-9: 2009 19th IEEE Semiconductor Wafer Test Workshop (SWTW 2009), San Diego, CA USA - June 15-18: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy - June 25-26: IEEE Int'l Workshop On Advances in Sensors and Interfaces (IWASI'09), Trani, Italy - July 6-9: 2009 5th Annual Organic Microelectronics and Optoelectronics Workshop, San Francisco CA, USA - August 10-13: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China - Sept. 14-16: 2009 IEEE Holm Conference on Electrical Contacts (Holm 2009), Vancouver, BC, Canada - Sept. 21-22: 2009 IEEE International Conference on Portable Information Devices (PORTABLE), Anchorage, AK, USA - Sept. 28–30: 2009 3rd International Conference on 3D System Integration (3DIC 2009), San Fancisco, CA, USA - Oct. 7–9: Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009), Leuven, Belgium - Oct. 7-9: IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (ASTR 2009), Jersey City, NJ, USA - Oct. 18: Future Directions in IC and Package Design Workshop (FDIP), Portland, OR USA - Oct. 19-21: IEEE Electrical Performance of Electronic Packaging (EPEP 2009), Portland, OR USA - Oct. 21-23: Int'l Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2009), Taipei, Taiwan CALLS FOR PAPERS: - Dec. 1-3: 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia (Due June 30) - Dec. 2-4: IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China (Due August 10) - Dec. 9-11: 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore (Due June 15) See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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