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CPMT NEWSLETTER for MARCH 2009

We invite you to download the full March CPMT Society NEWSLETTER, or any of the individual stories listed below. Circulate key articles and announcements to your co-workers.

Full Newsletter (600 kB)

INDEX to individual PDFs:
- President's Column
- Officers, Committee Chairs
- Call for BOG Candidate Nominations
- New Fellows and Senior Members
- Student Branch News
- Calls for Special Trans Sections:
  - High-Speed I/O Channels   - Packaging for Micro/Nano-Scale Systems   - Wafer Level Packaging   - Solid-State Lighting Technologies
- Conference Announcements:
  - IEEE Semiconductor Wafer Test Workshop (SWTW 2009)   - CFP: Electronic Materials and Packaging Conference (EMAP 2009)   - Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009)   - IEEE NANO 2009   - Organic Microelectronics & Optoelectronics Workshop   - EMPC in Italy   - Int'l Conference on 3D System Integration (3D IC)   - Workshop on Accelerated Stress Testing & Reliability (ASTR)   - CFP: Electronics Packaging Technology Conference (EPTC 2009)   - Future Directions in IC and Package Design Workshop (FDIP)   - Electrical Performance of Electronic Packaging (EPEP 2009)

MARCH 2009 NEWSLETTER (continued)

UPCOMING CONFERENCES:
- May 25-29: 59th Electronic Components and Technology Conference (ECTC 2009), San Diego, CA USA

- June 7-9: 2009 19th IEEE Semiconductor Wafer Test Workshop (SWTW 2009), San Diego, CA USA

- June 15-18: European Microelectronics and Packaging Conference & Exhibition (EMPC 2009), Rimini, Italy

- June 25-26: IEEE Int'l Workshop On Advances in Sensors and Interfaces (IWASI'09), Trani, Italy

- July 6-9: 2009 5th Annual Organic Microelectronics and Optoelectronics Workshop, San Francisco CA, USA

- August 10-13: Int'l Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China

- Sept. 14-16: 2009 IEEE Holm Conference on Electrical Contacts (Holm 2009), Vancouver, BC, Canada

- Sept. 21-22: 2009 IEEE International Conference on Portable Information Devices (PORTABLE), Anchorage, AK, USA

- Sept. 28–30: 2009 3rd International Conference on 3D System Integration (3DIC 2009), San Fancisco, CA, USA

- Oct. 7–9: Int‘l Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2009), Leuven, Belgium

- Oct. 7-9: IEEE/CPMT Workshop on Accelerated Stress Test and Reliability (ASTR 2009), Jersey City, NJ, USA

- Oct. 18: Future Directions in IC and Package Design Workshop (FDIP), Portland, OR USA

- Oct. 19-21: IEEE Electrical Performance of Electronic Packaging (EPEP 2009), Portland, OR USA

- Oct. 21-23: Int'l Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2009), Taipei, Taiwan

CALLS FOR PAPERS:
- Dec. 1-3: 11th Electronic Material and Packaging Conference (EMAP 2009), Penang, Malaysia (Due June 30)

- Dec. 2-4: IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2009), Hong Kong, China (Due August 10)

- Dec. 9-11: 11th Electronics Packaging Technology Conference (EPTC 2009), Singapore (Due June 15)

See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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