CPMT NEWSLETTER for SEPTEMBER 2010

Full Newsletter (1.2 MB) INDEX to individual PDFs: - President's Column: CPMT's Conferences - Officers, Committee Chairs - Society news: Elections - Region 8 Award: Jorma Kivilahti - Nominations Open for CPMT Society Awards - CPMT Journals: New Options in 2011 - CPMT Journals: Most-Downloaded Papers - Book Review: Portable Electronics - Conference Review: ICEPT-HDP 2010 in Xi'an - Conference Review: ESTC 2010 in Berlin - Conference Review: VLSI Pkg Symposium in Tokyo - Conference Review: Semiconductor Wafer Test in San Diego - Upcoming conferences/events: - 4th Int'l Conference on 3D System Integration (3DIC 2010) - 34th Int'l Electronics Manufacturing Technology Conference (IEMT) - Electrical Design of Advanced Package & Systems Symposium (EDAPS) - 12th Electronics Packaging Technology Conference (EPTC 2010) - 3rd Int'l Conference on Thermal Issues in Emerging Technologies, Theory and Applications (ThETA3) - 27th Int'l Semiconductor Thermal Modeling, Measurement and Management Symposium (SEMI-THERM)

SEPTEMBER 2010 NEWSLETTER (continued) UPCOMING CONFERENCES: - November 16-18: 4th International Conference on 3D System Integration (3DIC 2010), Munich, Germany - Nov. 30 - Dec. 2: 34th International Electronics Manufacturing Technology Conference (IEMT), Melaka, Malaysia - Dec. 7-9: Electrical Design of Advanced Package & Systems Symposium (EDAPS), Singapore - December 8-10: 12th Electronics Packaging Technology Conference (EPTC 2010), Singapore - December 8-10: 3rd Int'l Conference on Thermal Issues in Emerging Technologies, Theory and Applications (ThETA3), Cairo, Egypt - March 20-24: 27th Int'l Semiconductor Thermal Modeling, Measurement and Management Symposium (SEMI-THERM), San Jose, CA USA - October 12-14: Workshop on Accelerated Stress Testing & Reliability (ASTR), San Francisco, CA, USA CALLS FOR PAPERS: - October 12-14: Workshop on Accelerated Stress Testing & Reliability (ASTR), San Francisco, CA, USA (Due March 15) See the full Conference Calendar for opportunities to expand your technical knowledge and meet with peers.

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