Description

With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, ITC-Asia was initiated in Taipei in 2017, and the 2 nd ITC-Asia will be held in Harbin China in 2018 and co-located with China Test Conference. Attendee can involve themselves in not only the state-of-the-art test technology trend, but also numerous industry / hot topic forums organized by China Test Conference.

Call for paper

Important Dates

Draft paper submission deadline:2018-02-19

Draft paper acceptance notification:2018-03-31

Abstract submission deadline:2018-02-05

Final paper submission deadline:2018-05-11

Topics of submission

Topics of Interests include (but are not limited to) the following topics:
Special Promotion: Security/Trust, Validation/Debug, Safety and Test for Automotive ICs
 Hardware Oriented Security and Thrust
 Design Validation and Debug
 ATE Design
 Analog and Mixed-Signal Test
 RF Test
 High-Speed I/O Test
 Fault Modeling and Simulation
 ATPG (Automatic Test Pattern
Generation)
 Design for Testability
 Built-In Self-Test
 Delay Test
 System-on-Chip Test
 Test Compression
 Power-Aware and/or Thermal-Aware Test
 Memory Test, Diagnosis, and Repair
 Fault Diagnosis and Failure Analysis
 Yield Analysis and Learning
 Safety and Test for Automotive ICs
 Test for Internet of Things
 Test for Emerging Devices
 CPU/GPU Test
 MEMS/Sensor Test
 Online Test
 On-Chip Measurement
 SiP, 2.5D, and 3D IC Test
 Interconnect Test
 Board-Level Testing and Diagnosis
 Test Standards
 Test Economics
 Reliability Issues
 Fault Tolerance
 Test for Reconfigurable Systems
 Software Test and Reliability
 Dependable Systems and Networks

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Important dates

  • Conference Dates

    15 Aug.

    2018

    TO

    17 Aug.

    2018

  • 05 Feb.

    2018

    Abstract submission deadline

  • 19 Feb.

    2018

    Draft paper submission deadline

  • 31 Mar.

    2018

    Draft paper acceptance notification

  • 11 May.

    2018

    Final paper deadline

Contact information

  • Huawei Li
  • lihuawei@ict.ac.cn

Sponsored By

  • China Computer Federation
    Chinese Academy of Sciences - Institute of Computing Technology
    IEEE Computer Society
    IEEE Council on Electronic Design Automation

Conference Series