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Topics covered by the conference Over the past twenty-five years, the IEEE MEMS Conference series has been the flagship annual event of the MEMS community. The 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014) will report research and development results on every aspect of MEMS and Microsystems Technology, reflecting on the strong commitment and continuing success of the international MEMS community. In recent years, the IEEE MEMS Conference has created the forum for over 200 top-quality papers, selected from over 800 abstract submissions, in non-overlapping oral and poster sessions, and attracted more than 700 participants. Its single-session format provides ample opportunity for strong interaction between attendees, presenters and exhibitors. MEMS 2014 will be held in San Francisco, California, USA, from January 26 - 30, 2014. The major areas of activity in the MEMS research solicited and expected at this conference include but are not limited to: Design, simulation and analysis tools with experimental verification Fabrication technologies and processes Silicon and non-silicon materials Electro-mechanical integration techniques Assembly and packaging approaches Metrology and operational evaluation techniques System architecture Industrial research and development The major areas of activity in the application of MEMS solicited and expected at this conference include but are not limited to: Mechanical, thermal, and magnetic sensors, actuators, and systems Fluidic microcomponents and microsystems Microdevices for biomedical systems Micro chemical analysis systems Microdevices for inertial sensing Microdevices for wireless communication Microdevices for energy harvesting Optomechanical microdevices and microsystems Microdevices for data storage Nano-electro-mechanical devices and systems Scientific microinstruments

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